Testing of IC packages; Test features related to IC packages

Industry

CPC
G01R31/2896

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/2896Testing of IC packages; Test features related to IC packages

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device package with board level reliability
- Patent number 12,131,967
- Issue date Oct 29, 2024
- Texas Instruments Incorporated
- Naweed Anjum
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Loopback testing of integrated circuits
- Patent number 12,123,908
- Issue date Oct 22, 2024
- PROTEANTECS LTD.
- Eyal Fayneh
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for RF built-in test system for a beamforming...
- Patent number 12,111,350
- Issue date Oct 8, 2024
- Andrew John Bonthron
- G01 - MEASURING TESTING
Information Patent Grant
Assembly for carrying chip, and device and method for testing chip
- Patent number 12,092,654
- Issue date Sep 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jinrong Huang
- G01 - MEASURING TESTING
Information Patent Grant
Testing devices and method for testing semiconductor devices
- Patent number 12,092,655
- Issue date Sep 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for electrical component
- Patent number 12,066,482
- Issue date Aug 20, 2024
- Enplas Corporation
- Yoshinobu Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip testing method and apparatus, and electronic equipment
- Patent number 12,044,724
- Issue date Jul 23, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hang Gao
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for remote access hardware testing
- Patent number 12,044,728
- Issue date Jul 23, 2024
- DISH Network L.L.C.
- Mansoor Ahmed
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for testing an integrated circuit
- Patent number 12,007,438
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Che Wu
- G01 - MEASURING TESTING
Information Patent Grant
Testing bonding pads for chiplet systems
- Patent number 11,984,371
- Issue date May 14, 2024
- Macronix International Co., Ltd.
- Chun-Hsiung Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with internal circuitry to detect extern...
- Patent number 11,959,962
- Issue date Apr 16, 2024
- QUALCOMM Incorporated
- Chengyue Yu
- G01 - MEASURING TESTING
Information Patent Grant
System, apparatus and method for identifying functionality of integ...
- Patent number 11,953,936
- Issue date Apr 9, 2024
- Silicon Laboratories Inc.
- Eugenio Carey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dice testing method
- Patent number 11,921,155
- Issue date Mar 5, 2024
- TANGO AI CORP.
- Min-Ju Tsai
- G01 - MEASURING TESTING
Information Patent Grant
Scan architecture for interconnect testing in 3D integrated circuits
- Patent number 11,899,064
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sandeep Kumar Goel
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and test method of semiconductor device
- Patent number 11,892,503
- Issue date Feb 6, 2024
- Toshiba Tec Kabushiki Kaisha
- Takuya Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,860,225
- Issue date Jan 2, 2024
- Renesas Electronics Corporation
- Fukumi Unokuchi
- G01 - MEASURING TESTING
Information Patent Grant
Ring transport employing clock wake suppression
- Patent number 11,829,196
- Issue date Nov 28, 2023
- Advanced Micro Devices, Inc.
- William L. Walker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Physical layer parameter compliance in high speed communication net...
- Patent number 11,789,067
- Issue date Oct 17, 2023
- Marvell Israel (M.I.S.L) Ltd.
- Liav Ben Artsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit, method of testing the semiconduct...
- Patent number 11,774,493
- Issue date Oct 3, 2023
- Canon Kabushiki Kaisha
- Koichi Iwao
- G01 - MEASURING TESTING
Information Patent Grant
Inspection jig and inspection apparatus
- Patent number 11,768,226
- Issue date Sep 26, 2023
- Nidec-Read Corporation
- Kohei Tsumura
- G01 - MEASURING TESTING
Information Patent Grant
3D TAP and scan port architectures
- Patent number 11,762,014
- Issue date Sep 19, 2023
- Texas Instruments Incorporated
- Lee D. Whetsel
- G01 - MEASURING TESTING
Information Patent Grant
Thermal control system for an automated test system
- Patent number 11,754,622
- Issue date Sep 12, 2023
- Teradyne, Inc.
- Larry Wayne Akers
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Testing bonding pads for chiplet systems
- Patent number 11,749,572
- Issue date Sep 5, 2023
- Macronix International Co., Ltd.
- Chun-Hsiung Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and testing method
- Patent number 11,733,294
- Issue date Aug 22, 2023
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-board power control arrangements for integrated circuit dev...
- Patent number 11,710,726
- Issue date Jul 25, 2023
- Microsoft Technology Licensing, LLC
- William Paul Hovis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level testing of optical components
- Patent number 11,688,652
- Issue date Jun 27, 2023
- II-VI DELAWARE, INC.
- Shiyun Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method, system and computer program product for introducing persona...
- Patent number 11,675,001
- Issue date Jun 13, 2023
- STMICROELECTRONICS S.r.l.
- Marco Alfarano
- G11 - INFORMATION STORAGE
Information Patent Grant
Force deflection and resistance testing system and method of use
- Patent number 11,668,731
- Issue date Jun 6, 2023
- MODUS TEST, LLC
- Lynwood Adams
- G01 - MEASURING TESTING
Information Patent Grant
Connectivity verification for flip-chip and advanced packaging tech...
- Patent number 11,639,955
- Issue date May 2, 2023
- Cisco Technology, Inc.
- Sanjay Sunder
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit spike check apparatus and method
- Patent number 11,639,960
- Issue date May 2, 2023
- Texas Instruments Incorporated
- Robert Gabriel Almendarez
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ANALOG TEST DEVICES FOR INTEGRATED CIRCUITS WITH MULTIPLE POWER DOM...
- Publication number 20240353478
- Publication date Oct 24, 2024
- NXP B.V.
- Prashant Goyal
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING
- Publication number 20240345158
- Publication date Oct 17, 2024
- Dish Network L.L.C.
- Mansoor Ahmed
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR TESTING SEMICONDUCTOR PACKAGE
- Publication number 20240337688
- Publication date Oct 10, 2024
- TSE CO., LTD.
- Dae Hyun ROH
- G01 - MEASURING TESTING
Information Patent Application
PIN FAULT DETECTION SYSTEM
- Publication number 20240329127
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- David Megaw
- G01 - MEASURING TESTING
Information Patent Application
SOFTWARE DEFINED DEVICE VARIANTS
- Publication number 20240329126
- Publication date Oct 3, 2024
- Xilinx, Inc.
- Dinesh D. GAITONDE
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...
- Publication number 20240329125
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Moise AVOCI UGWIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TEST DEVICES, SYSTEMS INCLUDING THE SAME, AND METHODS...
- Publication number 20240319265
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seongkwan LEE
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT MANUFACTURING METHOD, MANUFACTURING FILM, AND...
- Publication number 20240312848
- Publication date Sep 19, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Eiji Hayashishita
- G01 - MEASURING TESTING
Information Patent Application
CHIP TESTING DEVICE AND PACKAGE TESTING MACHINE
- Publication number 20240295600
- Publication date Sep 5, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe LIAN
- G01 - MEASURING TESTING
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240290796
- Publication date Aug 29, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhuoran YAN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION STRUCTURE AND METHOD...
- Publication number 20240222205
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Chulhee JEON
- G01 - MEASURING TESTING
Information Patent Application
TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR
- Publication number 20240203801
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
- Publication number 20240145317
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEAK POWER PACKAGE TRACKING
- Publication number 20240142515
- Publication date May 2, 2024
- ADVANCED MICRO DEVICES, INC.
- Amanullah Samit
- G01 - MEASURING TESTING
Information Patent Application
SCAN ARCHITECTURE FOR INTERCONNECT TESTING IN 3D INTEGRATED CIRCUITS
- Publication number 20240133951
- Publication date Apr 25, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Sandeep Kumar GOEL
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE TESTING METHOD
- Publication number 20240085473
- Publication date Mar 14, 2024
- LAPIS Technology Co., Ltd.
- Tomomi MIYANO
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240061037
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING
- Publication number 20240044972
- Publication date Feb 8, 2024
- Dish Network L.L.C.
- Mansoor Ahmed
- G01 - MEASURING TESTING
Information Patent Application
Repackaging IC Chip For Fault Identification
- Publication number 20240036108
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Trench In IC Chip Through Multiple Trench Formation And Dep...
- Publication number 20240040701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Openings Through Carrier Substrate of IC Package Assembly f...
- Publication number 20240038587
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTERNAL CIRCUITRY TO DETECT EXTERN...
- Publication number 20230417828
- Publication date Dec 28, 2023
- QUALCOMM Incorporated
- Chengyue YU
- G01 - MEASURING TESTING
Information Patent Application
3D TAP & SCAN PORT ARCHITECTURES
- Publication number 20230417831
- Publication date Dec 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE STRUCTURE AND TESTING METHOD
- Publication number 20230393194
- Publication date Dec 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao WANG
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS FOR A SEMICONDUCTOR PACKAGE
- Publication number 20230384368
- Publication date Nov 30, 2023
- TSE CO., LTD.
- Min Cheol Kim
- G01 - MEASURING TESTING
Information Patent Application
TESTING DEVICES AND METHOD FOR TESTING SEMICONDUCTOR DEVICES
- Publication number 20230366910
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICE TESTING METHOD
- Publication number 20230366927
- Publication date Nov 16, 2023
- TANGO AI CORP.
- MIN-JU TSAI
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for testing a package-on-package semiconductor...
- Publication number 20230349968
- Publication date Nov 2, 2023
- CHROMA ATE INC.
- Chin-Yi OUYANG
- G01 - MEASURING TESTING
Information Patent Application
TESTING BONDING PADS FOR CHIPLET SYSTEMS
- Publication number 20230343657
- Publication date Oct 26, 2023
- Macronix International Co., Ltd.
- Chun-Hsiung Hung
- G01 - MEASURING TESTING
Information Patent Application
LIMITING CIRCUITRY WITH CONTROLLED PARALLEL DIRECT CURRENT-DIRECT C...
- Publication number 20230341461
- Publication date Oct 26, 2023
- INFINEON TECHNOLOGIES AG
- Peter Johannes FRANK
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Testing of IC packages; Test features related to IC packages

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device package with board level reliability

Loopback testing of integrated circuits

Method and apparatus for RF built-in test system for a beamforming...

Assembly for carrying chip, and device and method for testing chip

Testing devices and method for testing semiconductor devices

Socket for electrical component

Chip testing method and apparatus, and electronic equipment

Methods and systems for remote access hardware testing

Method and system for testing an integrated circuit

Testing bonding pads for chiplet systems

Integrated circuit package with internal circuitry to detect extern...

System, apparatus and method for identifying functionality of integ...

Dice testing method

Scan architecture for interconnect testing in 3D integrated circuits

Semiconductor device and test method of semiconductor device

Method of manufacturing semiconductor device

Ring transport employing clock wake suppression

Physical layer parameter compliance in high speed communication net...

Semiconductor integrated circuit, method of testing the semiconduct...

Inspection jig and inspection apparatus

3D TAP and scan port architectures

Thermal control system for an automated test system

Testing bonding pads for chiplet systems

Package structure and testing method

Through-board power control arrangements for integrated circuit dev...

Wafer level testing of optical components

Method, system and computer program product for introducing persona...

Force deflection and resistance testing system and method of use

Connectivity verification for flip-chip and advanced packaging tech...

Integrated circuit spike check apparatus and method

Patents Applicationslast 30 patents

ANALOG TEST DEVICES FOR INTEGRATED CIRCUITS WITH MULTIPLE POWER DOM...

METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING

APPARATUS FOR TESTING SEMICONDUCTOR PACKAGE

PIN FAULT DETECTION SYSTEM

SOFTWARE DEFINED DEVICE VARIANTS

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...

SEMICONDUCTOR TEST DEVICES, SYSTEMS INCLUDING THE SAME, AND METHODS...

ELECTRONIC COMPONENT MANUFACTURING METHOD, MANUFACTURING FILM, AND...

CHIP TESTING DEVICE AND PACKAGE TESTING MACHINE

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION STRUCTURE AND METHOD...

TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR

SEMICONDUCTOR PACKAGES HAVING TEST PADS

PEAK POWER PACKAGE TRACKING

SCAN ARCHITECTURE FOR INTERCONNECT TESTING IN 3D INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE TESTING METHOD

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS AND SYSTEMS FOR REMOTE ACCESS HARDWARE TESTING

Repackaging IC Chip For Fault Identification

Forming Trench In IC Chip Through Multiple Trench Formation And Dep...

Forming Openings Through Carrier Substrate of IC Package Assembly f...

INTEGRATED CIRCUIT PACKAGE WITH INTERNAL CIRCUITRY TO DETECT EXTERN...

3D TAP & SCAN PORT ARCHITECTURES

PACKAGE STRUCTURE AND TESTING METHOD

TEST APPARATUS FOR A SEMICONDUCTOR PACKAGE

TESTING DEVICES AND METHOD FOR TESTING SEMICONDUCTOR DEVICES

DICE TESTING METHOD

Method and apparatus for testing a package-on-package semiconductor...

TESTING BONDING PADS FOR CHIPLET SYSTEMS

LIMITING CIRCUITRY WITH CONTROLLED PARALLEL DIRECT CURRENT-DIRECT C...