Synchronous dynamic random access memory [SDRAM]

Industry

CPC
H01L2924/14361

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/14361Synchronous dynamic random access memory [SDRAM]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses and systems having ball grid arrays and associated micr...
- Patent number 11,942,404
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Matthew B. Leslie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring design method, wiring structure, and flip chip
- Patent number 11,887,923
- Issue date Jan 30, 2024
- NEXTVPU (SHANGHAI) CO., LTD.
- Aofeng Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FPGA device forming network-on-chip by using silicon connection layer
- Patent number 11,776,915
- Issue date Oct 3, 2023
- WUXI ESIONTECH CO., LTD.
- Jicong Fan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 11,605,584
- Issue date Mar 14, 2023
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,437,341
- Issue date Sep 6, 2022
- Renesas Electronics Corporation
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state storage device
- Patent number 11,201,100
- Issue date Dec 14, 2021
- Global Unichip Corporation
- Yu-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-rank high bandwidth memory (HBM) memory
- Patent number 11,189,338
- Issue date Nov 30, 2021
- Xilinx, Inc.
- Rafael C. Camarota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and methods of forming same
- Patent number 11,152,344
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for arranging through-silicon vias and pads...
- Patent number 11,081,467
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Tomohiro Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided memory module with channels aligned in opposition
- Patent number 10,804,243
- Issue date Oct 13, 2020
- Apple Inc.
- James D. Kelly
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 10,756,076
- Issue date Aug 25, 2020
- Samsung Electronics Co., Ltd.
- Yonghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing device
- Patent number 10,726,878
- Issue date Jul 28, 2020
- Renesas Electronics Corporation
- Takafumi Betsui
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package and methods of forming same
- Patent number 10,354,983
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided memory module with channels aligned in opposition
- Patent number 10,217,721
- Issue date Feb 26, 2019
- Apple Inc.
- James D. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,211,134
- Issue date Feb 19, 2019
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing device
- Patent number 10,020,028
- Issue date Jul 10, 2018
- Renesas Electronics Corporation
- Takafumi Betsui
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 9,852,966
- Issue date Dec 26, 2017
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing device
- Patent number 9,792,959
- Issue date Oct 17, 2017
- Renesas Electronics Corporation
- Takafumi Betsui
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package and methods of forming same
- Patent number 9,653,442
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 9,627,354
- Issue date Apr 18, 2017
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk polarity reversal and cancellation through substrate mate...
- Patent number 9,564,407
- Issue date Feb 7, 2017
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip integrated circuit package
- Patent number 9,406,649
- Issue date Aug 2, 2016
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-support for XFD packaging
- Patent number 9,123,555
- Issue date Sep 1, 2015
- Invensas Corporation
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip integrated circuit package
- Patent number 8,963,339
- Issue date Feb 24, 2015
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package on package structure
- Patent number 8,791,559
- Issue date Jul 29, 2014
- Samsung Electronics Co., Ltd.
- Yong-hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,788,738
- Issue date Jul 22, 2014
- Yoshiro Riho
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND CHIP
- Publication number 20240321828
- Publication date Sep 26, 2024
- ALi Corporation
- Liang-Cai Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240312893
- Publication date Sep 19, 2024
- MEDIATEK INC.
- Hui-Chi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS
- Publication number 20240213151
- Publication date Jun 27, 2024
- Western Digital Technologies, Inc.
- John T. Contreras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SID...
- Publication number 20240153821
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
- Publication number 20240145368
- Publication date May 2, 2024
- Intel Corporation
- Jackson Chung Peng KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...
- Publication number 20240120317
- Publication date Apr 11, 2024
- Western Digital Technologies, Inc.
- Cheng-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240113056
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20240079308
- Publication date Mar 7, 2024
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240069093
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Sehyun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...
- Publication number 20240038295
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Youngdo Um
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240032310
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240030072
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Mingi HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030145
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKED PROCESSING SYSTEMS
- Publication number 20230326905
- Publication date Oct 12, 2023
- Alibaba Group Holding Limited
- Dimin NIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230282604
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215799
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION
- Publication number 20230197595
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING M...
- Publication number 20230163114
- Publication date May 25, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING DESIGN METHOD, WIRING STRUCTURE, AND FLIP CHIP
- Publication number 20230154840
- Publication date May 18, 2023
- NextVPU (Shanghai) Co., Ltd.
- Aofeng Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FPGA DEVICE FORMING NETWORK-ON-CHIP BY USING SILICON CONNECTION LAYER
- Publication number 20220216156
- Publication date Jul 7, 2022
- WUXI ESIONTECH CO., LTD.
- Jicong FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233886
- Publication date Jul 29, 2021
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED MEMORY MODULE THAT CONSERVES MOTHERBOARD WIRING SPACE
- Publication number 20210183410
- Publication date Jun 17, 2021
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR ARRANGING THROUGH-SILICON VIAS AND PADS...
- Publication number 20200212008
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Tomohiro Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Methods of Forming Same
- Publication number 20190341376
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190244945
- Publication date Aug 8, 2019
- Samsung Electronics Co., Ltd.
- Yonghoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED MEMORY MODULE WITH CHANNELS ALIGNED IN OPPOSITION
- Publication number 20180323169
- Publication date Nov 8, 2018
- Apple Inc.
- James D. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...
- Publication number 20180182734
- Publication date Jun 28, 2018
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS

Synchronous dynamic random access memory [SDRAM]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatuses and systems having ball grid arrays and associated micr...

Wiring design method, wiring structure, and flip chip

FPGA device forming network-on-chip by using silicon connection layer

Semiconductor package

Semiconductor device

Solid-state storage device

Multi-rank high bandwidth memory (HBM) memory

Integrated circuit package and methods of forming same

Apparatuses and methods for arranging through-silicon vias and pads...

Dual-sided memory module with channels aligned in opposition

Semiconductor package

Data processing device

Integrated circuit package and methods of forming same

Dual-sided memory module with channels aligned in opposition

Semiconductor package

Data processing device

Semiconductor package

Data processing device

Integrated circuit package and methods of forming same

Semiconductor memory device

Crosstalk polarity reversal and cancellation through substrate mate...

Stacked multi-chip integrated circuit package

Co-support for XFD packaging

Stacked multi-chip integrated circuit package

Semiconductor package with package on package structure

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

INTEGRATED CIRCUIT STRUCTURE AND CHIP

ELECTRONIC DEVICE

TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS

SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SID...

ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE ASSEMBLY

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL STACKED PROCESSING SYSTEMS

SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE

SEMICONDUCTOR PACKAGE

MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION

THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING M...

WIRING DESIGN METHOD, WIRING STRUCTURE, AND FLIP CHIP

FPGA DEVICE FORMING NETWORK-ON-CHIP BY USING SILICON CONNECTION LAYER

SEMICONDUCTOR DEVICE

IMPROVED MEMORY MODULE THAT CONSERVES MOTHERBOARD WIRING SPACE

APPARATUSES AND METHODS FOR ARRANGING THROUGH-SILICON VIAS AND PADS...

Integrated Circuit Package and Methods of Forming Same

SEMICONDUCTOR PACKAGE

DUAL-SIDED MEMORY MODULE WITH CHANNELS ALIGNED IN OPPOSITION

METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...