the bonding area connecting to a bonding area protruding from the surface of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08238the bonding area connecting to a bonding area protruding from the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Printed structure with electrical contact having reflowable polymer...
- Patent number 12,170,349
- Issue date Dec 17, 2024
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for electrically connecting printed horizont...
- Patent number 11,916,179
- Issue date Feb 27, 2024
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,810,893
- Issue date Nov 7, 2023
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method for manufacturing the same
- Patent number 11,532,542
- Issue date Dec 20, 2022
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing an LED-based emissive display device
- Patent number 11,404,401
- Issue date Aug 2, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Ivan-Christophe Robin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed structures with electrical contact having reflowable polyme...
- Patent number 11,316,086
- Issue date Apr 26, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 11,276,630
- Issue date Mar 15, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,211,339
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,205,602
- Issue date Dec 21, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including capping pad having crystal grain of...
- Patent number 11,121,069
- Issue date Sep 14, 2021
- Samsung Electronics Co., Ltd.
- Jaehoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,088,065
- Issue date Aug 10, 2021
- Rohm Co., Ltd.
- Hiroshi Oji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,049,841
- Issue date Jun 29, 2021
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,833,049
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical chip interposer and method of making a chip assembly conta...
- Patent number 10,700,028
- Issue date Jun 30, 2020
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 10,651,116
- Issue date May 12, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased contact alignment tolerance for direct bonding
- Patent number 10,607,937
- Issue date Mar 31, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 10,607,976
- Issue date Mar 31, 2020
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with extruded feed-through vias
- Patent number 10,535,594
- Issue date Jan 14, 2020
- Texas Instruments Incorporated
- Steven Kummerl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,510,681
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 10,446,530
- Issue date Oct 15, 2019
- Intel Corporation
- Russell K. Mortensen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429206
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429213
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BODY AND PREPARATION METHOD THEREFOR
- Publication number 20240404938
- Publication date Dec 5, 2024
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
- Publication number 20240387427
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Siu Lung Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Enhanced Power Semiconductor Package
- Publication number 20240243106
- Publication date Jul 18, 2024
- Wolfspeed, Inc.
- Daniel Ginn Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL I/O DIE
- Publication number 20240243074
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240178192
- Publication date May 30, 2024
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240120306
- Publication date Apr 11, 2024
- UNITED MICROELECTRONICS CORP.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20240112966
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240113072
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
- Publication number 20240096838
- Publication date Mar 21, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240072003
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055316
- Publication date Feb 15, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...
- Publication number 20240030124
- Publication date Jan 25, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE
- Publication number 20240021556
- Publication date Jan 18, 2024
- Shinko Electric Industries Co., LTD.
- Mitsuhiro Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240021591
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Taeyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20230411377
- Publication date Dec 21, 2023
- Murata Manufacturing Co., Ltd.
- Atsushi ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20230411376
- Publication date Dec 21, 2023
- Murata Manufacturing Co., Ltd.
- Atsushi ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE
- Publication number 20230317650
- Publication date Oct 5, 2023
- Shinko Electric Industries Co., Ltd.
- Mitsuhiro AIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW Z-HEIGHT LED ARRAY PACKAGE HAVING TSV SUPPORT STRUCTURE
- Publication number 20230154911
- Publication date May 18, 2023
- Lumileds LLC
- Tze Yang HIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230102618
- Publication date Mar 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hae Ju YUN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220344318
- Publication date Oct 27, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum nitride multilayer power module interposer and method
- Publication number 20220278021
- Publication date Sep 1, 2022
- TRIPENT POWER LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220157799
- Publication date May 19, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area connecting to a bonding area protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed structure with electrical contact having reflowable polymer...

Offset interposers for large-bottom packages and large-die package-...

Offset interposers for large-bottom packages and large-die package-...

Structures and methods for electrically connecting printed horizont...

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

Offset interposers for large-bottom packages and large-die package-...

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Wiring structure and method for manufacturing the same

Selective micro device transfer to receiver substrate

Process for manufacturing an LED-based emissive display device

Printed structures with electrical contact having reflowable polyme...

Planar integrated circuit package interconnects

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor package including capping pad having crystal grain of...

Semiconductor device

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

Method for electrical coupling and electric coupling arrangement

Vertical chip interposer and method of making a chip assembly conta...

Ball grid array and land grid array assemblies fabricated using tem...

Planar integrated circuit package interconnects

Increased contact alignment tolerance for direct bonding

Offset interposers for large-bottom packages and large-die package-...

Interposer with extruded feed-through vias

Semiconductor device

Offset interposers for large-bottom packages and large-die package-...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

PACKAGE BODY AND PREPARATION METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Thermal Enhanced Power Semiconductor Package

COAXIAL I/O DIE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

MULTISIDED INTEGRATED CIRCUIT ASSEMBLY

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

COMPONENT-EMBEDDED PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...

CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE

LOW Z-HEIGHT LED ARRAY PACKAGE HAVING TSV SUPPORT STRUCTURE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

PIXEL AND DISPLAY DEVICE INCLUDING THE SAME

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

Aluminum nitride multilayer power module interposer and method

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE