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ELECTRONIC PACKAGE STRUCTURE
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Publication number 20240055417
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Publication date Feb 15, 2024
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ACER INCORPORATED
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Yu-Ming Lin
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MODULE
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Publication number 20230420318
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Publication date Dec 28, 2023
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Fuji Electric Co., Ltd.
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Akira MOROZUMI
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H01 - BASIC ELECTRIC ELEMENTS
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ENCAPSULATION TECHNIQUES
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Publication number 20230215773
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Publication date Jul 6, 2023
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ELTA SYSTEMS LTD.
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Itzhak Shapir
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H01 - BASIC ELECTRIC ELEMENTS
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Multi-Chip Semiconductor Package
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Publication number 20220384411
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Publication date Dec 1, 2022
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Yu-Chia Lai
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGE AND METHOD
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Publication number 20220367301
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Publication date Nov 17, 2022
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Teng-Yuan Lo
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE WITH FAN-OUT FEATURE
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Publication number 20220310468
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Publication date Sep 29, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Meng-Liang Lin
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF FORMING PACKAGE STRUCTURE
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Publication number 20220231005
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Publication date Jul 21, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chih-Chien Pan
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H01 - BASIC ELECTRIC ELEMENTS