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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48145the bodies being stacked

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and driving circuit structure
- Patent number 12,112,669
- Issue date Oct 8, 2024
- E Ink Holdings Inc.
- Shu-Fen Tsai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor device packages, electronic sy...
- Patent number 11,984,440
- Issue date May 14, 2024
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,961,775
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple stacks of differ...
- Patent number 11,961,821
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Blaine J. Thurgood
- G11 - INFORMATION STORAGE
Information Patent Grant
Die over mold stacked semiconductor package
- Patent number 11,948,917
- Issue date Apr 2, 2024
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,948,919
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having chip stack
- Patent number 11,916,042
- Issue date Feb 27, 2024
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 11,901,345
- Issue date Feb 13, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual head capillary design for vertical wire bond
- Patent number 11,894,334
- Issue date Feb 6, 2024
- Intel Corporation
- Yuhong Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinning system in package
- Patent number 11,869,876
- Issue date Jan 9, 2024
- WALTON ADVANCED ENGINEERING INC.
- Chun Jung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 11,848,323
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory card
- Patent number 11,837,576
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Youngwoo Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,837,569
- Issue date Dec 5, 2023
- Kioxia Corporation
- Yoshiharu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 11,830,849
- Issue date Nov 28, 2023
- Western Digital Technologies, Inc.
- Saurabh Nilkanth Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421014
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Injae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240413032
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shaopeng Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE PACKAGE DATA STORAGE DEVICE
- Publication number 20240407180
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SPACER
- Publication number 20240404994
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240387460
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Heejae NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE INDUCTION APPARATUS
- Publication number 20240371914
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Carlos Franco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...
- Publication number 20240365543
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Taegon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...
- Publication number 20240349520
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Moorym CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE...
- Publication number 20240339435
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Ki Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332171
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING COMPENSATED ELECTRICAL CHANNEL PATHS
- Publication number 20240321710
- Publication date Sep 26, 2024
- SK HYNIX INC.
- Ki Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
- Publication number 20240319455
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321826
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dongchul YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312974
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- KYOUNGLIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...
- Publication number 20240312890
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312958
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Toshimitsu ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE
- Publication number 20240304515
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...
- Publication number 20240304509
- Publication date Sep 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20240304607
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282699
- Publication date Aug 22, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240274578
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A TERMINAL ELEMENT, TERMINAL ELEMENT, AND POWER...
- Publication number 20240266260
- Publication date Aug 8, 2024
- InfineonTechnologies AG
- Olaf Rüdiger Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...
- Publication number 20240260281
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Wen Wei LUM
- H01 - BASIC ELECTRIC ELEMENTS

the bodies being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Signal routing between memory die and logic die

Semiconductor package including stacked semiconductor chips

Display device and driving circuit structure

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Semiconductor device including a suspended reinforcing layer and me...

Method for interconnecting stacked semiconductor devices

Package-on-package semiconductor assemblies and methods of manufact...

Film in substrate for releasing z stack-up constraint

Semiconductor devices, semiconductor device packages, electronic sy...

Integrated high voltage capacitor

Semiconductor devices and related methods

Semiconductor device assemblies including multiple stacks of differ...

Die over mold stacked semiconductor package

Stacked semiconductor package

Die attached leveling control by metal stopper bumps

Semiconductor package having chip stack

Wafer-on-wafer formed memory and logic for genomic annotations

Semiconductor package

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device with integrated heat distribution and manufact...

Dual head capillary design for vertical wire bond

Semiconductor device and method of stacking semiconductor die for s...

Thinning system in package

Semiconductor devices with package-level configurability

Memory card

Semiconductor device and manufacturing method thereof

Semiconductor device with unbalanced die stackup

Package-on-package assembly with wire bonds to encapsulation surface

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE

SINGLE PACKAGE DATA STORAGE DEVICE

THERMALLY CONDUCTIVE SPACER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

BOND WIRE INDUCTION APPARATUS

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...

SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR PACKAGE HAVING COMPENSATED ELECTRICAL CHANNEL PATHS

PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...

SEMICONDUCTOR DEVICE

Semiconductor Device Package with Die Stackup and Interposer

HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR DEVICE

METHOD FOR FORMING A TERMINAL ELEMENT, TERMINAL ELEMENT, AND POWER...

MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...