Testing of IC packages; Test features related to IC packages

Industry

CPC
G01R31/2896

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/2896Testing of IC packages; Test features related to IC packages

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package with internal circuitry to detect extern...
- Patent number 11,959,962
- Issue date Apr 16, 2024
- QUALCOMM Incorporated
- Chengyue Yu
- G01 - MEASURING TESTING
Information Patent Grant
System, apparatus and method for identifying functionality of integ...
- Patent number 11,953,936
- Issue date Apr 9, 2024
- Silicon Laboratories Inc.
- Eugenio Carey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dice testing method
- Patent number 11,921,155
- Issue date Mar 5, 2024
- TANGO AI CORP.
- Min-Ju Tsai
- G01 - MEASURING TESTING
Information Patent Grant
Scan architecture for interconnect testing in 3D integrated circuits
- Patent number 11,899,064
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sandeep Kumar Goel
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and test method of semiconductor device
- Patent number 11,892,503
- Issue date Feb 6, 2024
- Toshiba Tec Kabushiki Kaisha
- Takuya Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,860,225
- Issue date Jan 2, 2024
- Renesas Electronics Corporation
- Fukumi Unokuchi
- G01 - MEASURING TESTING
Information Patent Grant
Ring transport employing clock wake suppression
- Patent number 11,829,196
- Issue date Nov 28, 2023
- Advanced Micro Devices, Inc.
- William L. Walker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Physical layer parameter compliance in high speed communication net...
- Patent number 11,789,067
- Issue date Oct 17, 2023
- Marvell Israel (M.I.S.L) Ltd.
- Liav Ben Artsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit, method of testing the semiconduct...
- Patent number 11,774,493
- Issue date Oct 3, 2023
- Canon Kabushiki Kaisha
- Koichi Iwao
- G01 - MEASURING TESTING
Information Patent Grant
Inspection jig and inspection apparatus
- Patent number 11,768,226
- Issue date Sep 26, 2023
- Nidec-Read Corporation
- Kohei Tsumura
- G01 - MEASURING TESTING
Information Patent Grant
3D TAP and scan port architectures
- Patent number 11,762,014
- Issue date Sep 19, 2023
- Texas Instruments Incorporated
- Lee D. Whetsel
- G01 - MEASURING TESTING
Information Patent Grant
Thermal control system for an automated test system
- Patent number 11,754,622
- Issue date Sep 12, 2023
- Teradyne, Inc.
- Larry Wayne Akers
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Testing bonding pads for chiplet systems
- Patent number 11,749,572
- Issue date Sep 5, 2023
- Macronix International Co., Ltd.
- Chun-Hsiung Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and testing method
- Patent number 11,733,294
- Issue date Aug 22, 2023
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-board power control arrangements for integrated circuit dev...
- Patent number 11,710,726
- Issue date Jul 25, 2023
- Microsoft Technology Licensing, LLC
- William Paul Hovis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level testing of optical components
- Patent number 11,688,652
- Issue date Jun 27, 2023
- II-VI DELAWARE, INC.
- Shiyun Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method, system and computer program product for introducing persona...
- Patent number 11,675,001
- Issue date Jun 13, 2023
- STMICROELECTRONICS S.r.l.
- Marco Alfarano
- G11 - INFORMATION STORAGE
Information Patent Grant
Force deflection and resistance testing system and method of use
- Patent number 11,668,731
- Issue date Jun 6, 2023
- MODUS TEST, LLC
- Lynwood Adams
- G01 - MEASURING TESTING
Information Patent Grant
Connectivity verification for flip-chip and advanced packaging tech...
- Patent number 11,639,955
- Issue date May 2, 2023
- Cisco Technology, Inc.
- Sanjay Sunder
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit spike check apparatus and method
- Patent number 11,639,960
- Issue date May 2, 2023
- Texas Instruments Incorporated
- Robert Gabriel Almendarez
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor device package with isolation
- Patent number 11,614,482
- Issue date Mar 28, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- G01 - MEASURING TESTING
Information Patent Grant
Failure pattern obtaining method and apparatus
- Patent number 11,609,263
- Issue date Mar 21, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chiasheng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package test system and semiconductor package fabrica...
- Patent number 11,592,478
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Jaehong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for testing an integrated circuit
- Patent number 11,579,191
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Che Wu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package test method, semiconductor package test devic...
- Patent number 11,568,949
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyungsuk Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Scan architecture for interconnect testing in 3D integrated circuits
- Patent number 11,549,984
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sandeep Kumar Goel
- G01 - MEASURING TESTING
Information Patent Grant
Methods and devices for bypassing a voltage regulator
- Patent number 11,550,348
- Issue date Jan 10, 2023
- STMICROELECTRONICS INTERNATIONAL N.V.
- Venkata Narayanan Srinivasan
- G01 - MEASURING TESTING
Information Patent Grant
Non-contact test solution for Antenna-On-Package (AOP) devices usin...
- Patent number 11,552,382
- Issue date Jan 10, 2023
- Texas Instmments Incorporated
- Meysam Moallem
- G01 - MEASURING TESTING
Information Patent Grant
3D tap and scan port architectures
- Patent number 11,549,983
- Issue date Jan 10, 2023
- Texas Instruments Incorporated
- Lee D. Whetsel
- G01 - MEASURING TESTING
Information Patent Grant
Measuring internal voltages of packaged electronic devices
- Patent number 11,543,845
- Issue date Jan 3, 2023
- Texas Instruments Incorporated
- Maciej Piotr Jankowski
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
PEAK POWER PACKAGE TRACKING
- Publication number 20240142515
- Publication date May 2, 2024
- ADVANCED MICRO DEVICES, INC.
- Amanullah Samit
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
- Publication number 20240145317
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCAN ARCHITECTURE FOR INTERCONNECT TESTING IN 3D INTEGRATED CIRCUITS
- Publication number 20240133951
- Publication date Apr 25, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Sandeep Kumar GOEL
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE TESTING METHOD
- Publication number 20240085473
- Publication date Mar 14, 2024
- LAPIS Technology Co., Ltd.
- Tomomi MIYANO
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240061037
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING
- Publication number 20240044972
- Publication date Feb 8, 2024
- Dish Network L.L.C.
- Mansoor Ahmed
- G01 - MEASURING TESTING
Information Patent Application
Repackaging IC Chip For Fault Identification
- Publication number 20240036108
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Trench In IC Chip Through Multiple Trench Formation And Dep...
- Publication number 20240040701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Openings Through Carrier Substrate of IC Package Assembly f...
- Publication number 20240038587
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTERNAL CIRCUITRY TO DETECT EXTERN...
- Publication number 20230417828
- Publication date Dec 28, 2023
- QUALCOMM Incorporated
- Chengyue YU
- G01 - MEASURING TESTING
Information Patent Application
3D TAP & SCAN PORT ARCHITECTURES
- Publication number 20230417831
- Publication date Dec 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE STRUCTURE AND TESTING METHOD
- Publication number 20230393194
- Publication date Dec 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao WANG
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS FOR A SEMICONDUCTOR PACKAGE
- Publication number 20230384368
- Publication date Nov 30, 2023
- TSE CO., LTD.
- Min Cheol Kim
- G01 - MEASURING TESTING
Information Patent Application
TESTING DEVICES AND METHOD FOR TESTING SEMICONDUCTOR DEVICES
- Publication number 20230366910
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICE TESTING METHOD
- Publication number 20230366927
- Publication date Nov 16, 2023
- TANGO AI CORP.
- MIN-JU TSAI
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for testing a package-on-package semiconductor...
- Publication number 20230349968
- Publication date Nov 2, 2023
- CHROMA ATE INC.
- Chin-Yi OUYANG
- G01 - MEASURING TESTING
Information Patent Application
LIMITING CIRCUITRY WITH CONTROLLED PARALLEL DIRECT CURRENT-DIRECT C...
- Publication number 20230341461
- Publication date Oct 26, 2023
- INFINEON TECHNOLOGIES AG
- Peter Johannes FRANK
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TESTING BONDING PADS FOR CHIPLET SYSTEMS
- Publication number 20230343657
- Publication date Oct 26, 2023
- Macronix International Co., Ltd.
- Chun-Hsiung Hung
- G01 - MEASURING TESTING
Information Patent Application
Architecture and Testing for an Integrated Circuit Package
- Publication number 20230341463
- Publication date Oct 26, 2023
- Kalyana Ravindra Kantipudi
- G01 - MEASURING TESTING
Information Patent Application
TEST METHOD AND MANUFACTURING METHOD
- Publication number 20230343652
- Publication date Oct 26, 2023
- Advantest Corporation
- Takeo MIURA
- G01 - MEASURING TESTING
Information Patent Application
TWINAXIAL CABLE SPLITTER
- Publication number 20230335960
- Publication date Oct 19, 2023
- SAMTEC, INC.
- Brandon Thomas GORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES
- Publication number 20230314503
- Publication date Oct 5, 2023
- Intel Corporation
- Gregorio Roberto Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR TESTING AND MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230305055
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- Bumsuk Chung
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PRODUCT WITH EDGE INTEGRITY DETECTION STRUCTURE
- Publication number 20230296664
- Publication date Sep 21, 2023
- Avago Technologies International Sales Pte. Limited
- Xiaoming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230296669
- Publication date Sep 21, 2023
- KIOXIA Corporation
- Takuya KUSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Virtualizing Hardware Processing Resources in a Processor
- Publication number 20230288471
- Publication date Sep 14, 2023
- NVIDIA Corporation
- Jerome F. DULUK
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET AND APPARATUS FOR TESTING A SEMICONDUCTOR PACKAGE
- Publication number 20230288474
- Publication date Sep 14, 2023
- STATS ChipPAC Pte Ltd.
- WonJung KIM
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL TESTING OF OPTICAL COMPONENTS
- Publication number 20230282527
- Publication date Sep 7, 2023
- II-VI Delaware, Inc.
- Shiyun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230266386
- Publication date Aug 24, 2023
- RENESAS ELECTRONICS CORPORATION
- Fukumi UNOKUCHI
- G01 - MEASURING TESTING
Information Patent Application
TESTING APPARATUS AND METHOD
- Publication number 20230194597
- Publication date Jun 22, 2023
- Seer Medical Pty Ltd
- Kyle Damon SLATER
- G06 - COMPUTING CALCULATING COUNTING

Testing of IC packages; Test features related to IC packages

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit package with internal circuitry to detect extern...

System, apparatus and method for identifying functionality of integ...

Dice testing method

Scan architecture for interconnect testing in 3D integrated circuits

Semiconductor device and test method of semiconductor device

Method of manufacturing semiconductor device

Ring transport employing clock wake suppression

Physical layer parameter compliance in high speed communication net...

Semiconductor integrated circuit, method of testing the semiconduct...

Inspection jig and inspection apparatus

3D TAP and scan port architectures

Thermal control system for an automated test system

Testing bonding pads for chiplet systems

Package structure and testing method

Through-board power control arrangements for integrated circuit dev...

Wafer level testing of optical components

Method, system and computer program product for introducing persona...

Force deflection and resistance testing system and method of use

Connectivity verification for flip-chip and advanced packaging tech...

Integrated circuit spike check apparatus and method

Method for manufacturing semiconductor device package with isolation

Failure pattern obtaining method and apparatus

Semiconductor package test system and semiconductor package fabrica...

Method and system for testing an integrated circuit

Semiconductor package test method, semiconductor package test devic...

Scan architecture for interconnect testing in 3D integrated circuits

Methods and devices for bypassing a voltage regulator

Non-contact test solution for Antenna-On-Package (AOP) devices usin...

3D tap and scan port architectures

Measuring internal voltages of packaged electronic devices

Patents Applicationslast 30 patents

PEAK POWER PACKAGE TRACKING

SEMICONDUCTOR PACKAGES HAVING TEST PADS

SCAN ARCHITECTURE FOR INTERCONNECT TESTING IN 3D INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE TESTING METHOD

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING

Repackaging IC Chip For Fault Identification

Forming Trench In IC Chip Through Multiple Trench Formation And Dep...

Forming Openings Through Carrier Substrate of IC Package Assembly f...

INTEGRATED CIRCUIT PACKAGE WITH INTERNAL CIRCUITRY TO DETECT EXTERN...

3D TAP & SCAN PORT ARCHITECTURES

PACKAGE STRUCTURE AND TESTING METHOD

TEST APPARATUS FOR A SEMICONDUCTOR PACKAGE

TESTING DEVICES AND METHOD FOR TESTING SEMICONDUCTOR DEVICES

DICE TESTING METHOD

Method and apparatus for testing a package-on-package semiconductor...

LIMITING CIRCUITRY WITH CONTROLLED PARALLEL DIRECT CURRENT-DIRECT C...

TESTING BONDING PADS FOR CHIPLET SYSTEMS

Architecture and Testing for an Integrated Circuit Package

TEST METHOD AND MANUFACTURING METHOD

TWINAXIAL CABLE SPLITTER

TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES

METHOD AND SYSTEM FOR TESTING AND MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PRODUCT WITH EDGE INTEGRITY DETECTION STRUCTURE

SEMICONDUCTOR DEVICE AND TEST METHOD OF SEMICONDUCTOR DEVICE

Virtualizing Hardware Processing Resources in a Processor

TEST SOCKET AND APPARATUS FOR TESTING A SEMICONDUCTOR PACKAGE

WAFER LEVEL TESTING OF OPTICAL COMPONENTS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

TESTING APPARATUS AND METHOD