Soldering

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CPC
B81C2203/035

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/035Soldering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon MEMS gyroscopes with upper and lower sense plates
- Patent number 12,092,460
- Issue date Sep 17, 2024
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multilayer fluidic devices and methods for their fabrication
- Patent number 12,017,214
- Issue date Jun 25, 2024
- Illumina, Inc.
- Jeffrey S. Fisher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,919,769
- Issue date Mar 5, 2024
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods including panel bonding acts and electronic devices includi...
- Patent number 11,921,032
- Issue date Mar 5, 2024
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing microelectromechanical devices, in partic...
- Patent number 11,891,298
- Issue date Feb 6, 2024
- STMicroelectronics S.r.l.
- Fabio Quaglia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods including panel bonding acts and electronic devices includi...
- Patent number 11,885,736
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,772,963
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capping plate for panel scale packaging of MEMS products
- Patent number 11,685,649
- Issue date Jun 27, 2023
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducer having individual cells with...
- Patent number 11,559,827
- Issue date Jan 24, 2023
- BFLY OPERATIONS, INC.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,542,154
- Issue date Jan 3, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for fabricating silicon MEMS gyroscopes with upper and lowe...
- Patent number 11,530,917
- Issue date Dec 20, 2022
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods including panel bonding acts and electronic devices includi...
- Patent number 11,519,847
- Issue date Dec 6, 2022
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus having a bondline structure and a diffusion barrier with...
- Patent number 11,505,451
- Issue date Nov 22, 2022
- Texas Instruments Incorporated
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for uniform target erosion magnetic assemblies
- Patent number 11,390,520
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fang Chung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing microelectromechanical devices, in partic...
- Patent number 11,383,971
- Issue date Jul 12, 2022
- STMicroelectronics S.r.l.
- Fabio Quaglia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Addressable vertical nanowire probe arrays and fabrication methods
- Patent number 11,363,979
- Issue date Jun 21, 2022
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Analyte sensor package with dispense chemistry and microfluidic cap
- Patent number 11,351,548
- Issue date Jun 7, 2022
- Maxim Integrated Products, Inc.
- Joy T. Jones
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic component package
- Patent number 11,331,663
- Issue date May 17, 2022
- The Regents of the University of California
- Mark Bachman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacture of microisolators and devices for mechanical...
- Patent number 11,312,619
- Issue date Apr 26, 2022
- ENGENIUSMICRO, LLC
- Brian A. English
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 11,305,980
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION
- Publication number 20240375099
- Publication date Nov 14, 2024
- Illumina, Inc.
- Jeffrey S. FISHER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERPOSER FOR DAMPING MEMS MICROPHONES
- Publication number 20240279049
- Publication date Aug 22, 2024
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Achim Bittner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
- Publication number 20240270567
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Hiroshi MATSUBARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
- Publication number 20240199412
- Publication date Jun 20, 2024
- InvenSense, Inc.
- Camillo Pilla
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT
- Publication number 20240182298
- Publication date Jun 6, 2024
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240092631
- Publication date Mar 21, 2024
- Rohm Co., Ltd.
- Yoshiyuki INUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE MANUFACTURING
- Publication number 20240043264
- Publication date Feb 8, 2024
- Obsidian Sensors, Inc.
- Tallis CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230365402
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS with cover drive and method of operating the same
- Publication number 20230322546
- Publication date Oct 12, 2023
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Sergiu LANGA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20230100960
- Publication date Mar 30, 2023
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS INCLUDING PANEL BONDING ACTS AND ELECTRONIC DEVICES INCLUDI...
- Publication number 20230085825
- Publication date Mar 23, 2023
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FABRICATING SILICON MEMS GYROSCOPES WITH UPPER AND LOWE...
- Publication number 20230076161
- Publication date Mar 9, 2023
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE BONDLINE CONTROL STRUCTURE
- Publication number 20230064645
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING AN INTEGRATED SYSTEM INCLUDING A CAPACITIV...
- Publication number 20230061430
- Publication date Mar 2, 2023
- STMicroelectronics S.r.l.
- Paolo FERRARI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
- Publication number 20230045563
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES, IN PARTIC...
- Publication number 20220306456
- Publication date Sep 29, 2022
- STMicroelectronics S.r.l.
- Fabio QUAGLIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20220298009
- Publication date Sep 22, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20220242724
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co.,Ltd
- Jui-Chun WENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...
- Publication number 20220172506
- Publication date Jun 2, 2022
- InvenSense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220068868
- Publication date Mar 3, 2022
- Advanced Semiconductor Engineering, Inc.
- An-Nong WEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20220063993
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20220017363
- Publication date Jan 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION
- Publication number 20210379585
- Publication date Dec 9, 2021
- Illumina, Inc.
- Jeffrey S. FISHER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC ASSEMBLY AND PRESSURE MEASUREMENT DEVICE WITH IMPROVED D...
- Publication number 20210309511
- Publication date Oct 7, 2021
- SAFRAN ELECTRONICS & DEFENSE
- Jean-Christophe RIOU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCER HAVING INDIVIDUAL CELLS WITH...
- Publication number 20210291228
- Publication date Sep 23, 2021
- Butterfly Network, Inc.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A WAFER CONNECTION
- Publication number 20210292160
- Publication date Sep 23, 2021
- ROBERT BOSCH GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN ST...
- Publication number 20210147222
- Publication date May 20, 2021
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anti-stiction process for MEMS device

Bonded structures

Silicon MEMS gyroscopes with upper and lower sense plates

Method for producing a wafer connection

Semiconductor integrated device with electrical contacts between st...

Multilayer fluidic devices and methods for their fabrication

Semiconductor package and method for manufacturing the same

Sensor with dimple features and improved out-of-plane stiction

Methods including panel bonding acts and electronic devices includi...

Process for manufacturing microelectromechanical devices, in partic...

Methods including panel bonding acts and electronic devices includi...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Bonding process for forming semiconductor device structure

Eutectic bonding with AlGe

Packaging method and associated packaging structure

Capping plate for panel scale packaging of MEMS products

Bonded structures

Packaged die and assembling method

Microfabricated ultrasonic transducer having individual cells with...

Sensor with dimple features and improved out-of-plane stiction

Methods for fabricating silicon MEMS gyroscopes with upper and lowe...

Methods including panel bonding acts and electronic devices includi...

Apparatus having a bondline structure and a diffusion barrier with...

Systems and methods for uniform target erosion magnetic assemblies

Process for manufacturing microelectromechanical devices, in partic...

Addressable vertical nanowire probe arrays and fabrication methods

Analyte sensor package with dispense chemistry and microfluidic cap

Microfluidic component package

Methods of manufacture of microisolators and devices for mechanical...

Anti-stiction process for MEMS device

Patents Applicationslast 30 patents

MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION

INTERPOSER FOR DAMPING MEMS MICROPHONES

ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT

MEMS SENSOR AND MANUFACTURING METHOD THEREOF

MEMS DEVICE MANUFACTURING

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

MEMS with cover drive and method of operating the same

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

METHODS INCLUDING PANEL BONDING ACTS AND ELECTRONIC DEVICES INCLUDI...

METHODS FOR FABRICATING SILICON MEMS GYROSCOPES WITH UPPER AND LOWE...

PROTECTIVE BONDLINE CONTROL STRUCTURE

METHOD FOR MANUFACTURING AN INTEGRATED SYSTEM INCLUDING A CAPACITIV...

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES, IN PARTIC...

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

ANTI-STICTION PROCESS FOR MEMS DEVICE

INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION

ELECTRONIC ASSEMBLY AND PRESSURE MEASUREMENT DEVICE WITH IMPROVED D...

MICROFABRICATED ULTRASONIC TRANSDUCER HAVING INDIVIDUAL CELLS WITH...

METHOD FOR PRODUCING A WAFER CONNECTION

SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN ST...