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H01L2224/85801
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/85801
Soldering or alloying
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Patents Grants
last 30 patents
Information
Patent Grant
SiC semiconductor device
Patent number
12,125,882
Issue date
Oct 22, 2024
Rohm Co., Ltd.
Toshio Nagata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package, method of forming a chip package and method of formin...
Patent number
12,033,972
Issue date
Jul 9, 2024
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solar cell module including solar cells
Patent number
11,652,178
Issue date
May 16, 2023
Panasonic Holdings Corporation
Haruhisa Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an electrical contact and method of forming a chi...
Patent number
10,978,418
Issue date
Apr 13, 2021
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder ball, solder joint, and joining method
Patent number
10,780,531
Issue date
Sep 22, 2020
Senju Metal Industry Co., Ltd.
Hiroyoshi Kawasaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconducter device with filler to suppress generation of air bubb...
Patent number
10,727,145
Issue date
Jul 28, 2020
Mitsubishi Electric Corporation
Hiroyuki Harada
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Signal routing in complex quantum systems
Patent number
10,658,340
Issue date
May 19, 2020
International Business Machines Corporation
Martin O. Sandberg
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Methods for connecting inter-layer conductors and components in 3D...
Patent number
10,660,214
Issue date
May 19, 2020
Board of Regents, The University of Texas System
Ryan B. Wicker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device
Patent number
10,483,446
Issue date
Nov 19, 2019
Osram Opto Semiconductors GmbH
Kok Eng Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method of forming a chip package with a metal cont...
Patent number
10,461,056
Issue date
Oct 29, 2019
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with roughened encapsulated surface for promoting adhesion
Patent number
10,453,771
Issue date
Oct 22, 2019
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with roughened encapsulated surface for promoting adhesion
Patent number
10,410,949
Issue date
Sep 10, 2019
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
10,403,616
Issue date
Sep 3, 2019
Fuji Electric Co., Ltd.
Kenichiro Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for routing signals in complex quantum systems
Patent number
10,347,605
Issue date
Jul 9, 2019
International Business Machines Corporation
Martin O. Sandberg
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Leadframe package with stable extended leads
Patent number
10,347,569
Issue date
Jul 9, 2019
STMicroelectronics, Inc.
Jefferson Talledo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic circuit arrangement and method of manufacturing the same
Patent number
10,327,333
Issue date
Jun 18, 2019
Koninklijke Philips N.V.
Ronald Dekker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface finish for wirebonding
Patent number
10,325,876
Issue date
Jun 18, 2019
NXP USA, INC.
Varughese Mathew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Discrete flexible interconnects for modules of integrated circuits
Patent number
10,297,572
Issue date
May 21, 2019
MC10, Inc.
Mitul Dalal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bendable and stretchable electronic devices and methods
Patent number
10,204,855
Issue date
Feb 12, 2019
Intel Corporation
Alejandro Levander
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonded electronic devices to round wire
Patent number
10,172,240
Issue date
Jan 1, 2019
Automated Assembly Corporation
Robert Neuman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
Patent number
10,037,972
Issue date
Jul 31, 2018
Infineon Technologies AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
Patent number
9,991,242
Issue date
Jun 5, 2018
Fuji Electric Co., Ltd.
Kenichiro Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device
Patent number
9,978,671
Issue date
May 22, 2018
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for assembling a microelectronic chip element on a wire elem...
Patent number
9,953,953
Issue date
Apr 24, 2018
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Jean Brun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
9,953,961
Issue date
Apr 24, 2018
Fuji Electric Co., Ltd.
Takeshi Yokoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Unpacked structure for power device of radio frequency power amplif...
Patent number
9,941,242
Issue date
Apr 10, 2018
INNOGRATION (SUZHOU) CO., LTD.
Gordon Chiang Ma
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Power module with the integration of control circuit
Patent number
9,887,183
Issue date
Feb 6, 2018
Delta Electronics, Inc.
Tao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe package with stable extended leads
Patent number
9,847,281
Issue date
Dec 19, 2017
STMicroelectronics, Inc.
Jefferson Talledo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
9,761,663
Issue date
Sep 12, 2017
Fuji Electric Co., Ltd.
Seiji Momota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module package and method for manufacturing the same
Patent number
9,728,484
Issue date
Aug 8, 2017
Hyundai Mobis Co., Ltd.
Jae Hyun Ko
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
Publication number
20240304607
Publication date
Sep 12, 2024
KIOXIA Corporation
Kazuma HASEGAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
Publication number
20240234475
Publication date
Jul 11, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
LI-CHUN HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
Publication number
20240194630
Publication date
Jun 13, 2024
Micron Technology, Inc.
See Hiong LEOW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
Publication number
20240136386
Publication date
Apr 25, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
LI-CHUN HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS
Publication number
20230098907
Publication date
Mar 30, 2023
TEXAS INSTRUMENTS INCORPORATED
LongTing LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SiC SEMICONDUCTOR DEVICE
Publication number
20220181447
Publication date
Jun 9, 2022
Rohm Co., Ltd.
Toshio NAGATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
Publication number
20210082861
Publication date
Mar 18, 2021
INFINEON TECHNOLOGIES AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS
Publication number
20190287946
Publication date
Sep 19, 2019
International Business Machines Corporation
Martin O. Sandberg
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS
Publication number
20190164935
Publication date
May 30, 2019
International Business Machines Corporation
Martin O. Sandberg
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20180254267
Publication date
Sep 6, 2018
Fuji Electric Co., Ltd.
Kenichiro SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method For Producing Wire Bond Connection And Arrangement For Imple...
Publication number
20180218996
Publication date
Aug 2, 2018
F&K Delvotec Bondtechnik GmbH
Franz Schlicht
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20180211930
Publication date
Jul 26, 2018
Toyota Jidosha Kabushiki Kaisha
Naoya TAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package with roughened encapsulated surface for promoting adhesion
Publication number
20180082921
Publication date
Mar 22, 2018
INFINEON TECHNOLOGIES AG
Andreas GRASSMANN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS
Publication number
20180068932
Publication date
Mar 8, 2018
STMICROELECTRONICS, INC.
Jefferson TALLEDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20170162468
Publication date
Jun 8, 2017
HYUNDAI MOBIS Co., LTD.
Jae Hyun KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNPACKED STRUCTURE FOR POWER DEVICE OF RADIO FREQUENCY POWER AMPLIF...
Publication number
20170055341
Publication date
Feb 23, 2017
Innogration (SuZhou) Co., Ltd.
Gordon Chiang Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT
Publication number
20170012030
Publication date
Jan 12, 2017
DELTA ELECTRONICS,INC.
Tao WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS
Publication number
20170005028
Publication date
Jan 5, 2017
STMICROELECTRONICS, INC.
Jefferson TALLEDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic module comprising fluid cooling channel and method of ma...
Publication number
20160322333
Publication date
Nov 3, 2016
INFINEON TECHNOLOGIES AG
Edward FUERGUT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D...
Publication number
20160324009
Publication date
Nov 3, 2016
Board of Regents, The University of Texas System
Ryan B. Wicker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS
Publication number
20160284630
Publication date
Sep 29, 2016
Intel Corporation
Alejandro Levander
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
Publication number
20160141275
Publication date
May 19, 2016
LITTELFUSE, INC.
Richard J. Bono
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
Publication number
20160035691
Publication date
Feb 4, 2016
MITSUBISHI ELECTRIC CORPORATION
Koji YAMAZAKI
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
SURFACE FINISH FOR WIREBONDING
Publication number
20150380376
Publication date
Dec 31, 2015
VARUGHESE MATHEW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COATED WIRE FOR BONDING APPLICATIONS
Publication number
20150360316
Publication date
Dec 17, 2015
Heraeus Deutschland GmbH & Co. KG
Eugen MILKE
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ENCAPSULATED LEAD FRAME CONTACT AREA AND...
Publication number
20150348879
Publication date
Dec 3, 2015
STMICROELECTRONICS, INC.
Jefferson TALLEDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MANUFACTURING AND OPERATING DIE-TO-DIE INDUCTIVE COMMUNI...
Publication number
20150333805
Publication date
Nov 19, 2015
FREESCALE SEMICONDUCTOR, INC.
FRED T. BRAUCHLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH STEP PORTION HAVING SHEAR SURFACES
Publication number
20150325502
Publication date
Nov 12, 2015
RENESAS ELECTRONICS CORPORATION
Hideko ANDOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE, EVALUATION METHOD OF SE...
Publication number
20150311285
Publication date
Oct 29, 2015
Fuji Electric Co., Ltd.
Seiji Momota
G01 - MEASURING TESTING
Information
Patent Application
SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES
Publication number
20150303169
Publication date
Oct 22, 2015
Tu-Anh N. Tran
H01 - BASIC ELECTRIC ELEMENTS