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H01L2224/1401

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1401Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,714,443
- Issue date Jul 14, 2020
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode for a semiconductor device of a ball grid array (BGA) type
- Patent number 10,283,472
- Issue date May 7, 2019
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out semiconductor device including a plurality of semiconductor...
- Patent number 10,177,119
- Issue date Jan 8, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable molded microelectronic packages
- Patent number 10,128,216
- Issue date Nov 13, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including carrier wafers and attached devi...
- Patent number 10,128,142
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Convection optimization for mixed feature electroplating
- Patent number 10,094,035
- Issue date Oct 9, 2018
- Lam Research Corporation
- Gabriel Hay Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,043,773
- Issue date Aug 7, 2018
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,037,959
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bump of semiconductor package
- Patent number 10,032,738
- Issue date Jul 24, 2018
- SMART MODULAR TECHNOLOGIES LX S.A.R.L.
- Bum Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive vias
- Patent number 9,875,981
- Issue date Jan 23, 2018
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 9,812,417
- Issue date Nov 7, 2017
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable molded microelectronic packages
- Patent number 9,570,382
- Issue date Feb 14, 2017
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including carrier wafers and methods of us...
- Patent number 9,472,518
- Issue date Oct 18, 2016
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,472,523
- Issue date Oct 18, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect
- Patent number 9,385,099
- Issue date Jul 5, 2016
- NXP, B.V.
- Leonardus Antonius Elisabeth van Gemert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,356,008
- Issue date May 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,337,134
- Issue date May 10, 2016
- Renesas Electronics Corporation
- Kenji Oyachi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump structure for stacked dies
- Patent number 9,312,225
- Issue date Apr 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional high surface area electrodes
- Patent number 9,177,933
- Issue date Nov 3, 2015
- California Institute of Technology
- Muhammad Mujeeb-U-Rahman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stackable molded microelectronic packages
- Patent number 9,123,664
- Issue date Sep 1, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including unitary supports
- Patent number 9,087,729
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Sang-Oh Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrates having pillars and related methods
- Patent number 8,866,311
- Issue date Oct 21, 2014
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level package device having solder bump assemblies that inclu...
- Patent number 8,643,150
- Issue date Feb 4, 2014
- Maxim Integrated Products, Inc.
- Yong L. Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microspring structures adapted for target device cooling
- Patent number 8,525,353
- Issue date Sep 3, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bump structure having tapered sidewalls for stack...
- Patent number 8,513,119
- Issue date Aug 20, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable molded microelectronic packages
- Patent number 8,482,111
- Issue date Jul 9, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack arrest vias for IC devices
- Patent number 8,304,867
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Robert Fabian McCarthy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180315726
- Publication date Nov 1, 2018
- LAPIS SEMICONDUCTOR CO., LTD.
- HIROKAZU SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMP OF SEMICONDUCTOR PACKAGE
- Publication number 20180174990
- Publication date Jun 21, 2018
- SMART MODULAR TECHNOLOGIES LX S.A.R.L
- Bum Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180040579
- Publication date Feb 8, 2018
- LAPIS SEMICONDUCTOR CO., LTD.
- HIROKAZU SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...
- Publication number 20180019228
- Publication date Jan 18, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20170365571
- Publication date Dec 21, 2017
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170092610
- Publication date Mar 30, 2017
- LAPIS SEMICONDUCTOR CO., LTD.
- HIROKAZU SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS
- Publication number 20170040277
- Publication date Feb 9, 2017
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160020195
- Publication date Jan 21, 2016
- Siliconware Pricision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...
- Publication number 20150287687
- Publication date Oct 8, 2015
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT
- Publication number 20150279803
- Publication date Oct 1, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STUD STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20150262954
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS NICKEL BUMP OF DIE PAD AND MANUFACTURING METHOD THEREOF
- Publication number 20150235978
- Publication date Aug 20, 2015
- AFLASH TECHNOLOGY CO., LTD.
- Ta-Lun Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODES
- Publication number 20150187718
- Publication date Jul 2, 2015
- California Institute of Technology
- Muhammad Mujeeb-U-Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS HAVING HEAT CONDUCTIVE LAYER WITH VIAS
- Publication number 20150179557
- Publication date Jun 25, 2015
- International Business Machines Corporation
- Kenneth J. Goodnow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MOLDED MICROELECTRONIC PACKAGES
- Publication number 20150084188
- Publication date Mar 26, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Electrode, Board Which Has Bump Electrodes, and Method for Man...
- Publication number 20150061129
- Publication date Mar 5, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING UNITARY SUPPORTS
- Publication number 20150041973
- Publication date Feb 12, 2015
- Samsung Electronics Co., Ltd.
- Sang-Oh PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140353822
- Publication date Dec 4, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenji OYACHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FABRICATION OF THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODES
- Publication number 20140167257
- Publication date Jun 19, 2014
- California Institute of Technology
- Muhammad Mujeeb-U-Rahman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140145327
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Hyung-Jun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATES HAVING PILLARS AND RELATED METHODS
- Publication number 20140084475
- Publication date Mar 27, 2014
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MOLDED MICROELECTRONIC PACKAGES
- Publication number 20140008790
- Publication date Jan 9, 2014
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Stacked Dies
- Publication number 20130299992
- Publication date Nov 14, 2013
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microspring Structures Adapted for Target Device Cooling
- Publication number 20130154127
- Publication date Jun 20, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120299197
- Publication date Nov 29, 2012
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK ARREST VIAS FOR IC DEVICES
- Publication number 20120104604
- Publication date May 3, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Robert Fabian McCarthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MOLDED MICROELECTRONIC PACKAGES
- Publication number 20120013000
- Publication date Jan 19, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100201001
- Publication date Aug 12, 2010
- SEIKO EPSON CORPORATION
- Tatsuhiko ASAKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tall and fine pitch interconnects

Semiconductor device and semiconductor device manufacturing method

Electrode for a semiconductor device of a ball grid array (BGA) type

Fan out semiconductor device including a plurality of semiconductor...

Stackable molded microelectronic packages

Semiconductor structures including carrier wafers and attached devi...

Tall and fine pitch interconnects

Convection optimization for mixed feature electroplating

Semiconductor device and semiconductor device manufacturing method

Semiconductor structure and manufacturing method thereof

Method for forming bump of semiconductor package

Semiconductor device having conductive vias

Semiconductor device and semiconductor device manufacturing method

Semiconductor packages

Stackable molded microelectronic packages

Semiconductor structures including carrier wafers and methods of us...

Semiconductor structure and manufacturing method thereof

Die interconnect

Semiconductor package and fabrication method thereof

Semiconductor device

Bump structure for stacked dies

Three-dimensional high surface area electrodes

Stackable molded microelectronic packages

Semiconductor devices including unitary supports

Semiconductor package substrates having pillars and related methods

Wafer-level package device having solder bump assemblies that inclu...

Microspring structures adapted for target device cooling

Method of forming bump structure having tapered sidewalls for stack...

Stackable molded microelectronic packages

Crack arrest vias for IC devices

Patents Applicationslast 30 patents

TALL AND FINE PITCH INTERCONNECTS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD FOR FORMING BUMP OF SEMICONDUCTOR PACKAGE

Tall and Fine Pitch Interconnects

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF US...

DIE INTERCONNECT

SOLDER STUD STRUCTURE AND METHOD OF FABRICATING THE SAME

ELECTROLESS NICKEL BUMP OF DIE PAD AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODES

SEMICONDUCTOR CHIPS HAVING HEAT CONDUCTIVE LAYER WITH VIAS

STACKABLE MOLDED MICROELECTRONIC PACKAGES

Bump Electrode, Board Which Has Bump Electrodes, and Method for Man...

SEMICONDUCTOR DEVICES INCLUDING UNITARY SUPPORTS

SEMICONDUCTOR DEVICE

FABRICATION OF THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE SUBSTRATES HAVING PILLARS AND RELATED METHODS

STACKABLE MOLDED MICROELECTRONIC PACKAGES

Bump Structure for Stacked Dies

Microspring Structures Adapted for Target Device Cooling

SEMICONDUCTOR PACKAGES

CRACK ARREST VIAS FOR IC DEVICES

STACKABLE MOLDED MICROELECTRONIC PACKAGES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE