Sintering

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CPC
H05K2203/1131

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1131Sintering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for a printed wiring board
- Patent number 12,058,812
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Takuto Hidani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inks containing metal precursors nanoparticles
- Patent number 12,054,626
- Issue date Aug 6, 2024
- Singapore Asahi Chemical & Solder Ind. Pte. Ltd
- Michael Grouchko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base material for printed circuit board and method of manufacturing...
- Patent number 12,016,132
- Issue date Jun 18, 2024
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for controlling powder bed density for 3D printing
- Patent number 11,998,982
- Issue date Jun 4, 2024
- Desktop Metal, Inc.
- George Hudelson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Boron nitride nanotube coated substrates for sintering of metallic...
- Patent number 11,993,719
- Issue date May 28, 2024
- National Research Council of Canada
- Chantal Paquet
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Via bond attachment
- Patent number 11,950,378
- Issue date Apr 2, 2024
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fusing electronic components into three-dimensional objects via add...
- Patent number 11,911,825
- Issue date Feb 27, 2024
- Hewlett-Packard Development Company, L.P.
- Kristopher J. Erickson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper ink for high conductivity fine printing
- Patent number 11,891,532
- Issue date Feb 6, 2024
- Bhavana Deore
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 11,877,402
- Issue date Jan 16, 2024
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printable molecular ink
- Patent number 11,873,409
- Issue date Jan 16, 2024
- Xiangyang Liu
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,856,712
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates comprising a network comprising core shell liquid metal...
- Patent number 11,856,690
- Issue date Dec 26, 2023
- United States of America as represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of fabricating a beaded path on the surface of a substrate,...
- Patent number 11,856,709
- Issue date Dec 26, 2023
- AGNIESZKA MAGDZIARZ CADENAS
- Zbigniew Rozynek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 11,832,395
- Issue date Nov 28, 2023
- Landa Labs (2012) LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for transferring a conductive pattern to a substrate and...
- Patent number 11,792,942
- Issue date Oct 17, 2023
- Fondazione Istituto Italiano di Tecnologia
- Alessandro Chiolerio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Printable electrical component comprising a plastic substrate
- Patent number 11,759,555
- Issue date Sep 19, 2023
- Fresenius Medical Care Deutschland GmbH
- Dejan Nikolic
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for applying a pattern to a substrate
- Patent number 11,751,336
- Issue date Sep 5, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,647,581
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,641,712
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ink for screen printing
- Patent number 11,597,851
- Issue date Mar 7, 2023
- Daicel Corporation
- Tsugio Watanabe
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flexible membrane for applying a pattern to a substrate
- Patent number 11,570,902
- Issue date Jan 31, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying of a conductive pattern to a substrate
- Patent number 11,546,999
- Issue date Jan 3, 2023
- Lumet Technologies Ltd.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molecular inks
- Patent number 11,525,066
- Issue date Dec 13, 2022
- National Research Council of Canada
- Arnold J. Kell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER
- Publication number 20240414852
- Publication date Dec 12, 2024
- Seoul National University R&DB Foundation
- Seung Hwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...
- Publication number 20240381539
- Publication date Nov 14, 2024
- MAHLE International GmbH
- Matthias Tuerpe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS
- Publication number 20240276637
- Publication date Aug 15, 2024
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...
- Publication number 20240268018
- Publication date Aug 8, 2024
- Rohm Co., Ltd.
- Goro Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS
- Publication number 20240164016
- Publication date May 16, 2024
- Aviv Mordechai RONEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240023251
- Publication date Jan 18, 2024
- Unimicron Technology Corp.
- Shao-Chien LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-IMMERSIVE DRY SINTERING STRATEGY FOR REALIZING DECENT METAL BAS...
- Publication number 20230300980
- Publication date Sep 21, 2023
- The University of Hong Kong
- Chik Ho Choy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
- Publication number 20230292445
- Publication date Sep 14, 2023
- LANDA LABS (2012) LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PROCESS FOR PCB PRODUCTION BY LAD SYSTEM
- Publication number 20230240022
- Publication date Jul 27, 2023
- IO TECH GROUP LTD.
- Ralph S. Birnbaum
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INK FOR SCREEN PRINTING
- Publication number 20230174812
- Publication date Jun 8, 2023
- Daicel Corporation
- Tsugio WATANABE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Application of Electrical Conductors of a Solar Cell
- Publication number 20230129839
- Publication date Apr 27, 2023
- Lumet Technologies LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD...
- Publication number 20230120298
- Publication date Apr 20, 2023
- Heraeus Deutschland GmbH & Co. KG
- Alan Paul STADNIK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR APPLYING A PATTERN TO A SUBSTRATE
- Publication number 20230087822
- Publication date Mar 23, 2023
- Lumet Technologies LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20230056971
- Publication date Feb 23, 2023
- Material Concept, Inc.
- Junichi KOIKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Semiconductor Component and Embedde...
- Publication number 20230055435
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes STAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via Bond attachment
- Publication number 20230053225
- Publication date Feb 16, 2023
- Harbor Electronics, Inc.
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A PRINTED WIRING BOARD
- Publication number 20230039742
- Publication date Feb 9, 2023
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMED FILM AND A MANUFACTURING METHOD THEREOF
- Publication number 20230014968
- Publication date Jan 19, 2023
- Canatu Oy
- Ilkka VARJOS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Interconnection and Manufacturing Method
- Publication number 20220386464
- Publication date Dec 1, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengensellschaft
- Abderrazzaq IFIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT COMPOSITE NANOWIRE ELECTRODES
- Publication number 20220377887
- Publication date Nov 24, 2022
- Massachusetts Institute of Technology
- Jeffrey C. Grossman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTABLE ELECTRICAL COMPONENT COMPRISING A PLASTIC SUBSTRATE
- Publication number 20220369471
- Publication date Nov 17, 2022
- FRESENIUS MEDICAL CARE DEUTSCHLAND GMBH
- Dejan NIKOLIC
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING FLEXIBLE ELECTRONICS
- Publication number 20220007516
- Publication date Jan 6, 2022
- Singapore University of Technology and Design
- Shaoying Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATES COMPRISING A NETWORK COMPRISING CORE SHELL LIQUID METAL...
- Publication number 20210360782
- Publication date Nov 18, 2021
- Government of the United States, as represented by the Secretary of the Air F...
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
- Publication number 20210227698
- Publication date Jul 22, 2021
- LANDA LABS (2012) LTD.
- Benzion LANDA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR REPAIRING CONDUCTOR TRACKS
- Publication number 20210227700
- Publication date Jul 22, 2021
- Piotr KOWALCZEWSKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CONTAINING FABRICS AND MEMBRANES, AND METHOD OF MANUFACTURING...
- Publication number 20210144851
- Publication date May 13, 2021
- Imperial College of Science, Technology and Medicine
- Anthony CASS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Application of Electrical Conductors of a Solar Cell
- Publication number 20210136923
- Publication date May 6, 2021
- Lumet Technologies LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication
- Publication number 20210092854
- Publication date Mar 25, 2021
- Manaflex, LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing shielded printed wiring board and shielded...

Substrate for a printed wiring board

Inks containing metal precursors nanoparticles

Pressure sintering device and method for manufacturing an electroni...

Base material for printed circuit board and method of manufacturing...

System and method for controlling powder bed density for 3D printing

Boron nitride nanotube coated substrates for sintering of metallic...

Via bond attachment

Fusing electronic components into three-dimensional objects via add...

Copper ink for high conductivity fine printing

Application of electrical conductors of a solar cell

Printable molecular ink

Method of manufacturing multilayer substrate

Substrates comprising a network comprising core shell liquid metal...

Process of fabricating a beaded path on the surface of a substrate,...

Application of electrical conductors to an electrically insulating...

Apparatus for transferring a conductive pattern to a substrate and...

Process and device for low-temperature pressure sintering

Printable electrical component comprising a plastic substrate

Method for applying a pattern to a substrate

Ceramic electronic component

Method of fabricating a glass substrate with a plurality of vias

Ceramic electronic component

Process and device for low-temperature pressure sintering

Ink for screen printing

Flexible membrane for applying a pattern to a substrate

Apparatus for applying of a conductive pattern to a substrate

Molecular inks

Reel-to-reel lamination methods and devices in FPC fabrication

Application specific electronics packaging systems, methods and dev...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER

SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...

PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...

SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

NON-IMMERSIVE DRY SINTERING STRATEGY FOR REALIZING DECENT METAL BAS...

APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...

HYBRID PROCESS FOR PCB PRODUCTION BY LAD SYSTEM

INK FOR SCREEN PRINTING

Application of Electrical Conductors of a Solar Cell

ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD...

METHOD FOR APPLYING A PATTERN TO A SUBSTRATE

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Component Carrier With Embedded Semiconductor Component and Embedde...

Via Bond attachment

SUBSTRATE FOR A PRINTED WIRING BOARD

FORMED FILM AND A MANUFACTURING METHOD THEREOF

Component Carrier Interconnection and Manufacturing Method

TRANSPARENT COMPOSITE NANOWIRE ELECTRODES

PRINTABLE ELECTRICAL COMPONENT COMPRISING A PLASTIC SUBSTRATE

METHOD AND SYSTEM FOR FABRICATING FLEXIBLE ELECTRONICS

SUBSTRATES COMPRISING A NETWORK COMPRISING CORE SHELL LIQUID METAL...

APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...

METHOD FOR REPAIRING CONDUCTOR TRACKS

METAL-CONTAINING FABRICS AND MEMBRANES, AND METHOD OF MANUFACTURING...

Application of Electrical Conductors of a Solar Cell

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication