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  • H05K2201/09827
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09827Tapered
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD
    • Publication number 20250240876
    • Publication date Jul 24, 2025
    • KYOCERA CORPORATION
    • Daichi SHIMIZU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • Publication number 20250212321
    • Publication date Jun 26, 2025
    • Dyi-Chung Hu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250212336
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ki Ran PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250194010
    • Publication date Jun 12, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jun Ki Min
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250193994
    • Publication date Jun 12, 2025
    • LG Innotek Co., Ltd.
    • Won Suk JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250194008
    • Publication date Jun 12, 2025
    • KYOCERA CORPORATION
    • Tomoya NAGASE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
    • Publication number 20250168965
    • Publication date May 22, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Gyumook Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250168980
    • Publication date May 22, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Min Gyu PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
    • Publication number 20250168981
    • Publication date May 22, 2025
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
    • Publication number 20250125239
    • Publication date Apr 17, 2025
    • Shinko Electric Industries Co., Ltd.
    • Yuji YUKIIRI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126715
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Byung Hak KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250126705
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Eun Su KWON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250120006
    • Publication date Apr 10, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Chul CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND SEMICONDUCTOR DEVICE
    • Publication number 20250113438
    • Publication date Apr 3, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki SHIMODAIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250098067
    • Publication date Mar 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250089171
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING INTERCONNECT SUBSTRATE
    • Publication number 20250089168
    • Publication date Mar 13, 2025
    • Shinko Electric Industries Co., Ltd.
    • Kensuke UCHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250089172
    • Publication date Mar 13, 2025
    • LG Innotek Co., Ltd.
    • Eom Ji KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250089165
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Hun NA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250081338
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250081337
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Kuk KO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250071897
    • Publication date Feb 27, 2025
    • LG Innotek Co., Ltd.
    • Dong Hun JOUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071898
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250063666
    • Publication date Feb 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung BYUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
    • Publication number 20250056728
    • Publication date Feb 13, 2025
    • NIPPON MEKTRON, LTD.
    • Akihiro NAKAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250056718
    • Publication date Feb 13, 2025
    • IBIDEN CO., LTD.
    • Atsushi ISHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250056727
    • Publication date Feb 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250048557
    • Publication date Feb 6, 2025
    • LG Innotek Co., Ltd.
    • Soo Min LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
    • Publication number 20250048533
    • Publication date Feb 6, 2025
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND MOUNTING STRUCTURE USING SAME
    • Publication number 20250040047
    • Publication date Jan 30, 2025
    • Kyocera Corporation
    • Masashi OHMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR