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  • H05K2201/09827
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09827Tapered
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    OPTICAL MODULE AND OPTICAL TRANSCEIVER
    • Publication number 20240407104
    • Publication date Dec 5, 2024
    • FUJITSU OPTICAL COMPONENTS LIMITED
    • Masaki Sugiyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
    • Publication number 20240404978
    • Publication date Dec 5, 2024
    • Shinko Electric Industries Co., Ltd.
    • Masaya Takizawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD DEVICE
    • Publication number 20240397621
    • Publication date Nov 28, 2024
    • Unimicron Technology Corp.
    • Chin-Hsun WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
    • Publication number 20240381538
    • Publication date Nov 14, 2024
    • AT&S Austria Technologie & Systemtechnik
    • Heinrich TRISCHLER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
    • Publication number 20240365467
    • Publication date Oct 31, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Hong MIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
    • Publication number 20240357736
    • Publication date Oct 24, 2024
    • Hitachi Astemo, Ltd.
    • Takanori SEKIGUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240341033
    • Publication date Oct 10, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240334601
    • Publication date Oct 3, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sangho Jeong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240334596
    • Publication date Oct 3, 2024
    • TDK Corporation
    • Mikihiro KUMON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240324102
    • Publication date Sep 26, 2024
    • LG Innotek Co., Ltd.
    • Byeong Kyun CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240234289
    • Publication date Jul 11, 2024
    • Shinko Electric Industries Co., Ltd.
    • Toshiki SHIROTORI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240224426
    • Publication date Jul 4, 2024
    • TOPPAN Holdings Inc.
    • Yuki UMEMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240215151
    • Publication date Jun 27, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Hsu-Chiang SHIH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240196526
    • Publication date Jun 13, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
    • Publication number 20240172361
    • Publication date May 23, 2024
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240164019
    • Publication date May 16, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Woo Seok YANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240155764
    • Publication date May 9, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Ho CHOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074049
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Kyun Bae
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074057
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Man Gon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...
    • Publication number 20240032202
    • Publication date Jan 25, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Kwang Yun KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240008179
    • Publication date Jan 4, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuta YAMAZAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230403789
    • Publication date Dec 14, 2023
    • IBIDEN CO., LTD.
    • Hiroki WAKAMORI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOUNTING BOARD AND CIRCUIT BOARD
    • Publication number 20230395766
    • Publication date Dec 7, 2023
    • TDK Corporation
    • Tomohisa MITOSE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
    • Publication number 20230397333
    • Publication date Dec 7, 2023
    • Intel Corporation
    • Eng Huat GOH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230389186
    • Publication date Nov 30, 2023
    • InnoLux Corporation
    • Yuan-Lin Wu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
    • Publication number 20230380062
    • Publication date Nov 23, 2023
    • Corning Incorporated
    • DHANANJAY JOSHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
    • Publication number 20230369192
    • Publication date Nov 16, 2023
    • Intel Corporation
    • Jonathan ROSCH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC CONTROL DEVICE
    • Publication number 20230354509
    • Publication date Nov 2, 2023
    • Hitachi Astemo, Ltd.
    • Ryo AKIBA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230319987
    • Publication date Oct 5, 2023
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR