the bond pad protruding from the surface of the item

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H01L2224/48249

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48249the bond pad protruding from the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package using selectively pre-plated leadframe
- Patent number 11,869,832
- Issue date Jan 9, 2024
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leads for semiconductor package
- Patent number 11,538,740
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Jason Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor outline housing with high return loss
- Patent number 11,088,096
- Issue date Aug 10, 2021
- Schott AG
- Artit Aowudomsuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus and system to interconnect packaged integrated ci...
- Patent number 10,910,347
- Issue date Feb 2, 2021
- Intel Corporation
- Yong She
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with short circuit failure mode
- Patent number 10,872,830
- Issue date Dec 22, 2020
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid pickup head with conformable layer
- Patent number 10,818,643
- Issue date Oct 27, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- F21 - LIGHTING
Information Patent Grant
Leadframe package using selectively pre-plated leadframe
- Patent number 10,763,195
- Issue date Sep 1, 2020
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive shield for semiconductor package
- Patent number 10,586,771
- Issue date Mar 10, 2020
- UTAC HEADQUARTERS PTE, LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond antennas
- Patent number 10,566,679
- Issue date Feb 18, 2020
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Ivan Ndip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting apparatus, stem part
- Patent number 10,411,167
- Issue date Sep 10, 2019
- Sumitomo Electric Industries, Ltd.
- Koichi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus and system to interconnect packaged integrated ci...
- Patent number 10,396,055
- Issue date Aug 27, 2019
- Intel Corporation
- Yong She
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and leadframe
- Patent number 10,043,739
- Issue date Aug 7, 2018
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having electromagnetic interference shielding an...
- Patent number 9,824,979
- Issue date Nov 21, 2017
- STMicroelectronics, Inc.
- Godfrey Dimayuga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules and methods of forming the same
- Patent number 9,818,686
- Issue date Nov 14, 2017
- Transphorm Inc.
- Yifeng Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package having routing traces therein
- Patent number 9,564,387
- Issue date Feb 7, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode assembly and fabrication method thereof
- Patent number 9,534,747
- Issue date Jan 3, 2017
- Huga Optotech Inc.
- Tzu-Chi Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 9,385,071
- Issue date Jul 5, 2016
- Renesas Electronics Corporation
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,245,832
- Issue date Jan 26, 2016
- Fuji Electric Co., Ltd.
- Akane Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertically offset bond o...
- Patent number 9,236,332
- Issue date Jan 12, 2016
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging quad flat non-leaded package body, and package...
- Patent number 9,224,620
- Issue date Dec 29, 2015
- Huawei Technologies Co., Ltd.
- Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules and methods of forming the same
- Patent number 9,209,176
- Issue date Dec 8, 2015
- Transphorm Inc.
- Yifeng Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of forming vertically offset bond o...
- Patent number 8,409,978
- Issue date Apr 2, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having isolated heatsink bonding pads
- Patent number 5,990,554
- Issue date Nov 23, 1999
- Motorola, Inc.
- Theodore R. Golubic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
- Publication number 20240145422
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
- Publication number 20240128168
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Feng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND SEMICONDUCT...
- Publication number 20240072026
- Publication date Feb 29, 2024
- Mitsubishi Electric Corporation
- Kazutake KADOWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240006122
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ferrite Electro-Magnetic Interference (EMI) Shield Between an Integ...
- Publication number 20230290735
- Publication date Sep 14, 2023
- High Tech Technology Limited
- Chik Wai (David) NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air-Core Transformer Package with Ferrite Electro-Magnetic Interfer...
- Publication number 20230290736
- Publication date Sep 14, 2023
- High Tech Technology Limited
- Chik Wai (David) NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composant de puissance à filtrage local et convertisseur mettant en...
- Publication number 20230208317
- Publication date Jun 29, 2023
- THALES
- Eric Ravindranath DUBOIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRENGTHENED WIRE-BOND
- Publication number 20220020717
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- WuXing Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising a Pin in the Form of a Dril...
- Publication number 20220005755
- Publication date Jan 6, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADS FOR SEMICONDUCTOR PACKAGE
- Publication number 20210020549
- Publication date Jan 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jason CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE USING SELECTIVELY PRE-PLATED LEADFRAME
- Publication number 20200373230
- Publication date Nov 26, 2020
- STMicroelectronics S.r.l.
- Paolo CREMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL DIE ATTACH TO SUBSTRATE WITH MULTI-...
- Publication number 20200312747
- Publication date Oct 1, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH SHORT CIRCUIT FAILURE MODE
- Publication number 20190355634
- Publication date Nov 21, 2019
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE USING SELECTIVELY PRE-PLATED LEADFRAME
- Publication number 20190295934
- Publication date Sep 26, 2019
- STMicroelectronics S.r.l.
- Paolo CREMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS AND SYSTEM TO INTERCONNECT PACKAGED INTEGRATED CI...
- Publication number 20190019777
- Publication date Jan 17, 2019
- Intel Corporation
- Yong SHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BOND ANTENNAS
- Publication number 20180191054
- Publication date Jul 5, 2018
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Ivan NDIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AN...
- Publication number 20170186698
- Publication date Jun 29, 2017
- STMICROELECTRONICS, INC.
- Godfrey DIMAYUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEADFRAME
- Publication number 20170125328
- Publication date May 4, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160372441
- Publication date Dec 22, 2016
- Fujitsu Limited
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20150262923
- Publication date Sep 17, 2015
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20150028462
- Publication date Jan 29, 2015
- Fuji Electric Co., Ltd.
- Akane HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Packaging Quad Flat Non-Leaded Package Body, and Package...
- Publication number 20140203432
- Publication date Jul 24, 2014
- Huawei Technologies Co., Ltd
- Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20140070389
- Publication date Mar 13, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Bond o...
- Publication number 20130154067
- Publication date Jun 20, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULES AND METHODS OF FORMING THE SAME
- Publication number 20130147540
- Publication date Jun 13, 2013
- Transphorm Inc.
- Yifeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHO...
- Publication number 20120104609
- Publication date May 3, 2012
- Chen-Hai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE MOLDED CHIP SCALE PACKAGE
- Publication number 20120001322
- Publication date Jan 5, 2012
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Bond o...
- Publication number 20110316132
- Publication date Dec 29, 2011
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110267796
- Publication date Nov 3, 2011
- Atsushi YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, semiconductor packaging structure and manufacturing meth...
- Publication number 20090243055
- Publication date Oct 1, 2009
- Chin-Ti Chen
- H01 - BASIC ELECTRIC ELEMENTS

the bond pad protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package comprising a pin in the form of a dril...

Leadframe package using selectively pre-plated leadframe

Leads for semiconductor package

Transistor outline housing with high return loss

Method, apparatus and system to interconnect packaged integrated ci...

Power semiconductor module with short circuit failure mode

Rigid pickup head with conformable layer

Leadframe package using selectively pre-plated leadframe

Conductive shield for semiconductor package

Ribbon bond antennas

Semiconductor light emitting apparatus, stem part

Method, apparatus and system to interconnect packaged integrated ci...

Semiconductor device and leadframe

Electronic package having electromagnetic interference shielding an...

Semiconductor modules and methods of forming the same

Semiconductor package having routing traces therein

Light-emitting diode assembly and fabrication method thereof

Manufacturing method of semiconductor device and semiconductor device

Semiconductor module

Semiconductor device and method of forming vertically offset bond o...

Method for packaging quad flat non-leaded package body, and package...

Semiconductor modules and methods of forming the same

Semiconductor device and method of forming vertically offset bond o...

Semiconductor package having isolated heatsink bonding pads

Patents Applicationslast 30 patents

LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND SEMICONDUCT...

CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME

Ferrite Electro-Magnetic Interference (EMI) Shield Between an Integ...

Air-Core Transformer Package with Ferrite Electro-Magnetic Interfer...

Composant de puissance à filtrage local et convertisseur mettant en...

STRENGTHENED WIRE-BOND

Semiconductor Device Package Comprising a Pin in the Form of a Dril...

LEADS FOR SEMICONDUCTOR PACKAGE

LEADFRAME PACKAGE USING SELECTIVELY PRE-PLATED LEADFRAME

SEMICONDUCTOR DEVICE WITH METAL DIE ATTACH TO SUBSTRATE WITH MULTI-...

POWER SEMICONDUCTOR MODULE WITH SHORT CIRCUIT FAILURE MODE

LEADFRAME PACKAGE USING SELECTIVELY PRE-PLATED LEADFRAME

METHOD, APPARATUS AND SYSTEM TO INTERCONNECT PACKAGED INTEGRATED CI...

RIBBON BOND ANTENNAS

ELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AN...

SEMICONDUCTOR DEVICE AND LEADFRAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

Method for Packaging Quad Flat Non-Leaded Package Body, and Package...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Vertically Offset Bond o...

SEMICONDUCTOR MODULES AND METHODS OF FORMING THE SAME

DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHO...

DOUBLE MOLDED CHIP SCALE PACKAGE

Semiconductor Device and Method of Forming Vertically Offset Bond o...

NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Leadframe, semiconductor packaging structure and manufacturing meth...