Single internal layer

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H01L2224/05073

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05073Single internal layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Basin-shaped underbump plates and methods of forming the same
- Patent number 12,362,299
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,354,980
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and display panel including electrically connected...
- Patent number 12,342,620
- Issue date Jun 24, 2025
- BOE Technology Group Co., Ltd.
- Xue Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device for improving internal quantum efficiency
- Patent number 12,334,485
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Jin Woo Choi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with redistribution plugs
- Patent number 12,315,793
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated indium bump stacks for cryogenic electronics
- Patent number 12,315,834
- Issue date May 27, 2025
- Microsoft Technology Licensing, LLC
- Christopher Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method thereof, and electronic term...
- Patent number 12,300,705
- Issue date May 13, 2025
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Zhuhui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel
- Patent number 12,289,921
- Issue date Apr 29, 2025
- Au Optronics Corporation
- I-Peng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,288,777
- Issue date Apr 29, 2025
- Japan Display Inc.
- Yoshinori Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
- Patent number 12,288,761
- Issue date Apr 29, 2025
- SK Hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,272,296
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display panel and display device
- Patent number 12,262,605
- Issue date Mar 25, 2025
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,255,161
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display apparatus
- Patent number 12,243,880
- Issue date Mar 4, 2025
- Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch
- Yingying Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,237,282
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 12,205,853
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,183,715
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 12,176,245
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,165,997
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,159,882
- Issue date Dec 3, 2024
- KYOCERA Coporation
- Hiroaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,588
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor element, and semiconductor el...
- Patent number 12,132,142
- Issue date Oct 29, 2024
- Kyocera Corporation
- Katsuaki Masaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
- Publication number 20250239500
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250239215
- Publication date Jul 24, 2025
- SAMSUNG DISPLAY CO., LTD.
- Hyun Joon KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250226371
- Publication date Jul 10, 2025
- Japan Display Inc.
- Yoshinori TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20250204185
- Publication date Jun 19, 2025
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250192100
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING INDUCTOR DEVICES
- Publication number 20250194255
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Jason GONZALEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174585
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER SEMICONDUCTOR DIE STACKS USING METAL-TO-METAL BONDING AN...
- Publication number 20250167146
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE
- Publication number 20250160219
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- G01 - MEASURING TESTING
Information Patent Application
Selective Dielectric Capping for Hybrid Bonding
- Publication number 20250149474
- Publication date May 8, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES
- Publication number 20250140718
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jose Arvin M. PLOMANTES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118714
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250118612
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Method Of Manufacturing The Same
- Publication number 20250105180
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...
- Publication number 20250096117
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Anshih TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
- Publication number 20250087611
- Publication date Mar 13, 2025
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20250087531
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sangjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20250079376
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...
- Publication number 20250079273
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...
- Publication number 20250070017
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS W...
- Publication number 20250038139
- Publication date Jan 30, 2025
- Impinj, Inc.
- James GUZZO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038141
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250029941
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- HYUNSU HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022821
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20250015026
- Publication date Jan 9, 2025
- Samsung Electronics Co., LTD
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Publication number 20250006671
- Publication date Jan 2, 2025
- Intel Corporation
- Marcel Arlan Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DISPLAY DEVICE
- Publication number 20240405031
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun Ki JEONG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS

Single internal layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Basin-shaped underbump plates and methods of forming the same

Electronic substrate and electronic device

Semiconductor package

Array substrate and display panel including electrically connected...

Display device for improving internal quantum efficiency

Semiconductor device with redistribution plugs

Electroplated indium bump stacks for cryogenic electronics

Display panel and manufacturing method thereof, and electronic term...

Display panel

Display device

Semiconductor device including re-distribution pads disposed at dif...

Display device

Display panel and display device

Semiconductor device with composite conductive features and method...

Display panel and display apparatus

Semiconductor device and method of forming the same

Semiconductor device with composite conductive features and method...

Semiconductor package and method of forming the same

Integrated circuit test method and structure thereof

Method for manufacturing semiconductor structure

Semiconductor chip structure

Semiconductor device and method of manufacturing the same

Transistor with integrated passive components

Display device

Semiconductor device assembly with die support structures

Semiconductor device and method of manufacturing the same

Integrated chip for standard logic performance improvement having a...

Method of manufacturing semiconductor element, and semiconductor el...

Packaged multi-chip semiconductor devices and methods of fabricatin...

Bonded assembly containing different size opposing bonding pads and...

Patents Applicationslast 30 patents

LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING

DISPLAY DEVICE

DISPLAY DEVICE

DISPLAY PANEL AND DISPLAY DEVICE

SYSTEM ON INTEGRATED CIRCUIT STRUCTURE

INTERPOSER INCLUDING INDUCTOR DEVICES

SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

MULTI-TIER SEMICONDUCTOR DIE STACKS USING METAL-TO-METAL BONDING AN...

PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE

Selective Dielectric Capping for Hybrid Bonding

DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor Device And Method Of Manufacturing The Same

INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...

INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...

SEMICONDUCTOR CHIP STRUCTURE

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...

ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS W...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

LIGHT EMITTING DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF