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  • H05K2201/09827
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09827Tapered
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240164019
    • Publication date May 16, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240155764
    • Publication date May 9, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Ho CHOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074049
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Kyun Bae
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074057
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Man Gon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...
    • Publication number 20240032202
    • Publication date Jan 25, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Kwang Yun KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240008179
    • Publication date Jan 4, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuta YAMAZAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230403789
    • Publication date Dec 14, 2023
    • IBIDEN CO., LTD.
    • Hiroki WAKAMORI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOUNTING BOARD AND CIRCUIT BOARD
    • Publication number 20230395766
    • Publication date Dec 7, 2023
    • TDK Corporation
    • Tomohisa MITOSE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
    • Publication number 20230397333
    • Publication date Dec 7, 2023
    • Intel Corporation
    • Eng Huat GOH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230389186
    • Publication date Nov 30, 2023
    • InnoLux Corporation
    • Yuan-Lin Wu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
    • Publication number 20230380062
    • Publication date Nov 23, 2023
    • Corning Incorporated
    • DHANANJAY JOSHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
    • Publication number 20230369192
    • Publication date Nov 16, 2023
    • Intel Corporation
    • Jonathan ROSCH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC CONTROL DEVICE
    • Publication number 20230354509
    • Publication date Nov 2, 2023
    • Hitachi Astemo, Ltd.
    • Ryo AKIBA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230319987
    • Publication date Oct 5, 2023
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
    • Publication number 20230309236
    • Publication date Sep 28, 2023
    • AT&S Austria Technologie & Systemtechnik AG
    • Stefanie Paller
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier With Protruding Portions and Manufacturing Method
    • Publication number 20230262892
    • Publication date Aug 17, 2023
    • AT&S Austria Technologie & Systemtechnik AG
    • Minwoo Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230217592
    • Publication date Jul 6, 2023
    • LG Innotek Co., Ltd.
    • Dong Sun KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD WITH CARRIER AND METHO...
    • Publication number 20230209707
    • Publication date Jun 29, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Han KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20230209710
    • Publication date Jun 29, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Su Min SONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230199959
    • Publication date Jun 22, 2023
    • LG Innotek Co., Ltd.
    • Won Suk JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230189431
    • Publication date Jun 15, 2023
    • LG Innotek Co., Ltd.
    • Won Suk JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
    • Publication number 20230189440
    • Publication date Jun 15, 2023
    • Nitto Denko Corporation
    • Kanayo SAWASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230171884
    • Publication date Jun 1, 2023
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SELF-GUIDED PLACEMENT OF MEMORY DEVICE COMPONENT PACKAGES
    • Publication number 20230156921
    • Publication date May 18, 2023
    • Western Digital Technologies, Inc.
    • Uthayarajan A/L Rasalingam
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20230141270
    • Publication date May 11, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Seong Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230119237
    • Publication date Apr 20, 2023
    • LG Innotek Co., Ltd.
    • Dong Hwa LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Structural Locating Sensors For A Sensor Module Using A Printed Cir...
    • Publication number 20230105697
    • Publication date Apr 6, 2023
    • BRP Megatech Industries Inc.
    • Jonathan Nobert
    • B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
  • Information Patent Application

    SUBSTRATE HAVING ELECTRIC COMPONENT EMBEDDED THEREIN
    • Publication number 20230104939
    • Publication date Apr 6, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Myeong Hui Jung
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
    • Publication number 20230081618
    • Publication date Mar 16, 2023
    • INTELLIMICRO MEDICAL CO., LTD.
    • Yu-chong Tai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Forming Through Hole in Component Carrier by Laser Drilling Blind H...
    • Publication number 20230085035
    • Publication date Mar 16, 2023
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Abderrazzaq IFIS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR