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H01L2224/0311

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0311Shaping

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure with conductive feature and method of forming same
- Patent number 12,211,809
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 12,191,267
- Issue date Jan 7, 2025
- Adeia Semiconductor Technologies, LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,742,307
- Issue date Aug 29, 2023
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature superconducting striated tape combinations
- Patent number 11,711,983
- Issue date Jul 25, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of high-temperature superconducting striated tape combi...
- Patent number 11,600,762
- Issue date Mar 7, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component and manufacturing method thereof
- Patent number 11,424,204
- Issue date Aug 23, 2022
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 11,387,202
- Issue date Jul 12, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated stretchable electronics
- Patent number 11,375,895
- Issue date Jul 5, 2022
- The Regents of the University of California
- Sheng Xu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,264,344
- Issue date Mar 1, 2022
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structure and method for forming the same
- Patent number 11,011,486
- Issue date May 18, 2021
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die structure, die stack structure and method of fabricating the same
- Patent number 10,867,943
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 10,756,036
- Issue date Aug 25, 2020
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with carrier construction configuration a...
- Patent number 10,679,954
- Issue date Jun 9, 2020
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process
- Patent number 10,424,573
- Issue date Sep 24, 2019
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Beng Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 9,966,349
- Issue date May 8, 2018
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a connection between metallic moulded bodies an...
- Patent number 9,786,627
- Issue date Oct 10, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating chip package with laser
- Patent number 9,780,050
- Issue date Oct 3, 2017
- Xintec Inc.
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 9,666,573
- Issue date May 30, 2017
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,613,929
- Issue date Apr 4, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,318,421
- Issue date Apr 19, 2016
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead package and production method thereof
- Patent number 9,275,941
- Issue date Mar 1, 2016
- TIANSHUI HUATIAN TECHNOLOGY CO.
- Wenhui Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices utilizing contact pads with protrusions and meth...
- Patent number 9,257,335
- Issue date Feb 9, 2016
- Research Triangle Institute
- Erik Vick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects in wafers
- Patent number 9,224,649
- Issue date Dec 29, 2015
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects in wafers
- Patent number 8,796,828
- Issue date Aug 5, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pads defined by embedded traces
- Patent number 8,772,908
- Issue date Jul 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING CONDUCTIVE STRUCTURES BETWEEN TWO SUBSTRATES
- Publication number 20250022819
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- KiRak SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGES
- Publication number 20250015027
- Publication date Jan 9, 2025
- Apple Inc.
- Jiongxin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...
- Publication number 20240304575
- Publication date Sep 12, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- ZZU-CHI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION
- Publication number 20240153895
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-HakLay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD F...
- Publication number 20240088076
- Publication date Mar 14, 2024
- OLYMPUS CORPORATION
- Keiichi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230378140
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20230105341
- Publication date Apr 6, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230060720
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230061716
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME
- Publication number 20220208702
- Publication date Jun 30, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20220157753
- Publication date May 19, 2022
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220013481
- Publication date Jan 13, 2022
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20210233822
- Publication date Jul 29, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210134747
- Publication date May 6, 2021
- UNITED MICROELECTRONICS CORP.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20210050315
- Publication date Feb 18, 2021
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20200357761
- Publication date Nov 12, 2020
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20200279821
- Publication date Sep 3, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURE, DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20190385963
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20190319001
- Publication date Oct 17, 2019
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING PROCESS
- Publication number 20190304961
- Publication date Oct 3, 2019
- Delta Electronics Int'l (Singapore) Pte Ltd
- Beng Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...
- Publication number 20190184480
- Publication date Jun 20, 2019
- The Government of the United States of America, as represented by the Secreta...
- Raymond C.Y. Auyeung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...
- Publication number 20180374809
- Publication date Dec 27, 2018
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD F...
- Publication number 20180342473
- Publication date Nov 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180108629
- Publication date Apr 19, 2018
- RENESAS ELECTRONICS CORPORATION
- Kentaro YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE STRUCTURE
- Publication number 20170194275
- Publication date Jul 6, 2017
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20160322318
- Publication date Nov 3, 2016
- EV GROUP E. THALLNER GMBH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20160240499
- Publication date Aug 18, 2016
- RENESAS ELECTRONICS CORPORATION
- Kentaro YAMADA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure with conductive feature and method of forming same

Nanowire bonding interconnect for fine-pitch microelectronics

Method for permanent connection of two metal surfaces

Semiconductor package and method of fabricating the same

Semiconductor memory device structure

High-temperature superconducting striated tape combinations

Fabrication of high-temperature superconducting striated tape combi...

Semiconductor component and manufacturing method thereof

Nanowire bonding interconnect for fine-pitch microelectronics

Three-dimensional integrated stretchable electronics

Method for permanent connection of two metal surfaces

Semiconductor memory device structure

Bonded semiconductor structure and method for forming the same

Die structure, die stack structure and method of fabricating the same

Semiconductor memory device structure

Integrated circuit system with carrier construction configuration a...

Semiconductor method for forming semiconductor structure having bum...

Packaging process

Semiconductor structure having bump on tilting upper corner surface

Semiconductor memory device structure

Method for creating a connection between metallic moulded bodies an...

Method of fabricating chip package with laser

Methods of forming integrated circuitry

Power semiconductor chip with a metallic moulded body for contactin...

Power semiconductor chip with a metallic moulded body for contactin...

Quad flat no lead package and production method thereof

Electronic devices utilizing contact pads with protrusions and meth...

Compliant interconnects in wafers

Compliant interconnects in wafers

Conductive pads defined by embedded traces

Patents Applicationslast 30 patents

METHODS FOR FORMING CONDUCTIVE STRUCTURES BETWEEN TWO SUBSTRATES

BONDING STRUCTURES IN SEMICONDUCTOR PACKAGES

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION

SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD F...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor Devices and Methods of Manufacture

STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF

BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

DIE STRUCTURE, DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

PACKAGING PROCESS

Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...

VIA STRUCTURE, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD F...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE STRUCTURE

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

Semiconductor Device and Method of Manufacturing the Same