Shape of the auxiliary member

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CPC
H01L2224/02145

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02145Shape of the auxiliary member

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,995,277
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 11,855,015
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,824,027
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,720,213
- Issue date Aug 8, 2023
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Redistribution layer (RDL) structure, semiconductor device and manu...
- Patent number 11,605,605
- Issue date Mar 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,417,620
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,360,621
- Issue date Jun 14, 2022
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 10,990,233
- Issue date Apr 27, 2021
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stress relieving structure for semiconductor device
- Patent number 10,896,887
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Marius Aurel Bodea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,833,034
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of semiconductor devices encapsulated by a molding materi...
- Patent number 10,784,220
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 10,615,242
- Issue date Apr 7, 2020
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and method
- Patent number 10,026,707
- Issue date Jul 17, 2018
- Microchip Technology Incorportated
- George Chu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of forming same
- Patent number 9,966,346
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts having varying widths and method of manufacturi...
- Patent number 9,953,939
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package with redistribution layer
- Patent number 9,953,954
- Issue date Apr 24, 2018
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,922,928
- Issue date Mar 20, 2018
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming stress-reduced conductiv...
- Patent number 9,349,700
- Issue date May 24, 2016
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,922,007
- Issue date Dec 30, 2014
- Samsung Electronics Co., Ltd.
- YoungLyong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20240055379
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- HASEOB SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
- Publication number 20240014152
- Publication date Jan 11, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE PROFILE CONTROL
- Publication number 20230387050
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Chi HUANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230350524
- Publication date Nov 2, 2023
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230180556
- Publication date Jun 8, 2023
- SAMSUNG DISPLAY CO., LTD.
- BYOUNGYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backlight Unit and Display Device Including the Same
- Publication number 20230170342
- Publication date Jun 1, 2023
- LG Display Co., Ltd.
- ChangKyeong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED PARASITIC CAPACITANCE IN BONDED STRUCTURES
- Publication number 20230122531
- Publication date Apr 20, 2023
- Invensas LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230119548
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20230056623
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...
- Publication number 20220392869
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ENCAPSULATED BY MOLDING MATERIAL ATTACHED TO R...
- Publication number 20220367395
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE PROFILE CONTROL
- Publication number 20220344290
- Publication date Oct 27, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chen-Chi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20220308698
- Publication date Sep 29, 2022
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE
- Publication number 20220310574
- Publication date Sep 29, 2022
- LG ELECTRONICS INC.
- Taehoon KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220278088
- Publication date Sep 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20210240301
- Publication date Aug 5, 2021
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...
- Publication number 20210225787
- Publication date Jul 22, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210057366
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-CHENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210005562
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20200235192
- Publication date Jul 23, 2020
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20200035631
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-CHENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Relieving Structure for Semiconductor Device
- Publication number 20190348382
- Publication date Nov 14, 2019
- Marius Aurel Bodea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20180286824
- Publication date Oct 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20180269269
- Publication date Sep 20, 2018
- Kiwook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER
- Publication number 20170162540
- Publication date Jun 8, 2017
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...
- Publication number 20170069587
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Stress-Reduced Conductiv...
- Publication number 20140319695
- Publication date Oct 30, 2014
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPOSITE LAYER STRUCTURE AND SEMICONDUCTOR PACKAGING...
- Publication number 20140264855
- Publication date Sep 18, 2014
- Macronix International Co., Ltd.
- Ming-Tung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Shape of the auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method to minimize stress on stack via

Display apparatus

Interposer, method for fabricating the same, and semiconductor pack...

Solderless interconnection structure and method of forming same

Semiconductor device encapsulated by molding material attached to r...

Polyimide profile control

Semiconductor package

Display apparatus

Redistribution layer (RDL) structure, semiconductor device and manu...

Semiconductor device encapsulated by molding material attached to r...

Semiconductor apparatus

Display apparatus

Packaged semiconductor devices and methods of packaging thereof

Solderless interconnection structure and method of forming same

Display apparatus

Stress relieving structure for semiconductor device

Semiconductor package

Plurality of semiconductor devices encapsulated by a molding materi...

Display apparatus

Solderless interconnection structure and method of forming same

Wafer level package and method

Structures having a tapering curved profile and methods of making same

Bump structure and method of forming same

Conductive contacts having varying widths and method of manufacturi...

Wafer-level chip-scale package with redistribution layer

Semiconductor device and method of manufacturing semiconductor device

Method for aligning micro-electronic components

Semiconductor device and method of forming stress-reduced conductiv...

Semiconductor structure with low-melting-temperature conductive reg...

Semiconductor package

Patents Applicationslast 30 patents

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR

POLYIMIDE PROFILE CONTROL

DISPLAY APPARATUS

DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME

Backlight Unit and Display Device Including the Same

REDUCED PARASITIC CAPACITANCE IN BONDED STRUCTURES

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME

DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...

SEMICONDUCTOR DEVICE ENCAPSULATED BY MOLDING MATERIAL ATTACHED TO R...

POLYIMIDE PROFILE CONTROL

DISPLAY APPARATUS

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

DISPLAY APPARATUS

REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

DISPLAY APPARATUS

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Stress Relieving Structure for Semiconductor Device

PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE

DISPLAY APPARATUS

WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER

CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...

Semiconductor Device and Method of Forming Stress-Reduced Conductiv...

SEMICONDUCTOR COMPOSITE LAYER STRUCTURE AND SEMICONDUCTOR PACKAGING...