Single-in-line [SIL] package

Industry

CPC
H05K2201/10696

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10696Single-in-line [SIL] package

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Methods for securing packaged semiconductor devices to carrier subs...
- Patent number 7,569,418
- Issue date Aug 4, 2009
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a vertically mountable IC package
- Patent number 7,494,920
- Issue date Feb 24, 2009
- Honeywell International Inc.
- Daniel McCarthy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device allowing for increased device densities
- Patent number 7,084,351
- Issue date Aug 1, 2006
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for modifying a vertical surface mount package
- Patent number 7,082,681
- Issue date Aug 1, 2006
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically mountable and alignable semiconductor device assembly
- Patent number 6,963,128
- Issue date Nov 8, 2005
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device allowing for increased device densities
- Patent number 6,914,198
- Issue date Jul 5, 2005
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device allowing for increased device densities
- Patent number 6,909,055
- Issue date Jun 21, 2005
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package alignment feature
- Patent number 6,858,453
- Issue date Feb 22, 2005
- Micron Technology, Inc.
- David J. Corisis
- G01 - MEASURING TESTING
Information Patent Grant
Video-apparatus-tuner mounting board
- Patent number 6,853,542
- Issue date Feb 8, 2005
- Alps Electric Co., Ltd.
- Michinori Sasaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package alignment feature
- Patent number 6,836,003
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- David J. Corisis
- G01 - MEASURING TESTING
Information Patent Grant
Vertical surface mount apparatus with thermal carrier and method
- Patent number 6,781,839
- Issue date Aug 24, 2004
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for assembling, modifying and manufacturing a vertical surf...
- Patent number 6,634,098
- Issue date Oct 21, 2003
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical surface mount apparatus with thermal carrier
- Patent number 6,577,503
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device allowing for increased device densities
- Patent number 6,535,393
- Issue date Mar 18, 2003
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically mountable semiconductor device, assembly, and methods
- Patent number 6,531,764
- Issue date Mar 11, 2003
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically mountable and alignable semiconductor device, assembly,...
- Patent number 6,512,290
- Issue date Jan 28, 2003
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical surface mount apparatus with thermal carrier
- Patent number 6,418,023
- Issue date Jul 9, 2002
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mountable semiconductor device, assembly, and methods
- Patent number 6,342,731
- Issue date Jan 29, 2002
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having heat sinks and method of fabrication
- Patent number 6,330,158
- Issue date Dec 11, 2001
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical surface mount apparatus with thermal carrier
- Patent number 6,330,159
- Issue date Dec 11, 2001
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for mounting a component upstanding on a carrier with s...
- Patent number 6,268,651
- Issue date Jul 31, 2001
- Telefonaktiebolaget LM Ericsson (publ)
- Eva Hellgren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically mountable and alignable semiconductor device, assembly,...
- Patent number 6,265,773
- Issue date Jul 24, 2001
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including lead frame with electrically i...
- Patent number 6,246,108
- Issue date Jun 12, 2001
- Micron Technology, Inc.
- David J. Corisis
- G01 - MEASURING TESTING
Information Patent Grant
Vertical surface mount apparatus with thermal carrier
- Patent number 6,134,111
- Issue date Oct 17, 2000
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical surface mount apparatus with thermal carrier
- Patent number 6,115,254
- Issue date Sep 5, 2000
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having interlocking heat sinks and method of...
- Patent number 6,075,288
- Issue date Jun 13, 2000
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die paddle heat sink with thermal posts
- Patent number 6,061,242
- Issue date May 9, 2000
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package alignment feature
- Patent number 6,048,744
- Issue date Apr 11, 2000
- Micron Technology, Inc.
- David J. Corisis
- G01 - MEASURING TESTING
Information Patent Grant
Method and an arrangement for mounting a component on a carrier
- Patent number 6,010,920
- Issue date Jan 4, 2000
- Telefonaktiebolaget LM Ericsson
- Eva Hellgren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package for surface mounting
- Patent number 5,861,669
- Issue date Jan 19, 1999
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME
- Publication number 20080266826
- Publication date Oct 30, 2008
- PREMIER IMAGE TECHNOLOGY(China) LTD.
- ZHEN HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating a vertically mountable IC package
- Publication number 20070090529
- Publication date Apr 26, 2007
- Honeywell International Inc.
- Daniel J. McCarthy
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical device allowing for increased device densities
- Publication number 20060201705
- Publication date Sep 14, 2006
- Micron Technology, Inc.
- Akram Salman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertically mountable and alignable semiconductor device packages an...
- Publication number 20060033190
- Publication date Feb 16, 2006
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for securing packaged semiconductor devices to carrier subs...
- Publication number 20060030072
- Publication date Feb 9, 2006
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Alignment devices for securing semiconductor devices to carrier sub...
- Publication number 20060001150
- Publication date Jan 5, 2006
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device packages including leads with substantially pl...
- Publication number 20060001155
- Publication date Jan 5, 2006
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertical surface mount apparatus with thermal carrier and method
- Publication number 20030198020
- Publication date Oct 23, 2003
- Larry D. Kinsman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for modifying a vertical surface mount package
- Publication number 20030196323
- Publication date Oct 23, 2003
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertically mountable and alignable semiconductor device assembly
- Publication number 20030111718
- Publication date Jun 19, 2003
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical device allowing for increased device densities
- Publication number 20030076665
- Publication date Apr 24, 2003
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Video-apparatus-tuner mounting board
- Publication number 20030063225
- Publication date Apr 3, 2003
- Alps Electric Co., Ltd.
- Michinori Sasaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Electrical device allowing for increased device densities
- Publication number 20030031000
- Publication date Feb 13, 2003
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical device allowing for increased device densities
- Publication number 20030007340
- Publication date Jan 9, 2003
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical surface mount apparatus with thermal carrier
- Publication number 20020176230
- Publication date Nov 28, 2002
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE ALLOWING FOR INCREASED DEVICE DENSITIES
- Publication number 20020054484
- Publication date May 9, 2002
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically mountable semiconductor device, assembly, and methods
- Publication number 20020008310
- Publication date Jan 24, 2002
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical surface mount apparatus with thermal carrier
- Publication number 20020003694
- Publication date Jan 10, 2002
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically mountable and alignable semiconductor device, assembly,...
- Publication number 20010026023
- Publication date Oct 4, 2001
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package alignment feature
- Publication number 20010011762
- Publication date Aug 9, 2001
- David J. Corisis
- G01 - MEASURING TESTING

Single-in-line [SIL] package

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for securing packaged semiconductor devices to carrier subs...

Method of fabricating a vertically mountable IC package

Electrical device allowing for increased device densities

Methods for modifying a vertical surface mount package

Vertically mountable and alignable semiconductor device assembly

Electrical device allowing for increased device densities

Electrical device allowing for increased device densities

Integrated circuit package alignment feature

Video-apparatus-tuner mounting board

Integrated circuit package alignment feature

Vertical surface mount apparatus with thermal carrier and method

Methods for assembling, modifying and manufacturing a vertical surf...

Vertical surface mount apparatus with thermal carrier

Electrical device allowing for increased device densities

Vertically mountable semiconductor device, assembly, and methods

Vertically mountable and alignable semiconductor device, assembly,...

Vertical surface mount apparatus with thermal carrier

Vertically mountable semiconductor device, assembly, and methods

Semiconductor package having heat sinks and method of fabrication

Vertical surface mount apparatus with thermal carrier

Arrangement for mounting a component upstanding on a carrier with s...

Vertically mountable and alignable semiconductor device, assembly,...

Integrated circuit package including lead frame with electrically i...

Vertical surface mount apparatus with thermal carrier

Vertical surface mount apparatus with thermal carrier

Semiconductor package having interlocking heat sinks and method of...

Die paddle heat sink with thermal posts

Integrated circuit package alignment feature

Method and an arrangement for mounting a component on a carrier

Semiconductor package for surface mounting

Patents Applicationslast 30 patents

ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME

Method of fabricating a vertically mountable IC package

Electrical device allowing for increased device densities

Vertically mountable and alignable semiconductor device packages an...

Methods for securing packaged semiconductor devices to carrier subs...

Alignment devices for securing semiconductor devices to carrier sub...

Semiconductor device packages including leads with substantially pl...

Vertical surface mount apparatus with thermal carrier and method

Methods for modifying a vertical surface mount package

Vertically mountable and alignable semiconductor device assembly

Electrical device allowing for increased device densities

Video-apparatus-tuner mounting board

Electrical device allowing for increased device densities

Electrical device allowing for increased device densities

Vertical surface mount apparatus with thermal carrier

ELECTRICAL DEVICE ALLOWING FOR INCREASED DEVICE DENSITIES

Vertically mountable semiconductor device, assembly, and methods

Vertical surface mount apparatus with thermal carrier

Vertically mountable and alignable semiconductor device, assembly,...

Integrated circuit package alignment feature