Solid or gel at the normal operating temperature of the device

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H01L23/24

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/24Solid or gel at the normal operating temperature of the device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with ring structure
- Patent number 12,368,080
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 12,368,137
- Issue date Jul 22, 2025
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Omni directional interconnect with magnetic fillers in mold matrix
- Patent number 12,354,883
- Issue date Jul 8, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid channel geometry optimizations to improve cooling efficiency
- Patent number 12,322,677
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Ron Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 12,322,670
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,308,344
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method for manufacturing same
- Patent number 12,300,628
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,116
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module trenched lid and low coefficient of thermal ex...
- Patent number 12,249,599
- Issue date Mar 11, 2025
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure and package structure therefrom
- Patent number 12,218,117
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple substrate package systems and related methods
- Patent number 12,211,775
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with recessed molding region disposed below h...
- Patent number 12,191,290
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- In-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assembly including coolant channel on the backsi...
- Patent number 12,176,263
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing, semiconductor module and methods for producing the same
- Patent number 12,148,718
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor module, vehicle, and manufactur...
- Patent number 12,107,030
- Issue date Oct 1, 2024
- Fuji Electric Co., Ltd.
- Sho Takano
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,087,651
- Issue date Sep 10, 2024
- Mitsubishi Electric Corporation
- Kazuma Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,087,729
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light emitting devices
- Patent number 12,080,695
- Issue date Sep 3, 2024
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power density 3D semiconductor module packaging
- Patent number 12,068,298
- Issue date Aug 20, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Yangang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with buffer layer embedded in lid layer
- Patent number 12,009,278
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a semiconductor device
- Patent number 11,996,299
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,984,372
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Teng-Yuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing power module, and power module
- Patent number 11,984,327
- Issue date May 14, 2024
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki Kushihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,978,700
- Issue date May 7, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of the same
- Patent number 11,935,844
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239498
- Publication date Jul 24, 2025
- HON HAI PRECISION INDUSTRY CO., LTD.
- Te-En TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20250239496
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED STRUCTURE FOR WARPAGE SUPPRESSION
- Publication number 20250226275
- Publication date Jul 10, 2025
- Industrial Technology Research Institute
- Yu-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES
- Publication number 20250218881
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi MOHAMMADIGHALENI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ASSEMBLY
- Publication number 20250210428
- Publication date Jun 26, 2025
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH STIFFENERS CONTAINING SEMICONDUCTO...
- Publication number 20250210429
- Publication date Jun 26, 2025
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC PACKAGE
- Publication number 20250201643
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sungeun JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250192100
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING MOLDING GUIDE PATTERNS
- Publication number 20250191986
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Gyuhyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183110
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblage module 3D
- Publication number 20250167057
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Manon PORLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM
- Publication number 20250140768
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125204
- Publication date Apr 17, 2025
- Mitsubishi Electric Corporation
- Yu FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging electronic device with liquid thermal interface material
- Publication number 20250118618
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Janak Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS
- Publication number 20250118640
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250112099
- Publication date Apr 3, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrates with Corner Stiffeners Extensions
- Publication number 20250087542
- Publication date Mar 13, 2025
- Intel Corporation
- Man Chun OOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079338
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20250079264
- Publication date Mar 6, 2025
- ZF Friedrichshafen AG
- Shaozhi Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY INTEGRATED CIRCUIT
- Publication number 20250069976
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vernon BUCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Stiffeners for Package Level Warpage Modulation
- Publication number 20250062168
- Publication date Feb 20, 2025
- Intel Corporation
- Justin WHETTEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct Vapor Chamber for Heat Dissipation in Electronic Devices
- Publication number 20250062187
- Publication date Feb 20, 2025
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING DAM STRUCTURE
- Publication number 20250054824
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT
- Publication number 20250054868
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038057
- Publication date Jan 30, 2025
- Kabushiki Kaisha Toshiba
- Eitaro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...
- Publication number 20250006569
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...
- Publication number 20240429144
- Publication date Dec 26, 2024
- SIEMENS AKTIENGESELLSCHAFT
- BERND KÜRTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY MODULE INCLUDING FIXING STRUCTURE
- Publication number 20240429111
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun NOH
- H01 - BASIC ELECTRIC ELEMENTS

Solid or gel at the normal operating temperature of the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure with ring structure

High bandwidth die to die interconnect with package area reduction

Omni directional interconnect with magnetic fillers in mold matrix

Fluid channel geometry optimizations to improve cooling efficiency

Methods and apparatus for package with interposers

Multi-chip package having stress relief structure

Module and method for manufacturing same

Integrated circuit package and method of forming same

Semiconductor structure and manufacturing method thereof

Multiple chip module trenched lid and low coefficient of thermal ex...

Method of forming package structure and package structure therefrom

Multiple substrate package systems and related methods

Semiconductor package with recessed molding region disposed below h...

Integrated cooling assembly including coolant channel on the backsi...

Housing, semiconductor module and methods for producing the same

Semiconductor device, semiconductor module, vehicle, and manufactur...

Semiconductor device and method of manufacturing the same

Multi-chip package having stress relief structure

Method for manufacturing light emitting devices

High power density 3D semiconductor module packaging

Integrated circuit package and method of forming same

Package structure with buffer layer embedded in lid layer

Methods for manufacturing a semiconductor device

Integrated circuit package and method

Method for producing power module, and power module

Power semiconductor module arrangement

Integrated circuit direct cooling systems having substrates in cont...

Semiconductor assemblies using edge stacking and methods of manufac...

Semiconductor device and method of the same

Semiconductor package and method of manufacturing the semiconductor...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

COMPONENT-EMBEDDED STRUCTURE FOR WARPAGE SUPPRESSION

LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES

STIFFENER ASSEMBLY

INTEGRATED CIRCUIT PACKAGES WITH STIFFENERS CONTAINING SEMICONDUCTO...

STACKED IC PACKAGE

SYSTEM ON INTEGRATED CIRCUIT STRUCTURE

SEMICONDUCTOR PACKAGES INCLUDING MOLDING GUIDE PATTERNS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Assemblage module 3D

METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM

SEMICONDUCTOR DEVICE

Packaging electronic device with liquid thermal interface material

MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Package Substrates with Corner Stiffeners Extensions

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR POWER MODULE

CAVITY INTEGRATED CIRCUIT

Method and Stiffeners for Package Level Warpage Modulation

Direct Vapor Chamber for Heat Dissipation in Electronic Devices

PACKAGE STRUCTURE HAVING DAM STRUCTURE

POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT

SEMICONDUCTOR DEVICE

METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...

SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...

SEMICONDUCTOR MEMORY MODULE INCLUDING FIXING STRUCTURE