suitable for fluid transfer from the MEMS out of the package or vice-versa

Industry

CPC
B81C1/00309

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00309suitable for fluid transfer from the MEMS out of the package or vice-versa

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sensor package substrate, sensor module having the same, and sensor...
- Patent number 12,240,751
- Issue date Mar 4, 2025
- TDK Corporation
- Kazutoshi Tsuyutani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a plurality of sensor devices, and sensor device
- Patent number 12,195,330
- Issue date Jan 14, 2025
- Robert Bosch GmbH
- Daniel Haug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ingress protection mechanism
- Patent number 12,035,092
- Issue date Jul 9, 2024
- GM CRUISE HOLDINGS LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic cavities for on-chip layering and sealing of separation arrays
- Patent number 11,992,837
- Issue date May 28, 2024
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capless semiconductor package with a micro-electromechanical system...
- Patent number 11,897,763
- Issue date Feb 13, 2024
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional features formed in molded panel
- Patent number 11,807,523
- Issue date Nov 7, 2023
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with particle filter and method of manufacture
- Patent number 11,787,689
- Issue date Oct 17, 2023
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic cavities for on-chip layering and sealing of separation arrays
- Patent number 11,612,889
- Issue date Mar 28, 2023
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 11,575,995
- Issue date Feb 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,535,509
- Issue date Dec 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,524,890
- Issue date Dec 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor, MEMS sensor system and method for producing a MEMS sen...
- Patent number 11,492,249
- Issue date Nov 8, 2022
- Infineon Technologies AG
- David Tumpold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged pressure sensor device
- Patent number 11,427,464
- Issue date Aug 30, 2022
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and a manufacturing method thereof
- Patent number 11,388,525
- Issue date Jul 12, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulation of sensing device
- Patent number 11,358,861
- Issue date Jun 14, 2022
- INDIGO DIABETES NV
- Juan Sebastian Ordonez Orellana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Analyte sensor package with dispense chemistry and microfluidic cap
- Patent number 11,351,548
- Issue date Jun 7, 2022
- Maxim Integrated Products, Inc.
- Joy T. Jones
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic component package
- Patent number 11,331,663
- Issue date May 17, 2022
- The Regents of the University of California
- Mark Bachman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a thin filtering membrane and an acoustic...
- Patent number 11,317,219
- Issue date Apr 26, 2022
- STMicroelectronics S.r.l.
- Matteo Perletti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging for a MEMS transducer
- Patent number 11,252,513
- Issue date Feb 15, 2022
- Cirrus Logic, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method to create multilayer microfluidic chips using spin-on carbon...
- Patent number 11,192,101
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic cavities for on-chip layering and sealing of separation arrays
- Patent number 11,173,486
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional features formed in molded panel
- Patent number 11,148,942
- Issue date Oct 19, 2021
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor system, sensor arrangement, and assembly method using solder...
- Patent number 11,146,893
- Issue date Oct 12, 2021
- TE CONNECTIVITY SOLUTIONS GmbH
- Predrag Drljaca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging for a MEMS transducer
- Patent number 11,146,894
- Issue date Oct 12, 2021
- Cirrus Logic, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a semiconductor die provided with a filter...
- Patent number 11,128,958
- Issue date Sep 21, 2021
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a micromechanical sensor
- Patent number 11,111,137
- Issue date Sep 7, 2021
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and method of manufacturing the same
- Patent number 11,115,756
- Issue date Sep 7, 2021
- DB HITEK CO., LTD.
- Hyeok In Kwon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS acoustic pressure sensor device and method for making same
- Patent number 11,053,116
- Issue date Jul 6, 2021
- Pixart Imaging Incorporation
- Chuan-Wei Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic microelectromechanical sensors/devices and fabrication meth...
- Patent number 11,033,898
- Issue date Jun 15, 2021
- EZMEMS LTD.
- Tsvi Shmilovich
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with discharge path, and method for producing...
- Patent number 11,027,968
- Issue date Jun 8, 2021
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
System And Method For Generating Fluid Flow
- Publication number 20240409399
- Publication date Dec 12, 2024
- Sonicedge Ltd.
- Mordehai Margalit
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP
- Publication number 20240409396
- Publication date Dec 12, 2024
- Canon Kabushiki Kaisha
- RYOTARO MURAKAMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
- Publication number 20240270567
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Hiroshi MATSUBARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INGRESS PROTECTION MECHANISM
- Publication number 20230396908
- Publication date Dec 7, 2023
- GM Cruise Holdings LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314193
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Vijay Parkhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...
- Publication number 20230242394
- Publication date Aug 3, 2023
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Achim Bittner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Making a MEMS Semiconductor Package
- Publication number 20230192478
- Publication date Jun 22, 2023
- UTAC Headquarters Pte. Ltd.
- Phongsak Sawasdee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENVIRONMENTAL SENSOR AND PREPARATION METHOD THEREFOR
- Publication number 20230192477
- Publication date Jun 22, 2023
- Multidimension Technology Co., Ltd
- Insik JIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS
- Publication number 20230191398
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT
- Publication number 20230030627
- Publication date Feb 2, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
- Publication number 20220396474
- Publication date Dec 15, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220353619
- Publication date Nov 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE SUBSTRATE, SENSOR MODULE HAVING THE SAME, AND SENSOR...
- Publication number 20220267142
- Publication date Aug 25, 2022
- TDK Corporation
- Kazutoshi TSUYUTANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL
- Publication number 20220002149
- Publication date Jan 6, 2022
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR
- Publication number 20210395077
- Publication date Dec 23, 2021
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20210179423
- Publication date Jun 17, 2021
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS
- Publication number 20210146355
- Publication date May 20, 2021
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210147219
- Publication date May 20, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210130165
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH PARTICLE FILTER AND METHOD OF MANUFACTURE
- Publication number 20210114866
- Publication date Apr 22, 2021
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED PRESSURE SENSOR DEVICE
- Publication number 20210009405
- Publication date Jan 14, 2021
- NXP USA, Inc.
- Weng Foong YAP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200336842
- Publication date Oct 22, 2020
- DB HITEK CO., LTD.
- Hyeok In KWON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A MEMS TRANSDUCER
- Publication number 20200304921
- Publication date Sep 24, 2020
- Cirrus Logic International Semiconductor Ltd.
- Roberto BRIOSCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A MEMS TRANSDUCER
- Publication number 20200304922
- Publication date Sep 24, 2020
- Cirrus Logic International Semiconductor Ltd.
- Roberto BRIOSCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH DISCHARGE PATH, AND METHOD FOR PRODUCING...
- Publication number 20200299128
- Publication date Sep 24, 2020
- DENSO CORPORATION
- Megumi SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS
- Publication number 20200254446
- Publication date Aug 13, 2020
- International Business Machines Corporation
- Evan Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package, MEMS Microphone and Method of Manufacturing the MEMS...
- Publication number 20200245076
- Publication date Jul 30, 2020
- SAE Magnetics (H.K.) Ltd.
- Koichi Shiozawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM STRUCTURE AND METHOD FOR FABRICATIN...
- Publication number 20200223687
- Publication date Jul 16, 2020
- United Microelectronics Corp.
- Yuan-Sheng LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY

suitable for fluid transfer from the MEMS out of the package or vice-versa

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sensor package substrate, sensor module having the same, and sensor...

Method for producing a plurality of sensor devices, and sensor device

Ingress protection mechanism

Fluidic cavities for on-chip layering and sealing of separation arrays

Capless semiconductor package with a micro-electromechanical system...

Three-dimensional features formed in molded panel

MEMS device with particle filter and method of manufacture

Fluidic cavities for on-chip layering and sealing of separation arrays

Semiconductor package device and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device packages and methods of manufacturing the same

MEMS sensor, MEMS sensor system and method for producing a MEMS sen...

Packaged pressure sensor device

MEMS microphone and a manufacturing method thereof

Encapsulation of sensing device

Analyte sensor package with dispense chemistry and microfluidic cap

Microfluidic component package

Method for manufacturing a thin filtering membrane and an acoustic...

Packaging for a MEMS transducer

Method to create multilayer microfluidic chips using spin-on carbon...

Fluidic cavities for on-chip layering and sealing of separation arrays

Three-dimensional features formed in molded panel

Sensor system, sensor arrangement, and assembly method using solder...

Packaging for a MEMS transducer

Method for manufacturing a semiconductor die provided with a filter...

Method for manufacturing a micromechanical sensor

MEMS microphone and method of manufacturing the same

MEMS acoustic pressure sensor device and method for making same

Fluidic microelectromechanical sensors/devices and fabrication meth...

Semiconductor device with discharge path, and method for producing...

Patents Applicationslast 30 patents

System And Method For Generating Fluid Flow

LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP

ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

INGRESS PROTECTION MECHANISM

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...

Semiconductor Device and Method of Making a MEMS Semiconductor Package

MEMS ENVIRONMENTAL SENSOR AND PREPARATION METHOD THEREFOR

FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS

SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT

SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SENSOR PACKAGE SUBSTRATE, SENSOR MODULE HAVING THE SAME, AND SENSOR...

THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL

WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

MEMS DEVICE WITH PARTICLE FILTER AND METHOD OF MANUFACTURE

PACKAGED PRESSURE SENSOR DEVICE

MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME

PACKAGING FOR A MEMS TRANSDUCER

PACKAGING FOR A MEMS TRANSDUCER

SEMICONDUCTOR DEVICE WITH DISCHARGE PATH, AND METHOD FOR PRODUCING...

FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS

MEMS Package, MEMS Microphone and Method of Manufacturing the MEMS...

MICRO-ELECTRO-MECHANICAL SYSTEM STRUCTURE AND METHOD FOR FABRICATIN...