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H01L2225/1076

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1076Shape of the containers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package on package structure
- Patent number 12,046,588
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED light source and method of manufacturing the same
- Patent number 12,034,102
- Issue date Jul 9, 2024
- Nichia Corporation
- Munetsugu Ehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,990,454
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric substrate including a trench
- Patent number 11,961,796
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,682,660
- Issue date Jun 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Yuanhao Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package on package structure
- Patent number 11,257,797
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing integrated fan-out packages without seal rings
- Patent number 11,177,142
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printable 3D electronic structure
- Patent number 11,064,609
- Issue date Jul 13, 2021
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with package on package structure and electr...
- Patent number 11,037,890
- Issue date Jun 15, 2021
- Samsung Electronics Co., Ltd.
- Ki Cheol Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 10,867,973
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory (DRAM) mounts
- Patent number 10,861,839
- Issue date Dec 8, 2020
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,734,367
- Issue date Aug 4, 2020
- Sansumg Electronics Co., Ltd.
- Seung-Kwan Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,643,918
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Toru Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package structure
- Patent number 10,546,845
- Issue date Jan 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with package on package structure and electr...
- Patent number 10,529,676
- Issue date Jan 7, 2020
- Samsung Electronics Co., Ltd.
- Ki Cheol Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 10,529,697
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory (DRAM) mounts
- Patent number 10,411,001
- Issue date Sep 10, 2019
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a molding layer including a molding ca...
- Patent number 10,361,177
- Issue date Jul 23, 2019
- Samsung Electronics Co., Ltd.
- Yun-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with embedded semiconductor die and substrate-...
- Patent number 10,297,552
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making wiring substrate for stackable semiconductor asse...
- Patent number 10,211,067
- Issue date Feb 19, 2019
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic device having heat dissipation...
- Patent number 10,192,855
- Issue date Jan 29, 2019
- Samsung Electronics Co., Ltd.
- Sunkyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package arrangement and method
- Patent number 10,083,932
- Issue date Sep 25, 2018
- NVIDIA Corporation
- Ernesto A. Opiniano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies including electronic devices mounted on non-p...
- Patent number 10,026,719
- Issue date Jul 17, 2018
- Teledyne Reynolds, Inc.
- Colleen Louise Khalifa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with heat dissipation layers and pillars and...
- Patent number 9,991,245
- Issue date Jun 5, 2018
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and stacked microelectronic packages with package surface c...
- Patent number 9,960,149
- Issue date May 1, 2018
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with stacked microelectronic units and meth...
- Patent number 9,876,002
- Issue date Jan 23, 2018
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow underfill for package with interposer frame
- Patent number 9,831,207
- Issue date Nov 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die-down package-on-package device
- Patent number 9,812,422
- Issue date Nov 7, 2017
- Intel Corporation
- Toong Erh Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly, semiconductor package and forming m...
- Patent number 9,748,156
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing stacked semiconductor package
- Patent number 9,673,185
- Issue date Jun 6, 2017
- Samsung Electronics Co., Ltd.
- Young-ho Joung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240355795
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240266336
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20230386989
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178451
- Publication date Jun 8, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsin-Jou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20230068082
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20220122950
- Publication date Apr 21, 2022
- Advanced Semiconductor Engineering, Inc.
- Yuanhao YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Package Structure and Method of Forming the Same
- Publication number 20210098434
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH PACKAGE ON PACKAGE STRUCTURE AND ELECTR...
- Publication number 20200098708
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- Ki Cheol BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20200091122
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY (DRAM) MOUNTS
- Publication number 20200027867
- Publication date Jan 23, 2020
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-...
- Publication number 20190311991
- Publication date Oct 10, 2019
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190067258
- Publication date Feb 28, 2019
- Samsung Electronics Co., Ltd.
- Yun-Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES INCLUDING AN ELECTRONIC DEVICE MOUNTED ON A N...
- Publication number 20180366454
- Publication date Dec 20, 2018
- Teledyne Reynolds, Inc.
- Colleen Louise Khalifa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method of Forming the Same
- Publication number 20180350784
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180082988
- Publication date Mar 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH PACKAGE ON PACKAGE STRUCTURE AND ELECTR...
- Publication number 20170358544
- Publication date Dec 14, 2017
- Samsung Electronics Co., Ltd.
- Ki Cheol BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES
- Publication number 20170162549
- Publication date Jun 8, 2017
- Teledyne Reynolds, Inc.
- Colleen Louise Khalifa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160064305
- Publication date Mar 3, 2016
- Toyota Jidosha Kabushiki Kaisha
- Eisaku KAKIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160064304
- Publication date Mar 3, 2016
- Toyota Jidosha Kabushiki Kaisha
- Yuya TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE PACKAGE AND SEMICONDUCTO...
- Publication number 20160027710
- Publication date Jan 28, 2016
- GE Energy Power Conversion Technology Ltd.
- Fei XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...
- Publication number 20140361427
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...
- Publication number 20140353840
- Publication date Dec 4, 2014
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20140339708
- Publication date Nov 20, 2014
- Eon Soo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF WAFER LEVEL PACKAGE
- Publication number 20140315355
- Publication date Oct 23, 2014
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE
- Publication number 20140291866
- Publication date Oct 2, 2014
- Toong Erh Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...
- Publication number 20140212996
- Publication date Jul 31, 2014
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Device
- Publication number 20140175674
- Publication date Jun 26, 2014
- HUAWEI DEVICE CO., LTD.
- Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140117354
- Publication date May 1, 2014
- SK HYNIX INC.
- Chang-Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140104799
- Publication date Apr 17, 2014
- UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
- JENCHUN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Having a Guide Wall and Related Systems and...
- Publication number 20140084442
- Publication date Mar 27, 2014
- Jung-Do Lee
- H01 - BASIC ELECTRIC ELEMENTS

Shape of the containers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package on package structure

LED light source and method of manufacturing the same

Package structure and method of forming the same

Semiconductor package dielectric substrate including a trench

Semiconductor structure

Package on package structure

Method for dicing integrated fan-out packages without seal rings

Printable 3D electronic structure

Semiconductor assembly with package on package structure and electr...

Package structure and method of forming the same

Dynamic random access memory (DRAM) mounts

Semiconductor package and method of fabricating the same

Semiconductor device

Package on package structure

Semiconductor assembly with package on package structure and electr...

Package structure and method of forming the same

Dynamic random access memory (DRAM) mounts

Semiconductor package having a molding layer including a molding ca...

Semiconductor device with embedded semiconductor die and substrate-...

Methods of making wiring substrate for stackable semiconductor asse...

Semiconductor package and electronic device having heat dissipation...

Package on package arrangement and method

Electronic assemblies including electronic devices mounted on non-p...

Semiconductor packages with heat dissipation layers and pillars and...

Devices and stacked microelectronic packages with package surface c...

Microelectronic package with stacked microelectronic units and meth...

No-flow underfill for package with interposer frame

Embedded die-down package-on-package device

Semiconductor package assembly, semiconductor package and forming m...

Method of manufacturing stacked semiconductor package

Patents Applicationslast 30 patents

PACKAGE ON PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

SEMICONDUCTOR STRUCTURE AND ELECTRONIC DEVICE

Package Structure and Method of Forming the Same

SEMICONDUCTOR ASSEMBLY WITH PACKAGE ON PACKAGE STRUCTURE AND ELECTR...

PACKAGE ON PACKAGE STRUCTURE

DYNAMIC RANDOM ACCESS MEMORY (DRAM) MOUNTS

SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

ELECTRONIC ASSEMBLIES INCLUDING AN ELECTRONIC DEVICE MOUNTED ON A N...

Package Structure and Method of Forming the Same

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR ASSEMBLY WITH PACKAGE ON PACKAGE STRUCTURE AND ELECTR...

ELECTRONIC ASSEMBLIES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE PACKAGE AND SEMICONDUCTO...

FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...

STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...

SEMICONDUCTOR PACKAGE DEVICE

MANUFACTURING METHOD OF WAFER LEVEL PACKAGE

EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...

Package on Package Device

SEMICONDUCTOR PACKAGE

3D STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Packages Having a Guide Wall and Related Systems and...