Soldering or alloying

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H01L2224/85801

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85801Soldering or alloying

Industries

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Patents Grantslast 30 patents

Information Patent Grant
SiC semiconductor device
- Patent number 12,125,882
- Issue date Oct 22, 2024
- Rohm Co., Ltd.
- Toshio Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell module including solar cells
- Patent number 11,652,178
- Issue date May 16, 2023
- Panasonic Holdings Corporation
- Haruhisa Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball, solder joint, and joining method
- Patent number 10,780,531
- Issue date Sep 22, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconducter device with filler to suppress generation of air bubb...
- Patent number 10,727,145
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Hiroyuki Harada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Signal routing in complex quantum systems
- Patent number 10,658,340
- Issue date May 19, 2020
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for connecting inter-layer conductors and components in 3D...
- Patent number 10,660,214
- Issue date May 19, 2020
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,483,446
- Issue date Nov 19, 2019
- Osram Opto Semiconductors GmbH
- Kok Eng Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with roughened encapsulated surface for promoting adhesion
- Patent number 10,453,771
- Issue date Oct 22, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with roughened encapsulated surface for promoting adhesion
- Patent number 10,410,949
- Issue date Sep 10, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for routing signals in complex quantum systems
- Patent number 10,347,605
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadframe package with stable extended leads
- Patent number 10,347,569
- Issue date Jul 9, 2019
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit arrangement and method of manufacturing the same
- Patent number 10,327,333
- Issue date Jun 18, 2019
- Koninklijke Philips N.V.
- Ronald Dekker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bendable and stretchable electronic devices and methods
- Patent number 10,204,855
- Issue date Feb 12, 2019
- Intel Corporation
- Alejandro Levander
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 10,172,240
- Issue date Jan 1, 2019
- Automated Assembly Corporation
- Robert Neuman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,978,671
- Issue date May 22, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a microelectronic chip element on a wire elem...
- Patent number 9,953,953
- Issue date Apr 24, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,953,961
- Issue date Apr 24, 2018
- Fuji Electric Co., Ltd.
- Takeshi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unpacked structure for power device of radio frequency power amplif...
- Patent number 9,941,242
- Issue date Apr 10, 2018
- INNOGRATION (SUZHOU) CO., LTD.
- Gordon Chiang Ma
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power module with the integration of control circuit
- Patent number 9,887,183
- Issue date Feb 6, 2018
- Delta Electronics, Inc.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with stable extended leads
- Patent number 9,847,281
- Issue date Dec 19, 2017
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,761,663
- Issue date Sep 12, 2017
- Fuji Electric Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method for manufacturing the same
- Patent number 9,728,484
- Issue date Aug 8, 2017
- Hyundai Mobis Co., Ltd.
- Jae Hyun Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20240304607
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240234475
- Publication date Jul 11, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
- Publication number 20240194630
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240136386
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS
- Publication number 20230098907
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- LongTing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC SEMICONDUCTOR DEVICE
- Publication number 20220181447
- Publication date Jun 9, 2022
- Rohm Co., Ltd.
- Toshio NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS
- Publication number 20190287946
- Publication date Sep 19, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS
- Publication number 20190164935
- Publication date May 30, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Producing Wire Bond Connection And Arrangement For Imple...
- Publication number 20180218996
- Publication date Aug 2, 2018
- F&K Delvotec Bondtechnik GmbH
- Franz Schlicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180211930
- Publication date Jul 26, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with roughened encapsulated surface for promoting adhesion
- Publication number 20180082921
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS
- Publication number 20180068932
- Publication date Mar 8, 2018
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170162468
- Publication date Jun 8, 2017
- HYUNDAI MOBIS Co., LTD.
- Jae Hyun KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNPACKED STRUCTURE FOR POWER DEVICE OF RADIO FREQUENCY POWER AMPLIF...
- Publication number 20170055341
- Publication date Feb 23, 2017
- Innogration (SuZhou) Co., Ltd.
- Gordon Chiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT
- Publication number 20170012030
- Publication date Jan 12, 2017
- DELTA ELECTRONICS,INC.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS
- Publication number 20170005028
- Publication date Jan 5, 2017
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module comprising fluid cooling channel and method of ma...
- Publication number 20160322333
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D...
- Publication number 20160324009
- Publication date Nov 3, 2016
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS
- Publication number 20160284630
- Publication date Sep 29, 2016
- Intel Corporation
- Alejandro Levander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
- Publication number 20160141275
- Publication date May 19, 2016
- LITTELFUSE, INC.
- Richard J. Bono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20160035691
- Publication date Feb 4, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Koji YAMAZAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SURFACE FINISH FOR WIREBONDING
- Publication number 20150380376
- Publication date Dec 31, 2015
- VARUGHESE MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE FOR BONDING APPLICATIONS
- Publication number 20150360316
- Publication date Dec 17, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen MILKE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENCAPSULATED LEAD FRAME CONTACT AREA AND...
- Publication number 20150348879
- Publication date Dec 3, 2015
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING AND OPERATING DIE-TO-DIE INDUCTIVE COMMUNI...
- Publication number 20150333805
- Publication date Nov 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- FRED T. BRAUCHLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STEP PORTION HAVING SHEAR SURFACES
- Publication number 20150325502
- Publication date Nov 12, 2015
- RENESAS ELECTRONICS CORPORATION
- Hideko ANDOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE, EVALUATION METHOD OF SE...
- Publication number 20150311285
- Publication date Oct 29, 2015
- Fuji Electric Co., Ltd.
- Seiji Momota
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES
- Publication number 20150303169
- Publication date Oct 22, 2015
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS

Soldering or alloying

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SiC semiconductor device

Chip package, method of forming a chip package and method of formin...

Solar cell module including solar cells

Method of forming an electrical contact and method of forming a chi...

Solder ball, solder joint, and joining method

Semiconducter device with filler to suppress generation of air bubb...

Signal routing in complex quantum systems

Methods for connecting inter-layer conductors and components in 3D...

Electronic device

Chip package and method of forming a chip package with a metal cont...

Package with roughened encapsulated surface for promoting adhesion

Package with roughened encapsulated surface for promoting adhesion

Method of manufacturing a semiconductor device

System and method for routing signals in complex quantum systems

Leadframe package with stable extended leads

Electronic circuit arrangement and method of manufacturing the same

Surface finish for wirebonding

Discrete flexible interconnects for modules of integrated circuits

Bendable and stretchable electronic devices and methods

Wire bonded electronic devices to round wire

Electronic module comprising fluid cooling channel and method of ma...

Semiconductor device, method of manufacturing a semiconductor devic...

Power semiconductor device

Method for assembling a microelectronic chip element on a wire elem...

Semiconductor device and method for manufacturing the same

Unpacked structure for power device of radio frequency power amplif...

Power module with the integration of control circuit

Leadframe package with stable extended leads

Semiconductor device

Power module package and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS

SiC SEMICONDUCTOR DEVICE

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS

SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Method For Producing Wire Bond Connection And Arrangement For Imple...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Package with roughened encapsulated surface for promoting adhesion

LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

UNPACKED STRUCTURE FOR POWER DEVICE OF RADIO FREQUENCY POWER AMPLIF...

POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT

LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS

Electronic module comprising fluid cooling channel and method of ma...

METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D...

BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS

SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

SURFACE FINISH FOR WIREBONDING

COATED WIRE FOR BONDING APPLICATIONS

SEMICONDUCTOR DEVICE WITH ENCAPSULATED LEAD FRAME CONTACT AREA AND...

METHODS OF MANUFACTURING AND OPERATING DIE-TO-DIE INDUCTIVE COMMUNI...

SEMICONDUCTOR DEVICE WITH STEP PORTION HAVING SHEAR SURFACES

FABRICATION METHOD OF SEMICONDUCTOR DEVICE, EVALUATION METHOD OF SE...

SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES