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H01L2224/05181
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2224/05181
Tantalum [Ta] as principal constituent
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last 30 patents
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Semiconductor package
Patent number
12,368,119
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Minki Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacture
Patent number
12,362,261
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor devices and data storage systems including the same
Patent number
12,355,003
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Seungyoon Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multilayer stacking wafer bonding structure and method of manufactu...
Patent number
12,354,870
Issue date
Jul 8, 2025
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device, manufacturing method, solid state image senso...
Patent number
12,347,798
Issue date
Jul 1, 2025
Sony Group Corporation
Masaki Haneda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
12,347,731
Issue date
Jul 1, 2025
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
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Connector and method for forming the same
Patent number
12,300,645
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
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Display device
Patent number
12,295,225
Issue date
May 6, 2025
Samsung Display Co., Ltd.
Chungi You
H01 - BASIC ELECTRIC ELEMENTS
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Reworkable inter-substrate bond structure
Patent number
12,278,212
Issue date
Apr 15, 2025
The Boeing Company
Peter D. Brewer
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with composite conductive features and method...
Patent number
12,255,161
Issue date
Mar 18, 2025
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of forming the same
Patent number
12,237,282
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Huan Fu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with composite conductive features and method...
Patent number
12,218,087
Issue date
Feb 4, 2025
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and manufacturing method of semiconductor device
Patent number
12,191,266
Issue date
Jan 7, 2025
Kabushiki Kaisha Toshiba
Emiko Inoue
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor chip structure
Patent number
12,176,245
Issue date
Dec 24, 2024
Samsung Electronics Co., Ltd.
Sangjun Park
H01 - BASIC ELECTRIC ELEMENTS
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Process flow for fabrication of cap metal over top metal with sinte...
Patent number
12,159,846
Issue date
Dec 3, 2024
Texas Instruments Incorporated
Richard Allen Faust
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of fabricating the same
Patent number
12,142,587
Issue date
Nov 12, 2024
Samsung Electronics Co., Ltd.
Jinho Park
H01 - BASIC ELECTRIC ELEMENTS
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Method of fabricating a semiconductor device
Patent number
12,136,602
Issue date
Nov 5, 2024
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
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Structure and method of bi-layer pixel isolation in advanced LCOS b...
Patent number
12,055,821
Issue date
Aug 6, 2024
Applied Materials, Inc.
Lan Yu
H01 - BASIC ELECTRIC ELEMENTS
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Redistribution layer metallic structure and method
Patent number
12,040,293
Issue date
Jul 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device having a dual material redistribution line
Patent number
12,027,447
Issue date
Jul 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Anhao Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Advanced device assembly structures and methods
Patent number
11,999,001
Issue date
Jun 4, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Semiconductor device with composite conductive features and method...
Patent number
12,002,772
Issue date
Jun 4, 2024
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with bonded substrates
Patent number
12,002,777
Issue date
Jun 4, 2024
Kioxia Corporation
Kotaro Fujii
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Metal pads over TSV
Patent number
11,955,445
Issue date
Apr 9, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having reduced bump height variation
Patent number
11,935,866
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Silicon photonic interposer with two metal redistribution layers
Patent number
11,923,327
Issue date
Mar 5, 2024
Rockley Photonics Limited
Michael Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bump structure and method of manufacturing bump structure
Patent number
11,923,326
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Chang
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Contact pad for semiconductor device
Patent number
11,901,320
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
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Multi-metal contact structure
Patent number
11,894,326
Issue date
Feb 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Silicon carbide device and method for forming a silicon carbide device
Patent number
11,869,840
Issue date
Jan 9, 2024
Infineon Technologies AG
Ralf Siemieniec
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE
Publication number
20250201775
Publication date
Jun 19, 2025
International Business Machines Corporation
Nicholas Alexander Polomoff
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC CIRCUIT COMPRISING CONTACT PADS
Publication number
20250167148
Publication date
May 22, 2025
STMicroelectronics International N.V.
Pierre BAR
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PHOTONIC ASSEMBLY FOR ENHANCED BONDING YIELD AND METHODS FOR FORMIN...
Publication number
20250149477
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
BONDING SCHEME FOR SEMICONDUCTOR PACKAGING
Publication number
20250149488
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Co, LTD.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
Publication number
20250118690
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP STRUCTURE
Publication number
20250087531
Publication date
Mar 13, 2025
Samsung Electronics Co., Ltd.
Sangjun PARK
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING ALUMINUM PAD OF SEMICONDUCTOR CHIP
Publication number
20250062254
Publication date
Feb 20, 2025
Shanghai Huali Integrated Circuit Corporation
Tianquan SHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...
Publication number
20250054888
Publication date
Feb 13, 2025
Huawei Technologies Co., Ltd
Ran He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Advanced Device Assembly Structures And Methods
Publication number
20250033138
Publication date
Jan 30, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Grain Structure Engineering for Metal Gapfill Materials
Publication number
20250038137
Publication date
Jan 30, 2025
Applied Materials, Inc.
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250022823
Publication date
Jan 16, 2025
Samsung Electronics Co., Ltd.
Ju-Il CHOI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
Publication number
20250006674
Publication date
Jan 2, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
Publication number
20240379607
Publication date
Nov 14, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
Publication number
20240339419
Publication date
Oct 10, 2024
Sumitomo Electric Industries, Ltd.
Shota SAMBONSUGE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240339420
Publication date
Oct 10, 2024
SAMSUNG ELECTRONICS CO,. LTD.
JU BIN SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
Publication number
20240332227
Publication date
Oct 3, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...
Publication number
20240332228
Publication date
Oct 3, 2024
Samsung Electronics Co., Ltd.
Joongwon SHIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
Publication number
20240321927
Publication date
Sep 26, 2024
SONY GROUP CORPORATION
Satoru WAKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240304576
Publication date
Sep 12, 2024
KIOXIA Corporation
Yuya KIYOMURA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
Publication number
20240274554
Publication date
Aug 15, 2024
NANYA TECHNOLOGY CORPORATION
Teng-Yen HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
Publication number
20240258252
Publication date
Aug 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Yu CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
Publication number
20240250047
Publication date
Jul 25, 2024
NANYA TECHNOLOGY CORPORATION
Teng-Yen HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240243028
Publication date
Jul 18, 2024
Innolux Corporation
Ming-Chih Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240243086
Publication date
Jul 18, 2024
Advanced Semiconductor Engineering, Inc.
Sheng-Hsiang HSU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
Publication number
20240234348
Publication date
Jul 11, 2024
Mitsubishi Electric Corporation
Yasunari HINO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240234354
Publication date
Jul 11, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...
Publication number
20240222318
Publication date
Jul 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng LIN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-METAL CONTACT STRUCTURE
Publication number
20240203917
Publication date
Jun 20, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL PADS OVER TSV
Publication number
20240194625
Publication date
Jun 13, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE
Publication number
20240178131
Publication date
May 30, 2024
Samsung Electronics Co., Ltd.
Sunoo KIM
H01 - BASIC ELECTRIC ELEMENTS