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  • H05K2201/09827
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09827Tapered
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250098067
    • Publication date Mar 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250089171
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250089172
    • Publication date Mar 13, 2025
    • LG Innotek Co., Ltd.
    • Eom Ji KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING INTERCONNECT SUBSTRATE
    • Publication number 20250089168
    • Publication date Mar 13, 2025
    • Shinko Electric Industries Co., Ltd.
    • Kensuke UCHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250089165
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Hun NA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250081338
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250081337
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Kuk KO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250071897
    • Publication date Feb 27, 2025
    • LG Innotek Co., Ltd.
    • Dong Hun JOUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071898
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250063666
    • Publication date Feb 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung BYUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
    • Publication number 20250056728
    • Publication date Feb 13, 2025
    • NIPPON MEKTRON, LTD.
    • Akihiro NAKAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250056718
    • Publication date Feb 13, 2025
    • IBIDEN CO., LTD.
    • Atsushi ISHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250056727
    • Publication date Feb 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250048557
    • Publication date Feb 6, 2025
    • LG Innotek Co., Ltd.
    • Soo Min LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
    • Publication number 20250048533
    • Publication date Feb 6, 2025
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND MOUNTING STRUCTURE USING SAME
    • Publication number 20250040047
    • Publication date Jan 30, 2025
    • Kyocera Corporation
    • Masashi OHMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...
    • Publication number 20240431027
    • Publication date Dec 26, 2024
    • TOPPAN Holdings Inc.
    • Yuki UMEMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240431023
    • Publication date Dec 26, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL MODULE AND OPTICAL TRANSCEIVER
    • Publication number 20240407104
    • Publication date Dec 5, 2024
    • FUJITSU OPTICAL COMPONENTS LIMITED
    • Masaki Sugiyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
    • Publication number 20240404978
    • Publication date Dec 5, 2024
    • Shinko Electric Industries Co., Ltd.
    • Masaya Takizawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD DEVICE
    • Publication number 20240397621
    • Publication date Nov 28, 2024
    • Unimicron Technology Corp.
    • Chin-Hsun WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
    • Publication number 20240381538
    • Publication date Nov 14, 2024
    • AT&S Austria Technologie & Systemtechnik
    • Heinrich TRISCHLER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
    • Publication number 20240365467
    • Publication date Oct 31, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Hong MIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
    • Publication number 20240357736
    • Publication date Oct 24, 2024
    • Hitachi Astemo, Ltd.
    • Takanori SEKIGUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240341033
    • Publication date Oct 10, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240334601
    • Publication date Oct 3, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sangho Jeong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240334596
    • Publication date Oct 3, 2024
    • TDK Corporation
    • Mikihiro KUMON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240324102
    • Publication date Sep 26, 2024
    • LG Innotek Co., Ltd.
    • Byeong Kyun CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240234289
    • Publication date Jul 11, 2024
    • Shinko Electric Industries Co., Ltd.
    • Toshiki SHIROTORI
    • H01 - BASIC ELECTRIC ELEMENTS