Stacked arrangements of non-apertured devices

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H01L25/074

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/074Stacked arrangements of non-apertured devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structurally embedded and inhospitable environment systems having a...
- Patent number 11,957,922
- Issue date Apr 16, 2024
- Face International Corporation
- Clark D Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-silicon N-type and P-type stacked transistors for integrated ci...
- Patent number 11,935,891
- Issue date Mar 19, 2024
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 11,916,054
- Issue date Feb 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with key pattern and electronic system includi...
- Patent number 11,889,688
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Chang-Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,837,523
- Issue date Dec 5, 2023
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module for improved heat dissipation and power...
- Patent number 11,823,996
- Issue date Nov 21, 2023
- Huawei Technologies Co., Ltd.
- Hamit Duran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional, monolithically stacked field effect transistors...
- Patent number 11,817,501
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Sung Dae Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,810,903
- Issue date Nov 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter with co-packaged secondary field effect transistors...
- Patent number 11,799,384
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Todd Edward Takken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,790,219
- Issue date Oct 17, 2023
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module
- Patent number 11,776,937
- Issue date Oct 3, 2023
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and method of manufacturing the same
- Patent number 11,764,268
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Sunggil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device topside cooling
- Patent number 11,742,266
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Laura May Antoinette Dela Paz Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 11,710,681
- Issue date Jul 25, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Tanawan Chaowasakoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power module and method for manufacturing the...
- Patent number 11,664,466
- Issue date May 30, 2023
- Nissan Motor Co., Ltd.
- Toshiharu Marui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof casing with a sealing grommet in a casting hole
- Patent number 11,646,245
- Issue date May 9, 2023
- Denso Corporation
- Satoshi Yamaura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,640,932
- Issue date May 2, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,637,092
- Issue date Apr 25, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) type semiconductor packages
- Patent number 11,610,871
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked chips comprising interconnects
- Patent number 11,594,521
- Issue date Feb 28, 2023
- Kioxia Corporation
- Masaru Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package manufacturing process
- Patent number 11,587,923
- Issue date Feb 21, 2023
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structurally embedded and inhospitable environment systems having a...
- Patent number 11,571,583
- Issue date Feb 7, 2023
- Face International Corporation
- Clark D Boyd
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Integration of III-V transistors in a silicon CMOS stack
- Patent number 11,538,803
- Issue date Dec 27, 2022
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting techniques for stacked substrates
- Patent number 11,532,586
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module including stacked power devices with metal clip
- Patent number 11,495,580
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,476,179
- Issue date Oct 18, 2022
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having stacked die structure
- Patent number 11,476,200
- Issue date Oct 18, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20240088120
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LONG CHANNEL TRANSISTOR
- Publication number 20240063189
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) AND METHOD OF...
- Publication number 20240021586
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DESIGN FOR III-NITRIDE DEVICES
- Publication number 20240014312
- Publication date Jan 11, 2024
- Transphorm Technology, Inc.
- Yifeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL, MONOLITHICALLY STACKED FIELD EFFECT TRANSISTORS...
- Publication number 20240014322
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Sung Dae Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE TOPSIDE COOLING
- Publication number 20230395471
- Publication date Dec 7, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Laura May Antoinette Dela Paz Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FIELD-EFFECT TRANSISTORS HAVING LATCH CROSS-COUPLING CONNEC...
- Publication number 20230335585
- Publication date Oct 19, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Architecture in Multi-Dimensional Monolithic Structure
- Publication number 20230335537
- Publication date Oct 19, 2023
- ARM Limited
- Lokesh Kumar Saini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUSBAR WITH DIELECTRIC COATING
- Publication number 20230326834
- Publication date Oct 12, 2023
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR STRUCTURE WITH REFLECTION LAYER
- Publication number 20230299053
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Teresa J. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230290757
- Publication date Sep 14, 2023
- Kabushiki Kaisha Toshiba
- Tatsuya OHGURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230290879
- Publication date Sep 14, 2023
- RENESAS ELECTRONICS CORPORATION
- Seiji HIRABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20230282634
- Publication date Sep 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230275006
- Publication date Aug 31, 2023
- Rohm Co., Ltd.
- Kota ISE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20230268253
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED FET WITH STRAINED CHANNEL
- Publication number 20230260971
- Publication date Aug 17, 2023
- International Business Machines Corporation
- SHOGO MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER MODULE AND MANUFACTURING METHOD FOR THE...
- Publication number 20230253512
- Publication date Aug 10, 2023
- Nissan Motor Co., Ltd.
- Toshiharu MARUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE
- Publication number 20230246002
- Publication date Aug 3, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230230963
- Publication date Jul 20, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
- Publication number 20230223387
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LATERAL POWER SEMICONDUCTOR DEVICE
- Publication number 20230178592
- Publication date Jun 8, 2023
- NEXPERIA B.V.
- Stefano Dalcanale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163106
- Publication date May 25, 2023
- Mitsubishi Electric Corporation
- Ryoya SHIRAHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET REPLACEMENT METAL GATE PATTERNING SCHEME
- Publication number 20230154996
- Publication date May 18, 2023
- International Business Machines Corporation
- RUQIANG BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230144840
- Publication date May 11, 2023
- RENESAS ELECTRONICS CORPORATION
- Hideki SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230145182
- Publication date May 11, 2023
- Shinko Electric Industries Co., Ltd.
- Hitoshi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230145565
- Publication date May 11, 2023
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR STRUCTURES OF INTEGRATED CIRCUIT DEVICES INCLUDING STACKED...
- Publication number 20230135219
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of non-apertured devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structurally embedded and inhospitable environment systems having a...

Non-silicon N-type and P-type stacked transistors for integrated ci...

Stacked devices and methods of fabrication

Semiconductor package with solder standoff

Semiconductor device with key pattern and electronic system includi...

Inverter

Lead between a plurality of encapsulated MOSFETs

Power semiconductor module for improved heat dissipation and power...

Three-dimensional, monolithically stacked field effect transistors...

Semiconductor structure and forming method thereof

Power converter with co-packaged secondary field effect transistors...

Three dimensional circuit implementing machine trained network

Electronic module

Semiconductor devices and method of manufacturing the same

Package and package-on-package structure having elliptical columns...

Electronic device topside cooling

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device, power module and method for manufacturing the...

Waterproof casing with a sealing grommet in a casting hole

Packaged electronic device with film isolated power stack

Semiconductor structure and forming method thereof

Package-on-package (POP) type semiconductor packages

Stacked chips comprising interconnects

Multichip package manufacturing process

Structurally embedded and inhospitable environment systems having a...

Integration of III-V transistors in a silicon CMOS stack

Connecting techniques for stacked substrates

Multi-chip module including stacked power devices with metal clip

Inverter

Semiconductor package structure having stacked die structure

Patents Applicationslast 30 patents

STACKED DEVICES AND METHODS OF FABRICATION

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

Two-In-One Lead Frame Package

STACKED LONG CHANNEL TRANSISTOR

SEMICONDUCTOR DEVICE

STACKED COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) AND METHOD OF...

INTEGRATED DESIGN FOR III-NITRIDE DEVICES

THREE-DIMENSIONAL, MONOLITHICALLY STACKED FIELD EFFECT TRANSISTORS...

ELECTRONIC DEVICE TOPSIDE COOLING

STACKED FIELD-EFFECT TRANSISTORS HAVING LATCH CROSS-COUPLING CONNEC...

Circuit Architecture in Multi-Dimensional Monolithic Structure

BUSBAR WITH DIELECTRIC COATING

STACKED TRANSISTOR STRUCTURE WITH REFLECTION LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

STACKED DEVICES AND METHODS OF FABRICATION

SEMICONDUCTOR APPARATUS

Packaged Electronic Device With Film Isolated Power Stack

VERTICALLY STACKED FET WITH STRAINED CHANNEL

SEMICONDUCTOR DEVICE, POWER MODULE AND MANUFACTURING METHOD FOR THE...

SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES

LATERAL POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

NANOSHEET REPLACEMENT METAL GATE PATTERNING SCHEME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

RESISTOR STRUCTURES OF INTEGRATED CIRCUIT DEVICES INCLUDING STACKED...