Claims
- 1. A method for manufacturing a vertical surface mount package, comprising:connecting a plurality of leads of the vertical surface mount package to a semiconductor device, each lead of said plurality of leads of the vertical surface mount package extending from said semiconductor device substantially parallel to every other lead of said plurality of leads of the vertical surface mount package, in substantially a same direction from said semiconductor device as every other lead of said plurality of leads, such that each lead of said plurality of leads extends from a single peripheral edge of said semiconductor device to be positioned adjacent to a bottom peripheral edge of the vertical surface mount package substantially parallel to a plane of said semiconductor device and non-parallel to a plane of a carrier upon orientation of the vertical surface mount package relative to the carrier; enclosing said semiconductor device within a cover including the bottom peripheral edge such that each of said plurality of leads extends from the bottom peripheral edge; and trimming said plurality of leads substantially parallel to the bottom peripheral edge to form a plurality of substantially non-deformed stub contacts.
- 2. The method of claim 1, wherein said trimming comprises cutting said plurality of leads so that said stub contacts extend less than about one millimeter past the bottom peripheral edge.
- 3. The method of claim 1, wherein said trimming comprises cutting said plurality of leads so that said stub contacts extend less than about one-half millimeter past the bottom peripheral edge.
- 4. The method of claim 1, wherein said trimming comprises cutting said plurality of leads so that said stub contacts extend about 10 mils or less past the bottom peripheral edge.
- 5. A method for assembling a vertical surface mount package, comprising:electrically connecting a plurality of leads of the vertical surface mount package to bond pads of a semiconductor device, each lead of said plurality of leads of the vertical surface mount package extending from said semiconductor device substantially parallel to every other lead of said plurality of leads, such that each lead of said plurality of leads extends out from a bottom peripheral edge of the vertical surface mount package, in substantially a same direction from said vertical mount package as every other lead of said plurality of leads, substantially parallel to a plane of said semiconductor device, and in a direction non-parallel to a plane of a carrier upon orientation of the vertical surface mount package relative to the carrier; encapsulating at least an active surface of said semiconductor device and a proximate region of said plurality of leads; and trimming said plurality of leads close to the bottom peripheral edge of the vertical surface mount package, and substantially parallel to the bottom peripheral edge to form a plurality of substantially non-deformed stub contacts.
- 6. The method of claim 5, wherein said trimming comprises cutting said plurality of leads so that said plurality of substantially non-deformed stub contacts extend less than about one millimeter past the bottom peripheral edge.
- 7. The method of claim 5, wherein said trimming comprises cutting said plurality of leads so that said plurality of substantially non-deformed stub contacts extend less than about one-half millimeter past the bottom peripheral edge.
- 8. The method of claim 5, wherein said trimming comprises cutting said plurality of leads so that said plurality of substantially non-deformed stub contacts extend about 10 mils or less past the bottom peripheral edge.
- 9. The method of claim 5, wherein said encapsulating comprises packaging the semiconductor device.
- 10. The method of claim 5, wherein said electrically connecting comprises wire bonding each of said plurality of leads to corresponding bond pads of the semiconductor device.
CROSS REFERENCE TO RELATED APPLICATION
This application is a divisional of application Ser. No. 09/002,160, filed Dec. 31, 1997, now U.S. Pat. No. 6,342,731, issued Jan. 29, 2002.
US Referenced Citations (40)
Foreign Referenced Citations (2)
Number |
Date |
Country |
2 104 827 |
Mar 1983 |
GB |
5-129481 |
May 1993 |
JP |