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Tantalum [Ta] as principal constituent
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H01L2224/05181
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05181
Tantalum [Ta] as principal constituent
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last 30 patents
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Patent Grant
Metal pads over TSV
Patent number
11,955,445
Issue date
Apr 9, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having reduced bump height variation
Patent number
11,935,866
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Silicon photonic interposer with two metal redistribution layers
Patent number
11,923,327
Issue date
Mar 5, 2024
Rockley Photonics Limited
Michael Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump structure and method of manufacturing bump structure
Patent number
11,923,326
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Chang
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,901,320
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-metal contact structure
Patent number
11,894,326
Issue date
Feb 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon carbide device and method for forming a silicon carbide device
Patent number
11,869,840
Issue date
Jan 9, 2024
Infineon Technologies AG
Ralf Siemieniec
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,862,586
Issue date
Jan 2, 2024
Kioxia Corporation
Mizuki Tamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and package assembly including the same
Patent number
11,855,025
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chita Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,848,346
Issue date
Dec 19, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Satoru Wakiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
Patent number
11,810,882
Issue date
Nov 7, 2023
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of fabricating the same
Patent number
11,804,459
Issue date
Oct 31, 2023
Samsung Electronics Co., Ltd.
Jinho Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,791,243
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
Patent number
11,776,923
Issue date
Oct 3, 2023
Sony Corporation
Masaki Haneda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure and method of forming same
Patent number
11,728,296
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsiao Yun Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
Patent number
11,728,297
Issue date
Aug 15, 2023
Samsung Electronics Co., Ltd.
Ju-il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode containing a grating and methods of making the...
Patent number
11,695,100
Issue date
Jul 4, 2023
Nanosys, Inc.
Zhen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
11,569,123
Issue date
Jan 31, 2023
Sony Corporation
Yoshihisa Kagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical mechanical polishing for hybrid bonding
Patent number
11,552,041
Issue date
Jan 10, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interlocked redistribution layer interface for flip-chip integrated...
Patent number
11,545,450
Issue date
Jan 3, 2023
NVIDIA Corporation
Yuanjing Jane Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,527,502
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer metallic structure and method
Patent number
11,502,050
Issue date
Nov 15, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing thereof
Patent number
11,476,291
Issue date
Oct 18, 2022
Sony Corporation
Satoru Wakiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
Patent number
11,476,212
Issue date
Oct 18, 2022
United Microelectronics Corporation
Yu-Jie Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,469,202
Issue date
Oct 11, 2022
Samsung Electronics Co., Ltd.
Seong-Min Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,462,458
Issue date
Oct 4, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump structure and method of manufacturing bump structure
Patent number
11,456,266
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Ching-Yu Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die including diffusion barrier layers embedding bond...
Patent number
11,450,624
Issue date
Sep 20, 2022
SanDisk Technologies LLC
Noriaki Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die including diffusion barrier layers embedding bond...
Patent number
11,444,039
Issue date
Sep 13, 2022
SanDisk Technologies LLC
Noriaki Oda
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MULTILAYER STACKING WAFER BONDING STRUCTURE AND METHOD OF MANUFACTU...
Publication number
20240162035
Publication date
May 16, 2024
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
Publication number
20240153897
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Fu-Chiang Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
Publication number
20240136309
Publication date
Apr 25, 2024
Mitsubishi Electric Corporation
Yasunari HINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Platinum-Based Solder Body Contacts for Integration of a First Subs...
Publication number
20240128213
Publication date
Apr 18, 2024
Newport Fab. LLC dba Tower Semiconductor Newport Beach
Zhirong Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
Publication number
20240113026
Publication date
Apr 4, 2024
INFINEON TECHNOLOGIES AG
Edward Fürgut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THICK REDISTRIBUTION LAYER FEATURES
Publication number
20240088074
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Feng Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20240071973
Publication date
Feb 29, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240055401
Publication date
Feb 15, 2024
United Microelectronics Corp.
Kun-Ju LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20240030169
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
Woon Chun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
Publication number
20240030187
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
Hyunsoo Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTOR AND METHOD FOR FORMING THE SAME
Publication number
20240021549
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Structure with Stress Buffer Zone and Method of Forming Same
Publication number
20240006352
Publication date
Jan 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
SyuFong LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
Publication number
20230402411
Publication date
Dec 14, 2023
SONY GROUP CORPORATION
Masaki HANEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230389339
Publication date
Nov 30, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Chao LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
Publication number
20230378126
Publication date
Nov 23, 2023
The Boeing Company
Peter D. Brewer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacture
Publication number
20230369170
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufaturing Co., Ltd.
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...
Publication number
20230361066
Publication date
Nov 9, 2023
SANDISK TECHNOLOGIES LLC
Linghan CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20230361062
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Huan Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...
Publication number
20230361061
Publication date
Nov 9, 2023
SANDISK TECHNOLOGIES LLC
Shingo TOTANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230352430
Publication date
Nov 2, 2023
RENESAS ELECTRONICS CORPORATION
Takashi MORIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
Publication number
20230340686
Publication date
Oct 26, 2023
LAM RESEARCH CORPORATION
Steven T. Mayer
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Publication number
20230317649
Publication date
Oct 5, 2023
Fuji Electric Co., Ltd.
Masahide GOTOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
Publication number
20230299023
Publication date
Sep 21, 2023
NANYA TECHNOLOGY CORPORATION
Teng-Yen HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20230282605
Publication date
Sep 7, 2023
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
Publication number
20230268308
Publication date
Aug 24, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230163087
Publication date
May 25, 2023
Samsung Electronics Co., Ltd.
Minki Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20230163089
Publication date
May 25, 2023
Samsung Electronics Co., Ltd.
Minki Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
Publication number
20230114550
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
Yongbum KWON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20230091325
Publication date
Mar 23, 2023
Kabushiki Kaisha Toshiba
Emiko INOUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR
Publication number
20230081238
Publication date
Mar 16, 2023
Samsung Electronics Co., Ltd.
Minho Jang
H01 - BASIC ELECTRIC ELEMENTS