TREA

the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate

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Industry

  • CPC
  • H01L2924/1533
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1533the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
Industries