Solid or gel at the normal operating temperature of the device

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/24Solid or gel at the normal operating temperature of the device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Housing, semiconductor module and methods for producing the same
- Patent number 12,148,718
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor module, vehicle, and manufactur...
- Patent number 12,107,030
- Issue date Oct 1, 2024
- Fuji Electric Co., Ltd.
- Sho Takano
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,087,651
- Issue date Sep 10, 2024
- Mitsubishi Electric Corporation
- Kazuma Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,087,729
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light emitting devices
- Patent number 12,080,695
- Issue date Sep 3, 2024
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power density 3D semiconductor module packaging
- Patent number 12,068,298
- Issue date Aug 20, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Yangang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with buffer layer embedded in lid layer
- Patent number 12,009,278
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a semiconductor device
- Patent number 11,996,299
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,984,372
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Teng-Yuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing power module, and power module
- Patent number 11,984,327
- Issue date May 14, 2024
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki Kushihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,978,700
- Issue date May 7, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of the same
- Patent number 11,935,844
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,894,242
- Issue date Feb 6, 2024
- Samsung Electronics Co, Ltd.
- Taeyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,894,358
- Issue date Feb 6, 2024
- Kioxia Corporation
- Masayuki Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrally bonded semiconductor device and power converter includin...
- Patent number 11,887,904
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency device comprising semiconductor device and waveguid...
- Patent number 11,854,917
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,855,054
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a layer that includes inorganic filler...
- Patent number 11,848,213
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Gopalakrishnan Trichy Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,848,319
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package with reduced underfill area
- Patent number 11,837,476
- Issue date Dec 5, 2023
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor devices and methods for manufacturing pressure sens...
- Patent number 11,815,414
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Emanuel Stoicescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,791,324
- Issue date Oct 17, 2023
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring structure and method for forming t...
- Patent number 11,728,233
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,721,601
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing same
- Patent number 11,655,143
- Issue date May 23, 2023
- Infineon Technologies AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421012
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sangsick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20240395643
- Publication date Nov 28, 2024
- Sony Semiconductor Solutions Corporation
- Yoshihiro MAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240395786
- Publication date Nov 28, 2024
- Nichia Corporation.
- Kenji OZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING BACKSIDE POWER/GROUND DELIV...
- Publication number 20240332129
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D FILLERS FOR REDUCED CTE FOR PID
- Publication number 20240332125
- Publication date Oct 3, 2024
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER
- Publication number 20240290682
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240274483
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Teng-Yuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING
- Publication number 20240266306
- Publication date Aug 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240243114
- Publication date Jul 18, 2024
- ACER INCORPORATED
- Yu-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20240222325
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY INTEGRATED CIRCUIT
- Publication number 20240178085
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- STEVEN ALFRED KUMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRU...
- Publication number 20240178086
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module having a double-sided heat dissipation structu...
- Publication number 20240096720
- Publication date Mar 21, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240087968
- Publication date Mar 14, 2024
- Mitsubishi Electric Corporation
- Yoshitaka KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH REDUCED STRESS
- Publication number 20240079350
- Publication date Mar 7, 2024
- Murata Manufacturing Co., Ltd.
- Shigeru ENDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICES AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICES
- Publication number 20240079282
- Publication date Mar 7, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Yasuyuki TAKEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079391
- Publication date Mar 7, 2024
- Taiwan Semiconductor Mqanufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM
- Publication number 20240079399
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER
- Publication number 20240071977
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240055417
- Publication date Feb 15, 2024
- ACER INCORPORATED
- Yu-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE
- Publication number 20240055396
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230420318
- Publication date Dec 28, 2023
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK
- Publication number 20230395446
- Publication date Dec 7, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Ex...
- Publication number 20230317708
- Publication date Oct 5, 2023
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307306
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20230223279
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- TAEYOUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION TECHNIQUES
- Publication number 20230215773
- Publication date Jul 6, 2023
- ELTA SYSTEMS LTD.
- Itzhak Shapir
- H01 - BASIC ELECTRIC ELEMENTS

Solid or gel at the normal operating temperature of the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Housing, semiconductor module and methods for producing the same

Semiconductor device, semiconductor module, vehicle, and manufactur...

Semiconductor device and method of manufacturing the same

Multi-chip package having stress relief structure

Method for manufacturing light emitting devices

High power density 3D semiconductor module packaging

Integrated circuit package and method of forming same

Package structure with buffer layer embedded in lid layer

Methods for manufacturing a semiconductor device

Integrated circuit package and method

Method for producing power module, and power module

Power semiconductor module arrangement

Integrated circuit direct cooling systems having substrates in cont...

Semiconductor assemblies using edge stacking and methods of manufac...

Semiconductor device and method of the same

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor device and manufacturing method thereof

Integrally bonded semiconductor device and power converter includin...

Thermal transfer structures for semiconductor die assemblies

Radio-frequency device comprising semiconductor device and waveguid...

Method of forming package structure

Semiconductor module having a layer that includes inorganic filler...

Multi-chip semiconductor package

Flip-chip package with reduced underfill area

Pressure sensor devices and methods for manufacturing pressure sens...

Light emitting device

Chip package structure with ring structure and method for forming t...

Semiconductor package and method of manufacturing the same

Semiconductor component and method for producing same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Semiconductor Device Package with Thermal Module

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

LIGHT EMITTING DEVICE

INTEGRATED COOLING ASSEMBLIES INCLUDING BACKSIDE POWER/GROUND DELIV...

2D FILLERS FOR REDUCED CTE FOR PID

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING

ELECTRONIC PACKAGE STRUCTURE

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

OPEN CAVITY INTEGRATED CIRCUIT

PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRU...

Semiconductor module having a double-sided heat dissipation structu...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

ELECTRONIC COMPONENT WITH REDUCED STRESS

ELECTRONIC DEVICES AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICES

Die Structures and Methods of Forming the Same

METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM

DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER

ELECTRONIC PACKAGE STRUCTURE

MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE

SEMICONDUCTOR MODULE

MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK

Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Ex...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

ENCAPSULATION TECHNIQUES