the bump connectors connecting two common bonding areas

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H01L2224/17107

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17107the bump connectors connecting two common bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,948,903
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier assembly
- Patent number 11,736,067
- Issue date Aug 22, 2023
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,616,039
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,552,034
- Issue date Jan 10, 2023
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,495,560
- Issue date Nov 8, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,276,657
- Issue date Mar 15, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,233,036
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,943,888
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier assembly
- Patent number 10,862,433
- Issue date Dec 8, 2020
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Printable component structure with electrical contact
- Patent number 10,777,521
- Issue date Sep 15, 2020
- X Display Company Technology Limited
- Matthew Meitl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,580,750
- Issue date Mar 3, 2020
- Taiyo Yuden Co., Ltd.
- Motoi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device capable of suppressing electromagnetic radiation...
- Patent number 10,504,853
- Issue date Dec 10, 2019
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 10,468,363
- Issue date Nov 5, 2019
- X-CELEPRINT LIMITED
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 10,199,358
- Issue date Feb 5, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,192,852
- Issue date Jan 29, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 10,177,108
- Issue date Jan 8, 2019
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor package assembly with thermal recycling function
- Patent number 9,837,595
- Issue date Dec 5, 2017
- Mediatek Inc.
- Long-Kun Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 9,818,728
- Issue date Nov 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 9,768,139
- Issue date Sep 19, 2017
- Advanced Semiconductor Engineering, Inc.
- Wan-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,640,455
- Issue date May 2, 2017
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor devices on sustrate and bonding st...
- Patent number 9,613,925
- Issue date Apr 4, 2017
- Tsinghua University
- Jian Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 9,532,495
- Issue date Dec 27, 2016
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump-on-lead interconnec...
- Patent number 9,385,101
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,355,974
- Issue date May 31, 2016
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,988
- Issue date May 31, 2016
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230223373
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20230146788
- Publication date May 11, 2023
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20220270999
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210407949
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AMPLIFIER ASSEMBLY
- Publication number 20210058039
- Publication date Feb 25, 2021
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20200243467
- Publication date Jul 30, 2020
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20200105697
- Publication date Apr 2, 2020
- X-Celeprint Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20190371753
- Publication date Dec 5, 2019
- X-Celeprint Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180323154
- Publication date Nov 8, 2018
- REALTEK SEMICONDUCTOR CORPORATION
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...
- Publication number 20180026015
- Publication date Jan 25, 2018
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTABLE COMPONENT STRUCTURE WITH ELECTRICAL CONTACT
- Publication number 20170047303
- Publication date Feb 16, 2017
- X-Celeprint Limited
- Matthew Meitl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20170048976
- Publication date Feb 16, 2017
- X-Celeprint Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20170040279
- Publication date Feb 9, 2017
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Wan-Ting CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH THERMAL RECYCLING FUNCTION
- Publication number 20160343929
- Publication date Nov 24, 2016
- MEDIATEK INC.
- Long-Kun YU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME
- Publication number 20160172326
- Publication date Jun 16, 2016
- TSINGHUA UNIVERSITY
- Jian CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING CONDUCTIVE BUMP STRUCTURE AND METHOD OF FABRICATION
- Publication number 20150228604
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART, ELECTRONIC APPARATUS, AND MOVING OBJECT
- Publication number 20140345928
- Publication date Nov 27, 2014
- SEIKO EPSON CORPORATION
- Yugo KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, AND METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20140332953
- Publication date Nov 13, 2014
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20140264832
- Publication date Sep 18, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Bump Bonding
- Publication number 20140264796
- Publication date Sep 18, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Interconnection Structure
- Publication number 20140145340
- Publication date May 29, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20140049922
- Publication date Feb 20, 2014
- MURATA MANUFACTURING CO., LTD.
- Shinya KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...
- Publication number 20140008792
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE CHIP SCALE PACKAGE
- Publication number 20130292716
- Publication date Nov 7, 2013
- Koninklijke Philips N.V.
- Daniel Alexander Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNEC...
- Publication number 20130277826
- Publication date Oct 24, 2013
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS

the bump connectors connecting two common bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chiplets with connection posts

Semiconductor package

Die attached leveling control by metal stopper bumps

Multilayer substrate

Industrial chip scale package for microelectronic device

Semiconductor device and amplifier assembly

Interconnect structure with redundant electrical connectors and ass...

Semiconductor package

Chiplets with connection posts

Chiplets with connection posts

Chiplets with connection posts

Interconnect structure with redundant electrical connectors and ass...

Interconnect structure with redundant electrical connectors and ass...

Semiconductor device and amplifier assembly

Printable component structure with electrical contact

Electronic component

Electronic device capable of suppressing electromagnetic radiation...

Chiplets with connection posts

Multilayer substrate

Interconnect structure with redundant electrical connectors and ass...

Method of manufacturing electronic component module and electronic...

Semiconductor package assembly with thermal recycling function

Interconnect structure with redundant electrical connectors and ass...

Semiconductor device and semiconductor package

Semiconductor device

Method for bonding semiconductor devices on sustrate and bonding st...

Method of manufacturing electronic component module and electronic...

Semiconductor device and method of forming bump-on-lead interconnec...

Semiconductor device and manufacturing method therefor

Semiconductor device

Patents Applicationslast 30 patents

CHIPLETS WITH CONNECTION POSTS

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

SEMICONDUCTOR PACKAGE

CHIPLETS WITH CONNECTION POSTS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND AMPLIFIER ASSEMBLY

CHIPLETS WITH CONNECTION POSTS

CHIPLETS WITH CONNECTION POSTS

CHIPLETS WITH CONNECTION POSTS

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...

PRINTABLE COMPONENT STRUCTURE WITH ELECTRICAL CONTACT

CHIPLETS WITH CONNECTION POSTS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE ASSEMBLY WITH THERMAL RECYCLING FUNCTION

BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME

SELF-ALIGNING CONDUCTIVE BUMP STRUCTURE AND METHOD OF FABRICATION

ELECTRONIC PART, ELECTRONIC APPARATUS, AND MOVING OBJECT

CHIP ARRANGEMENT, AND METHOD FOR FORMING A CHIP ARRANGEMENT

CHIP ARRANGEMENTS

Insulated Bump Bonding

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

Flip Chip Interconnection Structure

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...

Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...

LIGHT EMITTING DEVICE CHIP SCALE PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNEC...