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H01L2224/45005

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45005Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Encapsulating a bonded wire with low profile encapsulation
- Patent number 10,946,658
- Issue date Mar 16, 2021
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding technique for integrated circuit board connections
- Patent number 10,600,756
- Issue date Mar 24, 2020
- United States of America, as represented by the Secretary of the Navy
- Evan A. Aanerud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire and method for manufacturing the same
- Patent number 10,483,130
- Issue date Nov 19, 2019
- KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD.
- Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonding component
- Patent number 10,147,701
- Issue date Dec 4, 2018
- KYOCERA Corporation
- Hidekazu Shigeyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Pillar structure and manufacturing method thereof
- Patent number 10,121,757
- Issue date Nov 6, 2018
- Unimicron Technology Corp.
- Cheng-Jui Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,032,741
- Issue date Jul 24, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 9,812,421
- Issue date Nov 7, 2017
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for production
- Patent number 9,754,912
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
- Patent number 9,059,003
- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413062
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Jen-Hao PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20240404931
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Hyejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...
- Publication number 20240332133
- Publication date Oct 3, 2024
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240332144
- Publication date Oct 3, 2024
- NEXPERIA B.V.
- Hiu Hay Nichole Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC MODULE AND METHOD FOR MANUFACTURING IC MODULE
- Publication number 20240290747
- Publication date Aug 29, 2024
- TOPPAN Holdings Inc.
- Shinji KANEKO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240219630
- Publication date Jul 4, 2024
- Shanghai Xizhi Technology Co., Ltd.
- Yichen SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SOLDERABLE POWER PAD
- Publication number 20240194580
- Publication date Jun 13, 2024
- INFINEON TECHNOLOGIES AG
- Susanne Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE
- Publication number 20240170291
- Publication date May 23, 2024
- HAESUNG DS CO., LTD.
- Jong Hoe Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...
- Publication number 20240153859
- Publication date May 9, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240145332
- Publication date May 2, 2024
- Hitachi Energy Ltd
- Niko PAVLICEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240128154
- Publication date Apr 18, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AI WIRING MATERIAL
- Publication number 20240105668
- Publication date Mar 28, 2024
- NIPPON MICROMETAL CORPORATION
- Yuto KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20230282613
- Publication date Sep 7, 2023
- SHINKAWA LTD.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AL BONDING WIRE
- Publication number 20230146315
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE
- Publication number 20230105851
- Publication date Apr 6, 2023
- NIPPON MICROMETAL CORPORATION
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210280553
- Publication date Sep 9, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200185293
- Publication date Jun 11, 2020
- Stefan Schmalzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulating a Bonded Wire with Low Profile Encapsulation
- Publication number 20200139705
- Publication date May 7, 2020
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
COAXIAL WIRE
- Publication number 20190385969
- Publication date Dec 19, 2019
- The Charles Stark Draper Laboratory, Inc.
- Caprice Gray Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
WIRE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180366345
- Publication date Dec 20, 2018
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Kun HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180108629
- Publication date Apr 19, 2018
- RENESAS ELECTRONICS CORPORATION
- Kentaro YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION
- Publication number 20180047697
- Publication date Feb 15, 2018
- Pac Tech - Packaging Technologies GmbH
- Heinrich Lüdeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE BONDING COMPONENT
- Publication number 20180019224
- Publication date Jan 18, 2018
- Kyocera Corporation
- Hidekazu Shigeyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170323864
- Publication date Nov 9, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170110431
- Publication date Apr 20, 2017
- Unimicron Technology Corp.
- Cheng-Jui Chang
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Palladium-coated copper bonding wire and method for manufacturing same

Power semiconductor chip, method for producing a power semiconducto...

Bonding wire for semiconductor devices

Encapsulating a bonded wire with low profile encapsulation

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Wire bonding technique for integrated circuit board connections

Bonding wire for semiconductor device

Wire and method for manufacturing the same

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Wedge bonding component

Bonding wire for semiconductor device

Pillar structure and manufacturing method thereof

Bonding wire for semiconductor device

Bonding wire for semiconductor devices

Electronic device and method for production

Power semiconductor device, method of manufacturing the device and...

Patents Applicationslast 30 patents

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

PACKAGE STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

IC MODULE AND METHOD FOR MANUFACTURING IC MODULE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR DEVICE WITH SOLDERABLE POWER PAD

PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE

WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...

AI WIRING MATERIAL

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

AL BONDING WIRE

COPPER BONDING WIRE

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME

Semiconductor Package Having a Laser-Activatable Mold Compound

Encapsulating a Bonded Wire with Low Profile Encapsulation

COAXIAL WIRE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

WIRE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

WEDGE BONDING COMPONENT

BONDING WIRE FOR SEMICONDUCTOR DEVICE

PILLAR STRUCTURE AND MANUFACTURING METHOD THEREOF