Shielding layers formed together with wiring layers

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CPC
H01L23/5225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5225Shielding layers formed together with wiring layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with patterned ground shielding
- Patent number 12,148,694
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure of capacitive device
- Patent number 12,087,684
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tai-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 12,074,125
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,062,612
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus to enhance imag...
- Patent number 12,046,621
- Issue date Jul 23, 2024
- Sony Group Corporation
- Hajime Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including seal ring connection c...
- Patent number 12,040,242
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor device and system
- Patent number 12,018,963
- Issue date Jun 25, 2024
- Melexis Bulgaria Ltd
- Hristo Angelov Hristov
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Active under shielding for coils and transformers
- Patent number 12,014,981
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Marcus Nuebling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having sense amplifier
- Patent number 11,984,188
- Issue date May 14, 2024
- Micron Technology, Inc.
- Mamoru Nishizaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming semiconductor package transmission lines with mic...
- Patent number 11,978,712
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench insulation structure with enlarged electrically conductive s...
- Patent number 11,916,104
- Issue date Feb 27, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Ralf Lerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 11,901,391
- Issue date Feb 13, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takeyoshi Komoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,901,303
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked IC structure with orthogonal interconnect layers
- Patent number 11,881,454
- Issue date Jan 23, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,854,993
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated shield package and method
- Patent number 11,848,275
- Issue date Dec 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 11,824,042
- Issue date Nov 21, 2023
- Xcelsis Corporation
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric field grading protection design surrounding a galvanic or...
- Patent number 11,798,741
- Issue date Oct 24, 2023
- Analog Devices International Unlimited Company
- Sombel Diaham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and equipment
- Patent number 11,798,970
- Issue date Oct 24, 2023
- Canon Kabushiki Kaisha
- Kohichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor memory device
- Patent number 11,778,831
- Issue date Oct 3, 2023
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,742,305
- Issue date Aug 29, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement in fan out packaging including magnetic s...
- Patent number 11,728,291
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having conductive-shield-structures between l...
- Patent number 11,728,263
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Naveen Kaushik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked field-effect transistors with a shielded output
- Patent number 11,721,621
- Issue date Aug 8, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Shweta Vasant Khokale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,715,703
- Issue date Aug 1, 2023
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tank circuit structure and method of making the same
- Patent number 11,699,656
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 11,699,716
- Issue date Jul 11, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenji Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 11,657,953
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Kosei Osada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING
- Publication number 20240387363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE
- Publication number 20240363523
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TAI-YI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20240363560
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240363534
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD
- Publication number 20240347576
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20240332164
- Publication date Oct 3, 2024
- ABLIC Inc.
- Mitsuhiro YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240332162
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- William THIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240332335
- Publication date Oct 3, 2024
- SONY GROUP CORPORATION
- HAJIME YAMAGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...
- Publication number 20240321654
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20240324250
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Kosuke YANAGIDAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR DEVICE AND SYSTEM
- Publication number 20240295416
- Publication date Sep 5, 2024
- Melexis Bulgaria Ltd.
- Hristo Angelov HRISTOV
- B60 - VEHICLES IN GENERAL
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20240274642
- Publication date Aug 15, 2024
- Sony Semiconductor Solutions Corporation
- Kenji KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP SHARING DATA BUS
- Publication number 20240266325
- Publication date Aug 8, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICE
- Publication number 20240243073
- Publication date Jul 18, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20240234320
- Publication date Jul 11, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR ARRAY SUBSTRATE, MANUFACTURING METHOD, AND DIS...
- Publication number 20240222265
- Publication date Jul 4, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Xinghua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240204028
- Publication date Jun 20, 2024
- Sony Semiconductor Solutions Corporation
- Takeyoshi KOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHIELD PACKAGE AND METHOD
- Publication number 20240194615
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240147707
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Taegyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
- Publication number 20240136280
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIFFERENT CONDUCTIVE LINES
- Publication number 20240090202
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SHIELD PATTERNS
- Publication number 20240038655
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Tetsuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Advanced Thermal Dissipation
- Publication number 20230402343
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING
- Publication number 20230386997
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE UNDER SHIELDING FOR COILS AND TRANSFORMERS
- Publication number 20230369204
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Marcus Nuebling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20230307390
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230298805
- Publication date Sep 21, 2023
- Rohm Co., Ltd.
- Kosei OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20230246055
- Publication date Aug 3, 2023
- Sony Semiconductor Solutions Corporation
- Kenji KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED CIRCUIT CHIP COUPLERS
- Publication number 20230215808
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230207461
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS

Shielding layers formed together with wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with patterned ground shielding

Antenna in embedded wafer-level ball-grid array package

Integrated circuit structure of capacitive device

Coaxial through via with novel high isolation cross coupling method...

Semiconductor device structure and methods of forming the same

Solid-state imaging device and electronic apparatus to enhance imag...

Three-dimensional device structure including seal ring connection c...

Proximity sensor device and system

Active under shielding for coils and transformers

Semiconductor device having sense amplifier

Method of forming semiconductor package transmission lines with mic...

Trench insulation structure with enlarged electrically conductive s...

Imaging device

Integrated fan-out package

Conductive traces in semiconductor devices and methods of forming same

Stacked IC structure with orthogonal interconnect layers

Integrated fan-out package

Integrated shield package and method

3D chip sharing data bus

Electric field grading protection design surrounding a galvanic or...

Semiconductor apparatus and equipment

Manufacturing method of semiconductor memory device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor arrangement in fan out packaging including magnetic s...

Integrated assemblies having conductive-shield-structures between l...

Stacked field-effect transistors with a shielded output

EMI shielding for flip chip package with exposed die backside

Tank circuit structure and method of making the same

Solid-state imaging device

Semiconductor device and semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING

INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD

CAPACITIVE ELEMENT AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...

SEMICONDUCTOR MEMORY

PROXIMITY SENSOR DEVICE AND SYSTEM

SOLID-STATE IMAGING DEVICE

3D CHIP SHARING DATA BUS

RADIO FREQUENCY DEVICE

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

THIN FILM TRANSISTOR ARRAY SUBSTRATE, MANUFACTURING METHOD, AND DIS...

IMAGING DEVICE

INTEGRATED SHIELD PACKAGE AND METHOD

SEMICONDUCTOR MEMORY DEVICE

Conductive Traces in Semiconductor Devices and Methods of Forming Same

SEMICONDUCTOR DEVICE INCLUDING DIFFERENT CONDUCTIVE LINES

SEMICONDUCTOR DEVICE HAVING SHIELD PATTERNS

Semiconductor Device and Method for Advanced Thermal Dissipation

SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING

ACTIVE UNDER SHIELDING FOR COILS AND TRANSFORMERS

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SOLID-STATE IMAGING DEVICE

SEMICONDUCTOR PACKAGE WITH INTEGRATED CIRCUIT CHIP COUPLERS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME