Shielding layers formed together with wiring layers

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H01L23/5225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5225Shielding layers formed together with wiring layers

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
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- Issue date Jul 1, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Ken Williamson
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Information Patent Grant
Shielded inductor structures and methods of forming the same
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- Issue date Jun 17, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Muhammed Shafi Kunnathodi
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- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
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Information Patent Grant
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- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
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Semiconductor device having shield patterns
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- Issue date Mar 11, 2025
- Micron Technology, Inc.
- Tetsuji Takahashi
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Information Patent Grant
Flexible electronic structure including a support element
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Semiconductor structure with shielding structure for through silico...
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- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with patterned ground shielding
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- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
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- Issue date Sep 17, 2024
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- Pandi Chelvam Marimuthu
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Information Patent Grant
Integrated circuit structure of capacitive device
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- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tai-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 12,074,125
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
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- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
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- Hajime Yamagishi
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Information Patent Grant
Three-dimensional device structure including seal ring connection c...
- Patent number 12,040,242
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- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
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- Hristo Angelov Hristov
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Information Patent Grant
Active under shielding for coils and transformers
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- Marcus Nuebling
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Information Patent Grant
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- Mamoru Nishizaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming semiconductor package transmission lines with mic...
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- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench insulation structure with enlarged electrically conductive s...
- Patent number 11,916,104
- Issue date Feb 27, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Ralf Lerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 11,901,391
- Issue date Feb 13, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takeyoshi Komoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,901,303
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS

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SEMICONDUCTOR DEVICE HAVING SHIELD PATTERNS
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STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
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SEMICONDUCTOR DEVICE
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MESHED TRANSMISSION LINE
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- Infineon Technologies Austria AG
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SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING
- Publication number 20240387363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
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Information Patent Application
INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE
- Publication number 20240363523
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TAI-YI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
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COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
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- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
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SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
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- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
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- Hao-Lin Yang
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CAPACITIVE ELEMENT AND SEMICONDUCTOR DEVICE
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- Mitsuhiro YOSHIMURA
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- William THIES
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- HAJIME YAMAGISHI
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THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...
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- Hristo Angelov HRISTOV
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SOLID-STATE IMAGING DEVICE
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- Publication date Aug 15, 2024
- Sony Semiconductor Solutions Corporation
- Kenji KOBAYASHI
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- Publication date Aug 8, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS

Shielding layers formed together with wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating a conductive layer on an IC using non-lithogr...

Shielded inductor structures and methods of forming the same

Infrared debond damage mitigation by copper fill pattern

3D chip sharing data bus

Flexible electronic structure

Solid-state imaging device

Semiconductor device and method for advanced thermal dissipation

Semiconductor device having shield patterns

Flexible electronic structure including a support element

Crosstalk cancelation structures having metal layers between signal...

Compact transistor utilizing shield structure arrangement

Method of forming semiconductor structure and semiconductor structure

Stacked IC structure with orthogonal interconnect layers

Imaging device

Semiconductor structure with shielding structure for through silico...

Semiconductor device with patterned ground shielding

Antenna in embedded wafer-level ball-grid array package

Integrated circuit structure of capacitive device

Coaxial through via with novel high isolation cross coupling method...

Semiconductor device structure and methods of forming the same

Solid-state imaging device and electronic apparatus to enhance imag...

Three-dimensional device structure including seal ring connection c...

Proximity sensor device and system

Active under shielding for coils and transformers

Semiconductor device having sense amplifier

Method of forming semiconductor package transmission lines with mic...

Trench insulation structure with enlarged electrically conductive s...

Imaging device

Integrated fan-out package

Conductive traces in semiconductor devices and methods of forming same

Patents Applicationslast 30 patents

ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...

IMAGE SENSOR

Semiconductor Device and Method for Advanced Thermal Dissipation

PHOTOELECTRIC CONVERSION APPARATUS

SEMICONDUCTOR DEVICE HAVING SHIELD PATTERNS

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

SEMICONDUCTOR DEVICE

MESHED TRANSMISSION LINE

MAGNETIC AND ELECTRIC STRUCTURES IN TECHNOLOGIES WITH THROUGH-SILIC...

INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERN...

Techniques For Providing Shielding Between Inductors Using Guard Rings

IMAGING DEVICE

SEMICONDUCTOR DEVICE

SIGNAL TRANSMISSION DEVICE

IMAGE SENSOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH HIGH VOLTAGE TERMINATION

SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING

INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD

CAPACITIVE ELEMENT AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...

SEMICONDUCTOR MEMORY

PROXIMITY SENSOR DEVICE AND SYSTEM

SOLID-STATE IMAGING DEVICE

3D CHIP SHARING DATA BUS