Stacked insulating layers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53295Stacked insulating layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,230,538
- Issue date Feb 18, 2025
- Kioxia Corporation
- Shinya Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,204
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Nan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 12,224,205
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,738
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,211,795
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Jinsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising a compressive dielectric material, an...
- Patent number 12,205,900
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-layer etch stop structure
- Patent number 12,198,979
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,191,256
- Issue date Jan 7, 2025
- Samsung Display Co., Ltd.
- Jung Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric cap structure in semiconductor devices and methods of ma...
- Patent number 12,183,633
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,185,534
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method for manufacturing the same
- Patent number 12,183,628
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 12,176,246
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad fabrication process for a semiconductor product
- Patent number 12,170,256
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Sudtida Lavangkul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer surrounding conductive features and method forming same
- Patent number 12,165,914
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interconnect structure for thermal management of electrical...
- Patent number 12,165,945
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing semiconductor stru...
- Patent number 12,166,028
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite word line structure and method...
- Patent number 12,160,988
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having air gap structures integrated with i...
- Patent number 12,148,690
- Issue date Nov 19, 2024
- Tahoe Research, LTD.
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,692
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,148,831
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reducing dual damascene distortion
- Patent number 12,148,696
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,558
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Naoya Inoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20250062231
- Publication date Feb 20, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250046712
- Publication date Feb 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshiki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...
- Publication number 20250046673
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250040144
- Publication date Jan 30, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE
- Publication number 20250029873
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250029956
- Publication date Jan 23, 2025
- KIOXIA Corporation
- Yasunori IWASHITA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250015185
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...
- Publication number 20250014990
- Publication date Jan 9, 2025
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...
- Publication number 20250014998
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- JUNGHOO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250014989
- Publication date Jan 9, 2025
- AaltoSemi Inc.
- Jiun-Hua CHIUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND CIRCUIT DEVICE
- Publication number 20250015001
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Shota ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT PACKAGE, METHOD OF FORMING THE SAME AND POWER MODULE
- Publication number 20250006633
- Publication date Jan 2, 2025
- Shenzhen STS Microelectronics Co. Ltd
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006641
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Yoon Hee KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINER...
- Publication number 20250006640
- Publication date Jan 2, 2025
- SANDISK TECHNOLOGIES LLC
- Ryota SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240431107
- Publication date Dec 26, 2024
- SK HYNIX INC.
- Jin-Ha KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDU...
- Publication number 20240421084
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Kyosuke NANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421130
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS
- Publication number 20240413082
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413083
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...
- Publication number 20240404953
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20240395606
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20240395607
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE
- Publication number 20240387358
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KHADERBAD MRUNAL ABHIJITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20240387364
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...
- Publication number 20240387374
- Publication date Nov 21, 2024
- SANDISK TECHNOLOGIES LLC
- Masato NOGUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387166
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240387250
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387165
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Stacked insulating layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reducing RC delay in semiconductor devices

Semiconductor device and method of manufacturing the same

Semiconductor device and method

Semiconductor memory device and manufacturing method thereof

Method of forming an integrated circuit device having an etch-stop...

Integrated chip with graphene based interconnect

Semiconductor structure and manufacturing method thereof

Semiconductor device

Electronic devices comprising a compressive dielectric material, an...

Semiconductor device with multi-layer etch stop structure

Display device

Dielectric cap structure in semiconductor devices and methods of ma...

Integrated circuit device

Integrated circuit and method for manufacturing the same

Dielectric capping structure overlying a conductive structure to in...

Contact pad fabrication process for a semiconductor product

Selective passivation and selective deposition

Air spacer surrounding conductive features and method forming same

Thermal interconnect structure for thermal management of electrical...

Semiconductor structure and method for preparing semiconductor stru...

Semiconductor device with composite word line structure and method...

Method of forming an interconnect structure having an air gap and s...

Semiconductor device and a method of manufacturing the same

Microelectronic devices having air gap structures integrated with i...

Semiconductor package and manufacturing method thereof

Semiconductor device and a method for fabricating the same

High aspect ratio buried power rail metallization

Methods for reducing dual damascene distortion

Semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

WIRING SUBSTRATE

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...

MEMORY DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

ELECTRONIC COMPONENT AND CIRCUIT DEVICE

INTERCONNECT PACKAGE, METHOD OF FORMING THE SAME AND POWER MODULE

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINER...

VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS

SEMICONDUCTOR DEVICE

DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

DEVICE AND METHOD OF FORMING THE SAME

METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...