suitable for fluid transfer from the MEMS out of the package or vice-versa

Industry

CPC
B81B7/0061

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0061suitable for fluid transfer from the MEMS out of the package or vice-versa

Industries

Patents Grantslast 30 patents

Information Patent Grant
Support structure designs for MEMS-based active cooling
- Patent number 11,956,921
- Issue date Apr 9, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,915,924
- Issue date Feb 27, 2024
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capless semiconductor package with a micro-electromechanical system...
- Patent number 11,897,763
- Issue date Feb 13, 2024
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 11,885,689
- Issue date Jan 30, 2024
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone device
- Patent number 11,877,107
- Issue date Jan 16, 2024
- Yamaha Corporation
- Akihiro Sonogi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor
- Patent number 11,810,863
- Issue date Nov 7, 2023
- TDK TAIWAN CORP.
- An-Ping Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro mechanical device with vibration sensor and micro-ele...
- Patent number 11,800,298
- Issue date Oct 24, 2023
- Merry Electronics(Shenzhen) Co., Ltd.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with particle filter and method of manufacture
- Patent number 11,787,689
- Issue date Oct 17, 2023
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures
- Patent number 11,736,866
- Issue date Aug 22, 2023
- Cirrus Logic Inc.
- Rkia Achehboune
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package with ingress protection
- Patent number 11,662,236
- Issue date May 30, 2023
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Particle filter for MEMS device
- Patent number 11,649,162
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical microphone
- Patent number 11,622,183
- Issue date Apr 4, 2023
- STMicroelectronics S.r.l.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic cavities for on-chip layering and sealing of separation arrays
- Patent number 11,612,889
- Issue date Mar 28, 2023
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package
- Patent number 11,604,084
- Issue date Mar 14, 2023
- Analog Devices, Inc.
- David Frank Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device with manifold
- Patent number 11,597,646
- Issue date Mar 7, 2023
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 11,575,995
- Issue date Feb 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 11,572,269
- Issue date Feb 7, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,535,509
- Issue date Dec 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,524,890
- Issue date Dec 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor, MEMS sensor system and method for producing a MEMS sen...
- Patent number 11,492,249
- Issue date Nov 8, 2022
- Infineon Technologies AG
- David Tumpold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Techniques for alternate pressure equalization of a sensor
- Patent number 11,467,025
- Issue date Oct 11, 2022
- Invensense, Inc.
- Jeremy Parker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and a manufacturing method thereof
- Patent number 11,388,525
- Issue date Jul 12, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for protecting components against liquids and for ventilatin...
- Patent number 11,370,654
- Issue date Jun 28, 2022
- Robert Bosch GmbH
- Sebastian Schuler-Watkins
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 11,366,031
- Issue date Jun 21, 2022
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Analyte sensor package with dispense chemistry and microfluidic cap
- Patent number 11,351,548
- Issue date Jun 7, 2022
- Maxim Integrated Products, Inc.
- Joy T. Jones
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding manufacturing method
- Patent number 11,352,251
- Issue date Jun 7, 2022
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic component package
- Patent number 11,331,663
- Issue date May 17, 2022
- The Regents of the University of California
- Mark Bachman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waterproof microphone and associated packing techniques
- Patent number 11,312,620
- Issue date Apr 26, 2022
- Kathirgamasundaram Sooriakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20240118141
- Publication date Apr 11, 2024
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS, METHOD OF MANUFACTURING AN MEMS AND METHOD OF CONFIGURING AN...
- Publication number 20240092633
- Publication date Mar 21, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Anton MELNIKOV
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INGRESS PROTECTION MECHANISM
- Publication number 20230396908
- Publication date Dec 7, 2023
- GM Cruise Holdings LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER
- Publication number 20230345182
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Takanori Yasuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314193
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Vijay Parkhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20230257257
- Publication date Aug 17, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...
- Publication number 20230242394
- Publication date Aug 3, 2023
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Achim Bittner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Making a MEMS Semiconductor Package
- Publication number 20230192478
- Publication date Jun 22, 2023
- UTAC Headquarters Pte. Ltd.
- Phongsak Sawasdee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENVIRONMENTAL SENSOR AND PREPARATION METHOD THEREFOR
- Publication number 20230192477
- Publication date Jun 22, 2023
- Multidimension Technology Co., Ltd
- Insik JIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS
- Publication number 20230191398
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS FLOW MICROPHONE WITH EQUAL ACOUSTIC PATH LENGTHS
- Publication number 20230097786
- Publication date Mar 30, 2023
- Soundskrit Inc.
- Stephane Leahy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT
- Publication number 20230030627
- Publication date Feb 2, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL DEVICE
- Publication number 20220408197
- Publication date Dec 22, 2022
- Merry Electronics(Shenzhen) Co., Ltd.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
- Publication number 20220396474
- Publication date Dec 15, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COVER MEMBER FOR ELECTRONIC DEVICE, PACKAGE, ELECTRONIC DEVICE, AND...
- Publication number 20220396475
- Publication date Dec 15, 2022
- KYOCERA CORPORATION
- Sho YAMASAKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TECHNIQUES FOR ALTERNATE PRESSURE EQUALIZATION OF A SENSOR
- Publication number 20220381605
- Publication date Dec 1, 2022
- InvenSense, Inc.
- Jeremy Parker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220353619
- Publication date Nov 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE
- Publication number 20220333958
- Publication date Oct 20, 2022
- Analog Devices, Inc.
- David Frank Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE PACKAGE FOR EPOXY OVERFLOW PROTECTION GUARD RING IN CAVI...
- Publication number 20220286766
- Publication date Sep 8, 2022
- KNOWLES ELECTRONICS, LLC
- Shane Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE SUBSTRATE, SENSOR MODULE HAVING THE SAME, AND SENSOR...
- Publication number 20220267142
- Publication date Aug 25, 2022
- TDK Corporation
- Kazutoshi TSUYUTANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIQUID-RESISTANT AIR INLET PASSIVE DEVICE AND METHODS OF MAKING SAME
- Publication number 20220212920
- Publication date Jul 7, 2022
- Kathirgamasundaram SOORIAKUMAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TILES HAVING MULTIPLE COOLING CELLS FOR MEMS-BASED COOLING
- Publication number 20220081284
- Publication date Mar 17, 2022
- Frore Systems Inc.
- Suryaprakash Ganti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURES
- Publication number 20220060835
- Publication date Feb 24, 2022
- Cirrus Logic International Semiconductor Ltd.
- Rkia ACHEHBOUNE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR
- Publication number 20210395077
- Publication date Dec 23, 2021
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL MICROPHONE HAVING A ROBUST BACKPLATE
- Publication number 20210331914
- Publication date Oct 28, 2021
- TDK Electronics AG
- Anton Leidl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged Die and Assembling Method
- Publication number 20210238028
- Publication date Aug 5, 2021
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER
- Publication number 20210238030
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL MICROPHONE
- Publication number 20210204049
- Publication date Jul 1, 2021
- STMicroelectronics S.r.l.
- Roberto BRIOSCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY

suitable for fluid transfer from the MEMS out of the package or vice-versa

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Support structure designs for MEMS-based active cooling

Semiconductor device and method for manufacturing the same

Capless semiconductor package with a micro-electromechanical system...

Wearable device with combined sensing capabilities

Microphone device

Support structure for MEMS device with particle filter

Sensor

Micro-electro mechanical device with vibration sensor and micro-ele...

MEMS device with particle filter and method of manufacture

Semiconductor structures

Sensor package with ingress protection

Particle filter for MEMS device

Microelectromechanical microphone

Fluidic cavities for on-chip layering and sealing of separation arrays

Sensor package

Microfluidic device with manifold

Packaged die and assembling method

Semiconductor package device and method for manufacturing the same

Semiconductor package using a polymer substrate

Semiconductor package structure and method for manufacturing the same

Semiconductor device packages and methods of manufacturing the same

MEMS sensor, MEMS sensor system and method for producing a MEMS sen...

Techniques for alternate pressure equalization of a sensor

MEMS microphone and a manufacturing method thereof

Device for protecting components against liquids and for ventilatin...

Semiconductor device and method for forming a semiconductor device

Analyte sensor package with dispense chemistry and microfluidic cap

Electronic device and corresponding manufacturing method

Microfluidic component package

Waterproof microphone and associated packing techniques

Patents Applicationslast 30 patents

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

MEMS, METHOD OF MANUFACTURING AN MEMS AND METHOD OF CONFIGURING AN...

INGRESS PROTECTION MECHANISM

PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...

Semiconductor Device and Method of Making a MEMS Semiconductor Package

MEMS ENVIRONMENTAL SENSOR AND PREPARATION METHOD THEREFOR

FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS

MEMS FLOW MICROPHONE WITH EQUAL ACOUSTIC PATH LENGTHS

SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT

MICRO-ELECTRO MECHANICAL DEVICE

SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER

COVER MEMBER FOR ELECTRONIC DEVICE, PACKAGE, ELECTRONIC DEVICE, AND...

TECHNIQUES FOR ALTERNATE PRESSURE EQUALIZATION OF A SENSOR

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SENSOR PACKAGE

MICROPHONE PACKAGE FOR EPOXY OVERFLOW PROTECTION GUARD RING IN CAVI...

SENSOR PACKAGE SUBSTRATE, SENSOR MODULE HAVING THE SAME, AND SENSOR...

LIQUID-RESISTANT AIR INLET PASSIVE DEVICE AND METHODS OF MAKING SAME

TILES HAVING MULTIPLE COOLING CELLS FOR MEMS-BASED COOLING

SEMICONDUCTOR STRUCTURES

WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR

MICROELECTROMECHANICAL MICROPHONE HAVING A ROBUST BACKPLATE

Packaged Die and Assembling Method

SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER

MICROELECTROMECHANICAL MICROPHONE