-
LOW-STRESS PASSIVATION LAYER
-
Publication number 20240136291
-
Publication date Apr 25, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Hsiang-Ku SHEN
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
POWER MODULE
-
Publication number 20240128180
-
Publication date Apr 18, 2024
-
Hyundai Motor Company
-
Myung Ill You
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
STACKED FET CONTACT FORMATION
-
Publication number 20240105590
-
Publication date Mar 28, 2024
-
International Business Machines Corporation
-
Koichi Motoyama
-
H01 - BASIC ELECTRIC ELEMENTS
-
INTEGRATED CIRCUIT DEVICE
-
Publication number 20240096796
-
Publication date Mar 21, 2024
-
Samsung Electronics Co., Ltd.
-
Yongjin KIM
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
MULTI-LAYER LINE STRUCTURE
-
Publication number 20240088040
-
Publication date Mar 14, 2024
-
DAI NIPPON PRINTING CO., LTD.
-
Hiroshi Kudo
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
SEMICONDUCTOR DEVICE
-
Publication number 20240071923
-
Publication date Feb 29, 2024
-
Samsung Electronics Co., Ltd.
-
Minjun SONG
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
SEMICONDUCTOR DEVICE
-
Publication number 20240057344
-
Publication date Feb 15, 2024
-
Taiwan Semiconductor Manufacturing company Ltd.
-
HARRY-HAK-LAY CHUANG
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
DEVICES WITH REDUCED CAPACITANCES
-
Publication number 20240021468
-
Publication date Jan 18, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Yu-Hsin Chan
-
H01 - BASIC ELECTRIC ELEMENTS
-