Shape

Industry

CPC
H01L2224/82365

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82365Shape

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,742,310
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including solder bracing material with a rough...
- Patent number 11,018,106
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,629,537
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,290,584
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductive packaging device and manufacturing method thereof
- Patent number 10,020,275
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic packages having sidewall conductors and met...
- Patent number 9,299,670
- Issue date Mar 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,230,884
- Issue date Jan 5, 2016
- Olympus Corporation
- Yoshiaki Takemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for stacked semiconductor chips
- Patent number 9,087,883
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- SeokHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacked semiconductor chips
- Patent number 8,890,333
- Issue date Nov 18, 2014
- Samsung Electronics Co., Ltd.
- SeokHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using an anisotropically electroconductive adhesive havin...
- Patent number 5,120,665
- Issue date Jun 9, 1992
- Hitachi Chemical Company
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for circuit connection, method for connection using the...
- Patent number 5,001,542
- Issue date Mar 19, 1991
- Hitachi Chemical Company
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210257326
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180301431
- Publication date Oct 18, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...
- Publication number 20140264945
- Publication date Sep 18, 2014
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STACKED SEMICONDUCTOR CHIPS
- Publication number 20140008818
- Publication date Jan 9, 2014
- SeokHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20130256897
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered Integrated Circuit Apparatus
- Publication number 20120091595
- Publication date Apr 19, 2012
- MAO BANG ELECTRONIC CO., LTD.
- Sung Chuan MA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Semiconductor device including solder bracing material with a rough...

Conductive vias in semiconductor packages and methods of forming same

Conductive vias in semiconductor packages and methods of forming same

Semiconductive packaging device and manufacturing method thereof

Stacked microelectronic packages having sidewall conductors and met...

Semiconductor device

Method and apparatus for stacked semiconductor chips

Apparatus for stacked semiconductor chips

Method of using an anisotropically electroconductive adhesive havin...

Composition for circuit connection, method for connection using the...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...

METHOD AND APPARATUS FOR STACKED SEMICONDUCTOR CHIPS

SUBSTRATE AND SEMICONDUCTOR DEVICE

Layered Integrated Circuit Apparatus