Stacked insulating layers

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H01L23/53295

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/53295Stacked insulating layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques, methods, and structures for rapid and efficient interca...
- Patent number 12,368,102
- Issue date Jul 22, 2025
- Destination 2D Inc.
- Kaustav Banerjee
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Diffusion barrier layer for conductive via to decrease contact resi...
- Patent number 12,368,103
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside power rail and method thereof
- Patent number 12,369,365
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
- Patent number 12,368,097
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming embedded diffusion barriers
- Patent number RE50494
- Issue date Jul 15, 2025
- TESSERA LLC
- Cyril Cabral
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination control of dielectric layers of integrated circuit chips
- Patent number 12,354,946
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron migration control in interconnect structures
- Patent number 12,354,907
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 12,354,908
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device structure with a protection cap at an end port...
- Patent number 12,347,722
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,347,776
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including metal lines spaced apart from...
- Patent number 12,347,774
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Janggeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked FET contact formation
- Patent number 12,347,767
- Issue date Jul 1, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with direct attach to circuit boards
- Patent number 12,347,782
- Issue date Jul 1, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line for semiconductor device
- Patent number 12,341,057
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,341,097
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Sangshin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with liner structure
- Patent number 12,341,062
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming thereof
- Patent number 12,334,400
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Ming Hsun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,334,431
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with adjustment layers and method for fabricat...
- Patent number 12,327,793
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 12,327,773
- Issue date Jun 10, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage passive device structure
- Patent number 12,327,785
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,327,759
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheol Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric layer
- Patent number 12,322,648
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high density, high shorting margin, and low capac...
- Patent number 12,322,699
- Issue date Jun 3, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,792
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jongmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures of anti-fuse devices and core devices with...
- Patent number 12,315,799
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xianlei Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures with barriers and liners of varying thicknesses
- Patent number 12,315,764
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250239526
- Publication date Jul 24, 2025
- KIOXIA Corporation
- Hikaru ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE
- Publication number 20250234511
- Publication date Jul 17, 2025
- NANYA TECHNOLOGY CORPORATION
- YI-JEN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20250233068
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226374
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCA...
- Publication number 20250226320
- Publication date Jul 10, 2025
- Destination 2D Inc.
- Kaustav BANERJEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS
- Publication number 20250226322
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ren Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
- Publication number 20250226313
- Publication date Jul 10, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCA...
- Publication number 20250226321
- Publication date Jul 10, 2025
- Destination 2D Inc.
- Kaustav BANERJEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...
- Publication number 20250218949
- Publication date Jul 3, 2025
- Intel Corporation
- Sriharsha Karumuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES
- Publication number 20250218933
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210525
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Genki SAWADA
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210413
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF A MANUFACTURING THE SEMIC...
- Publication number 20250203866
- Publication date Jun 19, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250201717
- Publication date Jun 19, 2025
- KIOXIA Corporation
- Shigehiro WATANABE
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20250201718
- Publication date Jun 19, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING PAD STRUCTURES ON STAIRCASE STRUC...
- Publication number 20250201715
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA
- Publication number 20250201626
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250192036
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH CAVITY STRUCTURE
- Publication number 20250191971
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250192057
- Publication date Jun 12, 2025
- InnoLux Corporation
- Chandra LIUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A METAL WIRING LAYER
- Publication number 20250192042
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wonsuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE ISOLATION DEVICE
- Publication number 20250183152
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kozaburo Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN
- Publication number 20250183098
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Byung Wook BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250183028
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC LAYER
- Publication number 20250174493
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250167115
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jimo GU
- H01 - BASIC ELECTRIC ELEMENTS

Stacked insulating layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure comprising a gap an...

Techniques, methods, and structures for rapid and efficient interca...

Diffusion barrier layer for conductive via to decrease contact resi...

Semiconductor devices with backside power rail and method thereof

Contact structures for reducing electrical shorts and methods of fo...

Semiconductor device and method of manufacturing the same

Self-forming embedded diffusion barriers

Cobalt based interconnects and methods of fabrication thereof

Delamination control of dielectric layers of integrated circuit chips

Electron migration control in interconnect structures

Amorphous layers for reducing copper diffusion and method forming same

Semiconductor device structure with a protection cap at an end port...

Integrated chip with graphene based interconnect

Integrated circuit devices including metal lines spaced apart from...

Stacked FET contact formation

Microelectronic assemblies with direct attach to circuit boards

Interconnect line for semiconductor device

Semiconductor devices

Method for fabricating semiconductor device with liner structure

Semiconductor structure and method of forming thereof

Semiconductor interconnection structures and methods of forming the...

Semiconductor device with adjustment layers and method for fabricat...

Package with underfill containment barrier

High voltage passive device structure

Semiconductor device and method for fabricating the same

Interlayer dielectric layer

Method of forming high density, high shorting margin, and low capac...

Semiconductor device

Semiconductor structures of anti-fuse devices and core devices with...

Conductive structures with barriers and liners of varying thicknesses

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE

SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCA...

INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS

INTERCONNECT LINES WITH LINE WIDTH PROFILE

TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCA...

TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...

DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES

MULTI-LAYER LINE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF A MANUFACTURING THE SEMIC...

SEMICONDUCTOR MEMORY DEVICE

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

MICROELECTRONIC DEVICES INCLUDING PAD STRUCTURES ON STAIRCASE STRUC...

ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

INTEGRATED CHIP WITH CAVITY STRUCTURE

ELECTRONIC DEVICE

INTEGRATED CIRCUIT DEVICE INCLUDING A METAL WIRING LAYER

HIGH VOLTAGE ISOLATION DEVICE

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

INTERLAYER DIELECTRIC LAYER

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME