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H01L2224/2101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2101Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package with polymer pillars and raised portions
- Patent number 12,368,125
- Issue date Jul 22, 2025
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method comprising formation of redistribu...
- Patent number 12,368,077
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 12,347,802
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,347,801
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including post
- Patent number 12,322,720
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 12,300,656
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating structures for semiconductor devices and methods o...
- Patent number 12,272,616
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,272,666
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Eunsil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed density interconnect architectures using hybrid fan-out
- Patent number 12,266,611
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device with chip to package interconnects from a copper metal in...
- Patent number 12,261,141
- Issue date Mar 25, 2025
- Texas Instruments Incorporated
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including thermal enhanced bonding structure
- Patent number 12,261,142
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 12,255,114
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,249,588
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including parallel electrically conductive la...
- Patent number 12,237,246
- Issue date Feb 25, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with system and methods for conveying sign...
- Patent number 12,230,608
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 12,211,817
- Issue date Jan 28, 2025
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
- Patent number 12,191,239
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 12,165,989
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,154,889
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 12,136,579
- Issue date Nov 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising various via structures
- Patent number 12,087,597
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Fu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip encapsulation structure and encapsulation method
- Patent number 12,057,361
- Issue date Aug 6, 2024
- Epicmems (Xiamen) Co., Ltd.
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,021,053
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming same
- Patent number 12,009,226
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having adhesion layers for through vias
- Patent number 12,009,331
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,002,781
- Issue date Jun 4, 2024
- Tokyo Institute of Technology
- Takayuki Ohba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250239555
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING STRUCT...
- Publication number 20250233096
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- SOYEON MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE, METHOD OF FORMING REDISTRIBUTION LA...
- Publication number 20250219003
- Publication date Jul 3, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS, PACKAGE, AND MANUFACTURING METHOD OF PA...
- Publication number 20250210564
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250210565
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- EUNSIL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...
- Publication number 20250201751
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-Dissipating Structures for Semiconductor Devices and Methods o...
- Publication number 20250201659
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250192088
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method for manufacturing the same
- Publication number 20250174592
- Publication date May 29, 2025
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED HIGH FREQUENCY AESA ANTENNA CONNECTION METHOD
- Publication number 20250167154
- Publication date May 22, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING SEMICONDUCTOR DEVICE DELAMINATION
- Publication number 20250157973
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250149466
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT
- Publication number 20250140729
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND ME...
- Publication number 20250140727
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Wonbin Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE
- Publication number 20250140728
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Taehoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250132224
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20250125241
- Publication date Apr 17, 2025
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
- Publication number 20250125297
- Publication date Apr 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD
- Publication number 20250112111
- Publication date Apr 3, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...
- Publication number 20250096092
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250087572
- Publication date Mar 13, 2025
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250079382
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250062174
- Publication date Feb 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20250062267
- Publication date Feb 20, 2025
- SILICON BOX PTE. LTD.
- Sehat SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20250054893
- Publication date Feb 13, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Artan BAFTIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250038145
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Tzu-Jui FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429193
- Publication date Dec 26, 2024
- InnoLux Corporation
- Pei-Yin CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240404973
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mohamad Ashraf bin Mohd Arshad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UPPER CONDUCTIVE STRUCTURE HAVING MULTILAYER STACK TO DECREASE FABR...
- Publication number 20240404975
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package with polymer pillars and raised portions

Semiconductor package and method comprising formation of redistribu...

Die corner removal for underfill crack suppression in semiconductor...

Semiconductor package and method for manufacturing the same

Semiconductor package including post

Semiconductor package and method of forming thereof

Electronic package and method of forming the same

Heat-dissipating structures for semiconductor devices and methods o...

Semiconductor package and method of manufacturing the same

Mixed density interconnect architectures using hybrid fan-out

IC device with chip to package interconnects from a copper metal in...

Semiconductor structure including thermal enhanced bonding structure

Embedded package with electrically isolating dielectric liner

Semiconductor device and methods of manufacture

Semiconductor devices including parallel electrically conductive la...

Semiconductor assemblies with system and methods for conveying sign...

Semiconductor device and manufacturing method for semiconductor device

Submodule semiconductor package

Stacked via structure disposed on a conductive pillar of a semicond...

3D chip package based on vertical-through-via connector

Semiconductor package with electromagnetic interference shielding

Semiconductor package

Package structure and method for manufacturing the same

Method of forming semiconductor packages having through package vias

Semiconductor structure comprising various via structures

Chip encapsulation structure and encapsulation method

Semiconductor package and method

Semiconductor device and method of forming same

Integrated circuit packages having adhesion layers for through vias

Semiconductor device and method for manufacturing same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING STRUCT...

REDISTRIBUTION LAYER STRUCTURE, METHOD OF FORMING REDISTRIBUTION LA...

METHOD OF FORMING PATTERNS, PACKAGE, AND MANUFACTURING METHOD OF PA...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...

Heat-Dissipating Structures for Semiconductor Devices and Methods o...

SEMICONDUCTOR STRUCTURE

Electronic device and method for manufacturing the same

ADVANCED HIGH FREQUENCY AESA ANTENNA CONNECTION METHOD

SYSTEMS AND METHODS FOR REDUCING SEMICONDUCTOR DEVICE DELAMINATION

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT

WIRING STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND ME...

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE

PRINTED CIRCUIT BOARD

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

SUBMODULE SEMICONDUCTOR PACKAGE

FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD

STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

Component Carrier and Method of Manufacturing the Same

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC DEVICE

WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE

UPPER CONDUCTIVE STRUCTURE HAVING MULTILAYER STACK TO DECREASE FABR...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE