suitable for fluid transfer from the MEMS out of the package or vice-versa

Industry

CPC
B81B7/0061

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0061suitable for fluid transfer from the MEMS out of the package or vice-versa

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microphone package for epoxy overflow protection guard ring in cavi...
- Patent number 12,200,418
- Issue date Jan 14, 2025
- Knowles Electronics, LLC
- Shane Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 12,187,603
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic sensors with sensor die in package structure cavity
- Patent number 12,187,601
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Barry Jon Male
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cover member for electronic device, package, electronic device, and...
- Patent number 12,187,602
- Issue date Jan 7, 2025
- Kyocera Corporation
- Sho Yamasaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Virtual valve in a MEMS-based cooling system
- Patent number 12,181,077
- Issue date Dec 31, 2024
- Frore Systems Inc.
- Vikram Mukundan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical microphone having a robust backplate
- Patent number 12,116,269
- Issue date Oct 15, 2024
- TDK Corporation
- Anton Leidl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acoustic package structure and covering structure
- Patent number 12,063,470
- Issue date Aug 13, 2024
- xMEMS Labs, Inc.
- Chao-Yu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ingress protection mechanism
- Patent number 12,035,092
- Issue date Jul 9, 2024
- GM CRUISE HOLDINGS LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Techniques for alternate pressure equalization of a sensor
- Patent number 12,013,282
- Issue date Jun 18, 2024
- Invensense, Inc.
- Jeremy Parker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic cavities for on-chip layering and sealing of separation arrays
- Patent number 11,992,837
- Issue date May 28, 2024
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure designs for MEMS-based active cooling
- Patent number 11,956,921
- Issue date Apr 9, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,915,924
- Issue date Feb 27, 2024
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capless semiconductor package with a micro-electromechanical system...
- Patent number 11,897,763
- Issue date Feb 13, 2024
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 11,885,689
- Issue date Jan 30, 2024
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone device
- Patent number 11,877,107
- Issue date Jan 16, 2024
- Yamaha Corporation
- Akihiro Sonogi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor
- Patent number 11,810,863
- Issue date Nov 7, 2023
- TDK TAIWAN CORP.
- An-Ping Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro mechanical device with vibration sensor and micro-ele...
- Patent number 11,800,298
- Issue date Oct 24, 2023
- Merry Electronics(Shenzhen) Co., Ltd.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with particle filter and method of manufacture
- Patent number 11,787,689
- Issue date Oct 17, 2023
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures
- Patent number 11,736,866
- Issue date Aug 22, 2023
- Cirrus Logic Inc.
- Rkia Achehboune
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package with ingress protection
- Patent number 11,662,236
- Issue date May 30, 2023
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Particle filter for MEMS device
- Patent number 11,649,162
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical microphone
- Patent number 11,622,183
- Issue date Apr 4, 2023
- STMicroelectronics S.r.l.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic cavities for on-chip layering and sealing of separation arrays
- Patent number 11,612,889
- Issue date Mar 28, 2023
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package
- Patent number 11,604,084
- Issue date Mar 14, 2023
- Analog Devices, Inc.
- David Frank Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device with manifold
- Patent number 11,597,646
- Issue date Mar 7, 2023
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 11,575,995
- Issue date Feb 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 11,572,269
- Issue date Feb 7, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,535,509
- Issue date Dec 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DIRECTIONAL ACOUSTIC SENSOR DEVICES
- Publication number 20250033953
- Publication date Jan 30, 2025
- Soundskrit Inc.
- Sahil Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE AND MICROELECTROMECHANICAL LOUDSPEAKER
- Publication number 20250019228
- Publication date Jan 16, 2025
- ROBERT BOSCH GmbH
- Maximilian Sommer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE
- Publication number 20250016508
- Publication date Jan 9, 2025
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Xingfu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR OPERATING A MEMS DEVICE
- Publication number 20240425361
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Björn Oliver Eversmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
System And Method For Generating Fluid Flow
- Publication number 20240409399
- Publication date Dec 12, 2024
- Sonicedge Ltd.
- Mordehai Margalit
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP
- Publication number 20240409396
- Publication date Dec 12, 2024
- Canon Kabushiki Kaisha
- RYOTARO MURAKAMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOUND PRODUCING PACKAGE AND COVERING STRUCTURE
- Publication number 20240365048
- Publication date Oct 31, 2024
- xMEMS Labs, Inc.
- Chao-Yu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANCHOR AND CAVITY CONFIGURATION FOR MEMS-BASED COOLING SYSTEMS
- Publication number 20240351862
- Publication date Oct 24, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC CIGARETTE
- Publication number 20240327202
- Publication date Oct 3, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Jinyang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ULTRASONIC TRANSDUCER
- Publication number 20240284121
- Publication date Aug 22, 2024
- Murata Manufacturing Co., Ltd.
- Shinsuke IKEUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
- Publication number 20240270567
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Hiroshi MATSUBARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC PACKAGE STRUCTURE AND COVERING STRUCTURE
- Publication number 20240276139
- Publication date Aug 15, 2024
- xMEMS Labs, Inc.
- Chao-Yu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MA...
- Publication number 20240253978
- Publication date Aug 1, 2024
- KYOCERA CORPORATION
- Koutarou NAKAMOTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL PRINTED ARTICLES AND METHODS OF MANUFACTURE
- Publication number 20240164717
- Publication date May 23, 2024
- Arizona Board of Regents on behalf of The University of Arizona
- TUCKER STUART
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20240118141
- Publication date Apr 11, 2024
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS, METHOD OF MANUFACTURING AN MEMS AND METHOD OF CONFIGURING AN...
- Publication number 20240092633
- Publication date Mar 21, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Anton MELNIKOV
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INGRESS PROTECTION MECHANISM
- Publication number 20230396908
- Publication date Dec 7, 2023
- GM Cruise Holdings LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER
- Publication number 20230345182
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Takanori Yasuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314193
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Vijay Parkhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20230257257
- Publication date Aug 17, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...
- Publication number 20230242394
- Publication date Aug 3, 2023
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Achim Bittner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Making a MEMS Semiconductor Package
- Publication number 20230192478
- Publication date Jun 22, 2023
- UTAC Headquarters Pte. Ltd.
- Phongsak Sawasdee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENVIRONMENTAL SENSOR AND PREPARATION METHOD THEREFOR
- Publication number 20230192477
- Publication date Jun 22, 2023
- Multidimension Technology Co., Ltd
- Insik JIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS
- Publication number 20230191398
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS FLOW MICROPHONE WITH EQUAL ACOUSTIC PATH LENGTHS
- Publication number 20230097786
- Publication date Mar 30, 2023
- Soundskrit Inc.
- Stephane Leahy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT
- Publication number 20230030627
- Publication date Feb 2, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL DEVICE
- Publication number 20220408197
- Publication date Dec 22, 2022
- Merry Electronics(Shenzhen) Co., Ltd.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
- Publication number 20220396474
- Publication date Dec 15, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- B81 - MICRO-STRUCTURAL TECHNOLOGY

suitable for fluid transfer from the MEMS out of the package or vice-versa

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microphone package for epoxy overflow protection guard ring in cavi...

Semiconductor package using a polymer substrate

Electronic sensors with sensor die in package structure cavity

Cover member for electronic device, package, electronic device, and...

Virtual valve in a MEMS-based cooling system

Microelectromechanical microphone having a robust backplate

Acoustic package structure and covering structure

Ingress protection mechanism

Techniques for alternate pressure equalization of a sensor

Fluidic cavities for on-chip layering and sealing of separation arrays

Support structure designs for MEMS-based active cooling

Semiconductor device and method for manufacturing the same

Capless semiconductor package with a micro-electromechanical system...

Wearable device with combined sensing capabilities

Microphone device

Support structure for MEMS device with particle filter

Sensor

Micro-electro mechanical device with vibration sensor and micro-ele...

MEMS device with particle filter and method of manufacture

Semiconductor structures

Sensor package with ingress protection

Particle filter for MEMS device

Microelectromechanical microphone

Fluidic cavities for on-chip layering and sealing of separation arrays

Sensor package

Microfluidic device with manifold

Packaged die and assembling method

Semiconductor package device and method for manufacturing the same

Semiconductor package using a polymer substrate

Semiconductor package structure and method for manufacturing the same

Patents Applicationslast 30 patents

MULTI-DIRECTIONAL ACOUSTIC SENSOR DEVICES

MICROELECTROMECHANICAL DEVICE AND MICROELECTROMECHANICAL LOUDSPEAKER

MEMS MICROPHONE

MEMS DEVICE AND METHOD FOR OPERATING A MEMS DEVICE

System And Method For Generating Fluid Flow

LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP

SOUND PRODUCING PACKAGE AND COVERING STRUCTURE

ANCHOR AND CAVITY CONFIGURATION FOR MEMS-BASED COOLING SYSTEMS

ELECTRONIC CIGARETTE

ULTRASONIC TRANSDUCER

ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME

ACOUSTIC PACKAGE STRUCTURE AND COVERING STRUCTURE

WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MA...

THREE-DIMENSIONAL PRINTED ARTICLES AND METHODS OF MANUFACTURE

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

MEMS, METHOD OF MANUFACTURING AN MEMS AND METHOD OF CONFIGURING AN...

INGRESS PROTECTION MECHANISM

PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...

Semiconductor Device and Method of Making a MEMS Semiconductor Package

MEMS ENVIRONMENTAL SENSOR AND PREPARATION METHOD THEREFOR

FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS

MEMS FLOW MICROPHONE WITH EQUAL ACOUSTIC PATH LENGTHS

SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT

MICRO-ELECTRO MECHANICAL DEVICE

SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER