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H01L2224/37005

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37005Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method for semiconductor device
- Patent number 12,062,634
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current shunt with reduced temperature relative to voltage drop
- Patent number 11,810,888
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Andreas Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal clip with a solder volume balan...
- Patent number 11,769,748
- Issue date Sep 26, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor package with pin fit leads
- Patent number 11,652,078
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal clip with solder volume balancing reservoir
- Patent number 11,545,459
- Issue date Jan 3, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,274
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided chip stack assembly
- Patent number 11,211,373
- Issue date Dec 28, 2021
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,337,129
- Issue date May 10, 2016
- Rohm Co., Ltd.
- Koji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CLIP
- Publication number 20250105199
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Georgio El-Zammar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATIONS FOR SEMICONDUCTOR POWER DEVICES
- Publication number 20250081579
- Publication date Mar 6, 2025
- Wolfspeed, Inc.
- Jonathan Van Buskirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...
- Publication number 20250014972
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...
- Publication number 20240332133
- Publication date Oct 3, 2024
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240332144
- Publication date Oct 3, 2024
- NEXPERIA B.V.
- Hiu Hay Nichole Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...
- Publication number 20240312880
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Yusuke KUSAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...
- Publication number 20240312882
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Junqing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANU...
- Publication number 20240250005
- Publication date Jul 25, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- LIMIN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213208
- Publication date Jun 27, 2024
- Power Master Semiconductor Co., Ltd.
- Taekkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240153904
- Publication date May 9, 2024
- Fuji Electric Co., Ltd.
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240038715
- Publication date Feb 1, 2024
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUBSTRATE ASSEMBLY WITH REDUCED WARPAGE
- Publication number 20240021568
- Publication date Jan 18, 2024
- LITTELFUSE, INC.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
- Publication number 20230335530
- Publication date Oct 19, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230317672
- Publication date Oct 5, 2023
- Kabushiki Kaisha Toshiba
- Takeyuki SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE B...
- Publication number 20230154883
- Publication date May 18, 2023
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A METAL CLIP WITH A SOLDER VOLUME BALAN...
- Publication number 20230094794
- Publication date Mar 30, 2023
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230092121
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS
- Publication number 20220336401
- Publication date Oct 20, 2022
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20220302071
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP WITH SOLDER VOLUME BALANCING RESERVOIR
- Publication number 20220238475
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP INTERCONNECT WITH MICRO CONTACT HEADS
- Publication number 20220181290
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Emmanuel Silvestre RAMOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND SEMICONDUCTOR MODULE
- Publication number 20210288016
- Publication date Sep 16, 2021
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210202429
- Publication date Jul 1, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291828
- Publication date Oct 2, 2014
- Rohm Co., Ltd.
- Koji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power substrate assembly with reduced warpage

Semiconductor device and production method for semiconductor device

Current shunt with reduced temperature relative to voltage drop

Semiconductor device having a metal clip with a solder volume balan...

Additive manufacturing of a frontside or backside interconnect of a...

High voltage semiconductor package with pin fit leads

Metal clip with solder volume balancing reservoir

Electronic module

Double-sided chip stack assembly

Method for electrically contacting a component by galvanic connecti...

Power module and method of manufacturing power module

Semiconductor module package and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

CLIP

POWER MODULE AND POWER CONVERSION APPARATUS

METALLIZATIONS FOR SEMICONDUCTOR POWER DEVICES

PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...

CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...

CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

POWER SUBSTRATE ASSEMBLY WITH REDUCED WARPAGE

MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE B...

SEMICONDUCTOR DEVICE HAVING A METAL CLIP WITH A SOLDER VOLUME BALAN...

SEMICONDUCTOR DEVICE

HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

METAL CLIP WITH SOLDER VOLUME BALANCING RESERVOIR

CLIP INTERCONNECT WITH MICRO CONTACT HEADS

WIRING STRUCTURE AND SEMICONDUCTOR MODULE

ELECTRONIC MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME