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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/1011
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Patents Grants
last 30 patents
Information
Patent Grant
Method for manufacturing electronic device
Patent number
12,368,079
Issue date
Jul 22, 2025
Innolux Corporation
Cheng-Chi Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package comprising semiconductor chip with stepped po...
Patent number
12,362,318
Issue date
Jul 15, 2025
Samsung Electronics Co., Ltd.
Seunghyun Baik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modular construction of hybrid-bonded semiconductor die assemblies...
Patent number
12,278,202
Issue date
Apr 15, 2025
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with logic circuits and memor...
Patent number
12,183,699
Issue date
Dec 31, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,113,040
Issue date
Oct 8, 2024
Mitsubishi Electric Corporation
Tomoyuki Asada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
Patent number
11,626,378
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Hsien-Wei Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
Patent number
11,031,363
Issue date
Jun 8, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Light-emitting/receiving device and light-detecting method
Patent number
10,638,581
Issue date
Apr 28, 2020
Asahi Kasei Microdevices Corporation
Yuta Takagi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
Patent number
10,497,660
Issue date
Dec 3, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Deformable closed-loop multi-layered microelectronic device
Patent number
10,170,449
Issue date
Jan 1, 2019
International Business Machines Corporation
Bucknell C. Webb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
Patent number
9,673,176
Issue date
Jun 6, 2017
International Business Machines Corporation
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
Patent number
9,666,563
Issue date
May 30, 2017
International Business Machines Corporation
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
Patent number
9,653,431
Issue date
May 16, 2017
International Business Machines Corporation
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
Patent number
9,653,432
Issue date
May 16, 2017
International Business Machines Corporation
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a substrate and input and output electr...
Patent number
9,543,281
Issue date
Jan 10, 2017
Kabushiki Kaisha Toyota Jidoshokki
Kazuyoshi Kontani
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
Patent number
9,515,051
Issue date
Dec 6, 2016
International Business Machines Corporation
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having overhang portion
Patent number
9,281,267
Issue date
Mar 8, 2016
SK Hynix Inc.
Yong Tae Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Escape routes
Patent number
9,171,809
Issue date
Oct 27, 2015
Flextronics AP, LLC
Omar Garcia Lopez
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Embedded memory and dedicated processor structure within an integra...
Patent number
8,874,837
Issue date
Oct 28, 2014
Xilinx, Inc.
Christopher E. Neely
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
Publication number
20250239548
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yung Lin Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE
Publication number
20250133779
Publication date
Apr 24, 2025
International Business Machines Corporation
Adinath Shantinath Narasgond
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250062302
Publication date
Feb 20, 2025
Samsung Electronics Co., Ltd.
Junghoon KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...
Publication number
20250015036
Publication date
Jan 9, 2025
LINGSEN PRECISION INDUSTRIES, LTD.
Yu-Chia CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
Publication number
20240421115
Publication date
Dec 19, 2024
Taiwan Semiconductor Manufacturing Company Limited
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
Publication number
20240387184
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yan-Yu CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
Publication number
20240379489
Publication date
Nov 14, 2024
SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
SHUN-HSING LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME
Publication number
20240297087
Publication date
Sep 5, 2024
Taiwan Semiconductor Manufacturing Company Limited
Sheng-Kai CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...
Publication number
20240290687
Publication date
Aug 29, 2024
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS
Publication number
20240194548
Publication date
Jun 13, 2024
Intel Corporation
Kristof Darmawikarta
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240128179
Publication date
Apr 18, 2024
Unimicron Technology Corp.
Jyun-Hong CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240128148
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chang-Jung Hsueh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
Publication number
20240096848
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Publication number
20240071840
Publication date
Feb 29, 2024
InnoLux Corporation
Cheng-Chi WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240063160
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
Publication number
20240047297
Publication date
Feb 8, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240030121
Publication date
Jan 25, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20240030176
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
Ji-Yong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACK PACKAGE INCLUDING SEMICONDUCTOR DIES AND ENCAPSULANT
Publication number
20240014175
Publication date
Jan 11, 2024
SK HYNIX INC.
Kyung Beom SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...
Publication number
20230395545
Publication date
Dec 7, 2023
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES
Publication number
20230395438
Publication date
Dec 7, 2023
Western Digital Technologies, Inc.
Nagesh Vodrahalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20230369174
Publication date
Nov 16, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Miaomiao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230317657
Publication date
Oct 5, 2023
Samsung Electronics Co., Ltd.
Wonil SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREFOR
Publication number
20230307409
Publication date
Sep 28, 2023
Sony Semiconductor Solutions Corporation
SHOGO ONO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
Publication number
20230282604
Publication date
Sep 7, 2023
MEDIATEK INC.
Ta-Jen Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DIES BONDED TO LOGIC DIES AND ASSOCIATED SYSTE...
Publication number
20230282627
Publication date
Sep 7, 2023
Micron Technology, Inc.
Kunal R. Parekh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FAN-OUT WATER-LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD TH...
Publication number
20230282531
Publication date
Sep 7, 2023
JCET Advanced Packaging Co., LTD.
XIA XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURES
Publication number
20230268300
Publication date
Aug 24, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20230260866
Publication date
Aug 17, 2023
MEDIATEK INC.
Yin-Fa CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Publication number
20230207392
Publication date
Jun 29, 2023
Rohm Co., Ltd.
Shingo OTA
H01 - BASIC ELECTRIC ELEMENTS