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Shielding layers formed together with wiring layers
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Shielding layers formed together with wiring layers
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Trench insulation structure with enlarged electrically conductive s...
Patent number
11,916,104
Issue date
Feb 27, 2024
X-FAB SEMICONDUCTOR FOUNDRIES GMBH
Ralf Lerner
H01 - BASIC ELECTRIC ELEMENTS
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Imaging device
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11,901,391
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Feb 13, 2024
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Takeyoshi Komoto
H01 - BASIC ELECTRIC ELEMENTS
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Integrated fan-out package
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11,901,303
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Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Yen Chiu
H01 - BASIC ELECTRIC ELEMENTS
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Conductive traces in semiconductor devices and methods of forming same
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11,894,299
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Feb 6, 2024
TAIWAN SEMICONDUCTOR LTD
Chao-Wen Shih
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Stacked IC structure with orthogonal interconnect layers
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11,881,454
Issue date
Jan 23, 2024
Adeia Semiconductor Inc.
Ilyas Mohammed
H01 - BASIC ELECTRIC ELEMENTS
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Integrated fan-out package
Patent number
11,854,993
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Yen Chiu
H01 - BASIC ELECTRIC ELEMENTS
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Integrated shield package and method
Patent number
11,848,275
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Dec 19, 2023
Amkor Technology Singapore Holding Pte Ltd.
Paul Mescher
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3D chip sharing data bus
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11,824,042
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Nov 21, 2023
Xcelsis Corporation
Javier A. DeLaCruz
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Electric field grading protection design surrounding a galvanic or...
Patent number
11,798,741
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Oct 24, 2023
Analog Devices International Unlimited Company
Sombel Diaham
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Semiconductor apparatus and equipment
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11,798,970
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Oct 24, 2023
Canon Kabushiki Kaisha
Kohichi Nakamura
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Manufacturing method of semiconductor memory device
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11,778,831
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Oct 3, 2023
SK hynix Inc.
Nam Jae Lee
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Semiconductor device and manufacturing method of semiconductor device
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11,742,305
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Aug 29, 2023
Lapis Semiconductor Co., Ltd.
Masanori Shindo
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Semiconductor arrangement in fan out packaging including magnetic s...
Patent number
11,728,291
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wen-Shiang Liao
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Integrated assemblies having conductive-shield-structures between l...
Patent number
11,728,263
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Aug 15, 2023
Micron Technology, Inc.
Naveen Kaushik
H01 - BASIC ELECTRIC ELEMENTS
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Stacked field-effect transistors with a shielded output
Patent number
11,721,621
Issue date
Aug 8, 2023
GLOBALFOUNDRIES U.S. Inc.
Shweta Vasant Khokale
H01 - BASIC ELECTRIC ELEMENTS
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EMI shielding for flip chip package with exposed die backside
Patent number
11,715,703
Issue date
Aug 1, 2023
STATS ChipPAC Pte. Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
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Tank circuit structure and method of making the same
Patent number
11,699,656
Issue date
Jul 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hsiao-Tsung Yen
H01 - BASIC ELECTRIC ELEMENTS
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Solid-state imaging device
Patent number
11,699,716
Issue date
Jul 11, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Kenji Kobayashi
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Semiconductor device and semiconductor module
Patent number
11,657,953
Issue date
May 23, 2023
Rohm Co., Ltd.
Kosei Osada
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Apparatuses including transistors, and related methods, memory devi...
Patent number
11,653,488
Issue date
May 16, 2023
Micron Technology, Inc.
Litao Yang
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Coaxial through via with novel high isolation cross coupling method...
Patent number
11,637,078
Issue date
Apr 25, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Feng Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Shielding using layers with staggered trenches
Patent number
11,626,366
Issue date
Apr 11, 2023
Silicon Laboratories Inc.
Thomas C. Fowler
H01 - BASIC ELECTRIC ELEMENTS
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Patterned shielding structure
Patent number
11,616,012
Issue date
Mar 28, 2023
Realtek Semiconductor Corporation
Hsiao-Tsung Yen
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Semiconductor device structure and methods of forming the same
Patent number
11,605,591
Issue date
Mar 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Wei Li
H01 - BASIC ELECTRIC ELEMENTS
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Comparison circuit including input sampling capacitor and image sen...
Patent number
11,581,255
Issue date
Feb 14, 2023
Samsung Electronics Co., Ltd.
Yunhwan Jung
H01 - BASIC ELECTRIC ELEMENTS
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High-voltage capacitor, system including the capacitor and method f...
Patent number
11,574,996
Issue date
Feb 7, 2023
STMicroelectronics S.r.l.
Davide Giuseppe Patti
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and metal-oxide-semiconductor capacitor structure
Patent number
11,557,535
Issue date
Jan 17, 2023
Realtek Semiconductor Corporation
Hsiao-Tsung Yen
H01 - BASIC ELECTRIC ELEMENTS
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System and method for reducing mutual coupling for noise reduction...
Patent number
11,488,904
Issue date
Nov 1, 2022
NXP B.V.
Ajay Kumar Sharma
H01 - BASIC ELECTRIC ELEMENTS
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Memory and fabrication method thereof
Patent number
11,482,488
Issue date
Oct 25, 2022
Semiconductor Manufacturing International (Shanghai) Corporation
Peng Huang
H01 - BASIC ELECTRIC ELEMENTS
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Electric field grading protection design surrounding a galvanic or...
Patent number
11,476,045
Issue date
Oct 18, 2022
Analog Devices International Unlimited Company
Sombel Diaham
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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SEMICONDUCTOR DEVICE INCLUDING DIFFERENT CONDUCTIVE LINES
Publication number
20240090202
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Jihoon CHANG
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE HAVING SHIELD PATTERNS
Publication number
20240038655
Publication date
Feb 1, 2024
Micron Technology, Inc.
Tetsuji Takahashi
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Device and Method for Advanced Thermal Dissipation
Publication number
20230402343
Publication date
Dec 14, 2023
STATS ChipPAC Pte Ltd.
SeungHyun Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING
Publication number
20230386997
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Yu Lu
H01 - BASIC ELECTRIC ELEMENTS
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ACTIVE UNDER SHIELDING FOR COILS AND TRANSFORMERS
Publication number
20230369204
Publication date
Nov 16, 2023
INFINEON TECHNOLOGIES AG
Marcus Nuebling
H01 - BASIC ELECTRIC ELEMENTS
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COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
Publication number
20230307390
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Feng Wei KUO
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Publication number
20230298805
Publication date
Sep 21, 2023
Rohm Co., Ltd.
Kosei OSADA
H01 - BASIC ELECTRIC ELEMENTS
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SOLID-STATE IMAGING DEVICE
Publication number
20230246055
Publication date
Aug 3, 2023
Sony Semiconductor Solutions Corporation
Kenji KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED CIRCUIT CHIP COUPLERS
Publication number
20230215808
Publication date
Jul 6, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jen-Yuan CHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20230207461
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Wei LI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SHIELDED SUPERCONDUCTING QUBIT WITH IMPROVED COHERENCE
Publication number
20230196163
Publication date
Jun 22, 2023
International Business Machines Corporation
Harry Jonathon Mamin
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
STACKED FIELD-EFFECT TRANSISTORS WITH A SHIELDED OUTPUT
Publication number
20230154844
Publication date
May 18, 2023
GLOBALFOUNDRIES U.S. Inc.
Shweta Vasant Khokale
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRIC FIELD GRADING PROTECTION DESIGN SURROUNDING A GALVANIC OR...
Publication number
20230083839
Publication date
Mar 16, 2023
Analog Devices International Unlimited Company
Sombel Diaham
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED ISOLATION CAPACITOR WITH ENHANCED BOTTOM PLATE
Publication number
20230056046
Publication date
Feb 23, 2023
TEXAS INSTRUMENTS INCORPORATED
Byron Lovell Williams
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
Publication number
20230043941
Publication date
Feb 9, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SHIELDING USING LAYERS WITH STAGGERED TRENCHES
Publication number
20220406708
Publication date
Dec 22, 2022
Silicon Laboratories Inc.
Thomas C. Fowler
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Integrated Assemblies having Voltage Sources Coupled to Shields and...
Publication number
20220384448
Publication date
Dec 1, 2022
Micron Technology, Inc.
Jiyun Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
Publication number
20220375886
Publication date
Nov 24, 2022
STATS ChipPAC Pte Ltd.
Pandi Chelvam Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
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IMAGING DEVICE
Publication number
20220367555
Publication date
Nov 17, 2022
Sony Semiconductor Solutions Corporation
Takeyoshi KOMOTO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20220367341
Publication date
Nov 17, 2022
CHANGXIN MEMORY TECHNOLOGIES, INC
TZUNG-HAN LEE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR APPARATUS AND EQUIPMENT
Publication number
20220359600
Publication date
Nov 10, 2022
Canon Kabushiki Kaisha
Kohichi Nakamura
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CROSSTALK CANCELATION STRUCTURES IN SEMICONDUCTOR PACKAGES
Publication number
20220319980
Publication date
Oct 6, 2022
Shahram Nikoukary
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20220319989
Publication date
Oct 6, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Wei LI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING
Publication number
20220310511
Publication date
Sep 29, 2022
Taiwan Semiconductor Manufacturing Company Limited
Hsiao-Tsung Yen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Trench insulation structure with enlarged electrically conductive s...
Publication number
20220293728
Publication date
Sep 15, 2022
X-FAB SEMICONDUCTOR FOUNDRIES GmbH
Ralf LERNER
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE
Publication number
20220285265
Publication date
Sep 8, 2022
Taiwan Semiconductor Manufacturing company Ltd.
TAI-YI CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Publication number
20220278160
Publication date
Sep 1, 2022
SONY GROUP CORPORATION
HAJIME YAMAGISHI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor Device And Manufacturing Method Therefor
Publication number
20220254717
Publication date
Aug 11, 2022
Huawei Technologies Co., Ltd
Dong CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
Publication number
20220246541
Publication date
Aug 4, 2022
STATS ChipPAC Pte Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF FABRICATING A CONDUCTIVE LAYER ON AN IC USING NON-LITHOGR...
Publication number
20220230979
Publication date
Jul 21, 2022
PRAGMATIC PRINTING LTD.
Ken WILLIAMSON
H01 - BASIC ELECTRIC ELEMENTS