the bonding area connecting to a via metallisation of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08165the bonding area connecting to a via metallisation of the item

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Patents Grantslast 30 patents

Information Patent Grant
Radio frequency front end (RFFE) hetero-integration
- Patent number 11,749,746
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,694,950
- Issue date Jul 4, 2023
- Powertech Technology Inc.
- Chih-Yen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,081,434
- Issue date Aug 3, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,698,075
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-device package and manufacturing method thereof
- Patent number 9,543,270
- Issue date Jan 10, 2017
- Inotera Memories, Inc.
- Shih-Fan Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with integrated circuits and interposers...
- Patent number 9,536,862
- Issue date Jan 3, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ink for filling vias
- Patent number 9,123,705
- Issue date Sep 1, 2015
- NthDegree Technologies Worldwide Inc.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via (TSuV) structures and method of making the same
- Patent number 9,105,628
- Issue date Aug 11, 2015
- Valery Dubin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240178117
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Myung Sam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014199
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20240014138
- Publication date Jan 11, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230420344
- Publication date Dec 28, 2023
- NOVATEK MICROELECTRONICS CORP.
- Hsueh-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED GLASS CORE PATCH
- Publication number 20230085646
- Publication date Mar 23, 2023
- Jeremy D Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALI...
- Publication number 20230078099
- Publication date Mar 16, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT...
- Publication number 20230034737
- Publication date Feb 2, 2023
- Intel Corporation
- Junxin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY FRONT END (RFFE) HETERO-INTEGRATION
- Publication number 20220352359
- Publication date Nov 3, 2022
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220148955
- Publication date May 12, 2022
- Powertech Technology Inc.
- Chih-Yen SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170033078
- Publication date Feb 2, 2017
- Inotera Memories, Inc.
- Shih-Fan KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT
- Publication number 20160322277
- Publication date Nov 3, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INTEGRATED CIRCUITS AND INTERPOSERS...
- Publication number 20160133600
- Publication date May 12, 2016
- Invensas Corporation
- Hong SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA (TSUV) STRUCTURES AND METHOD OF MAKING THE SAME
- Publication number 20140231986
- Publication date Aug 21, 2014
- Valery Dubin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE INK FOR FILLING VIAS
- Publication number 20140138846
- Publication date May 22, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with integrated heat spreader
- Publication number 20070108595
- Publication date May 17, 2007
- ATI Technologies Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area connecting to a via metallisation of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Radio frequency front end (RFFE) hetero-integration

Semiconductor package

Package substrates with magnetic build-up layers

Package substrates with magnetic build-up layers

Integration of backside heat spreader for thermal management

Multi-device package and manufacturing method thereof

Microelectronic assemblies with integrated circuits and interposers...

Conductive ink for filling vias

Through substrate via (TSuV) structures and method of making the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SEMICONDUCTOR APPARATUS

EMBEDDED GLASS CORE PATCH

PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALI...

COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT...

RADIO FREQUENCY FRONT END (RFFE) HETERO-INTEGRATION

SEMICONDUCTOR PACKAGE

MULTI-DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT

MICROELECTRONIC ASSEMBLIES WITH INTEGRATED CIRCUITS AND INTERPOSERS...

THROUGH SUBSTRATE VIA (TSUV) STRUCTURES AND METHOD OF MAKING THE SAME

CONDUCTIVE INK FOR FILLING VIAS

Semiconductor device with integrated heat spreader