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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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the devices being encapsulated in a common layer
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last 30 patents
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Patent Grant
3D-interconnect
Patent number
11,929,337
Issue date
Mar 12, 2024
Invensas LLC
Chok J. Chia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of package structure
Patent number
11,895,780
Issue date
Feb 6, 2024
Unimicron Technology Corp.
Kai-Ming Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing an electronic device and electronic device...
Patent number
11,823,913
Issue date
Nov 21, 2023
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip integration into cavities of a host wafer using lateral dielec...
Patent number
11,756,848
Issue date
Sep 12, 2023
PseudolithIC, Inc.
Florian Herrault
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro device integration into system substrate
Patent number
11,735,623
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of forming insulating layers around...
Patent number
11,699,678
Issue date
Jul 11, 2023
Semtech Corporation
Satyamoorthi Chinnusamy
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit structure and method for reducing polymer layer...
Patent number
11,688,728
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged die and RDL with bonding structures therebetween
Patent number
11,640,958
Issue date
May 2, 2023
Taiwan Semiconductor Manufacturing Company
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
Patent number
11,631,611
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multilayer hybrid battery separators for lithium ion secondary batt...
Patent number
11,626,349
Issue date
Apr 11, 2023
Celgard, LLC
Lie Shi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Packaged integrated circuit with interposing functionality and meth...
Patent number
11,605,569
Issue date
Mar 14, 2023
AT&SAustria Technologie & Systemtechnik AG
Mikael Tuominen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
Patent number
11,581,250
Issue date
Feb 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polymer resin and compression mold chip scale package
Patent number
11,508,679
Issue date
Nov 22, 2022
Semiconductor Components Industries, LLC
Yusheng Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package with multiple coplanar interposers
Patent number
11,469,210
Issue date
Oct 11, 2022
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Four D device process and structure
Patent number
11,458,717
Issue date
Oct 4, 2022
International Business Machines Corporation
Roy R. Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacture
Patent number
11,456,240
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip modules formed using wafer-level processing of a reconst...
Patent number
11,387,214
Issue date
Jul 12, 2022
Invensas LLC
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of packaging a semiconductor die
Patent number
11,387,171
Issue date
Jul 12, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing insulating film and semiconductor package
Patent number
11,361,878
Issue date
Jun 14, 2022
LG Chem, Ltd.
Woo Jae Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,328,969
Issue date
May 10, 2022
Amkor Technology Singapore Holding Pte Ltd.
Do Hyun Na
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Embedded semiconductive chips in reconstituted wafers, and systems...
Patent number
11,257,688
Issue date
Feb 22, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Thin 3D fan-out embedded wafer level package (EWLB) for application...
Patent number
11,251,154
Issue date
Feb 15, 2022
STATS ChipPAC Pte. Ltd.
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked modules
Patent number
11,239,170
Issue date
Feb 1, 2022
Snaptrack, Inc.
Andreas Franz
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of forming ultra high density embed...
Patent number
11,227,809
Issue date
Jan 18, 2022
JCET Semiconductor (Shaoxing) Co., Ltd.
See Chian Lim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip package array, and chip package
Patent number
11,227,848
Issue date
Jan 18, 2022
VIA ALLIANCE SEMICONDUCTOR CO., LTD.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package process and package structure
Patent number
11,222,866
Issue date
Jan 11, 2022
Advanced Semiconductor Engineering, Inc.
Chi-Chih Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aligning bumps in fan-out packaging process
Patent number
11,217,555
Issue date
Jan 4, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Ying-Jui Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional integrated circuits stacking approach
Patent number
11,201,135
Issue date
Dec 14, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
Patent number
11,189,537
Issue date
Nov 30, 2021
Infineon Technologies AG
Khalil Hosseini
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Handler bonding and debonding for semiconductor dies
Patent number
11,121,005
Issue date
Sep 14, 2021
International Business Machines Corporation
Paul S. Andry
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
ELECTRONIC PACKAGE INCLUDING IC DIES ARRANGED IN INVERTED RELATIVE...
Publication number
20240153921
Publication date
May 9, 2024
MICROCHIP TECHNOLOGY INCORPORATED
Randy Yach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES
Publication number
20240145515
Publication date
May 2, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Swarnal BORTHAKUR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240145256
Publication date
May 2, 2024
Resonac Corporation
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
Publication number
20240136297
Publication date
Apr 25, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yingqiang YAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
Publication number
20240096848
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240079356
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
Publication number
20240071998
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
Publication number
20240065002
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Dongkyu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...
Publication number
20240063167
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Hyunsoo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR BONDING STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240063185
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Yuan CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
Publication number
20240047389
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Hyeonmin Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240038728
Publication date
Feb 1, 2024
Samsung Electronics Co., Ltd.
Aenee Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240030198
Publication date
Jan 25, 2024
Powertech Technology Inc.
Ching-Wei Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240030121
Publication date
Jan 25, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240030183
Publication date
Jan 25, 2024
Resonac Corporation
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20240030176
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
Ji-Yong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
Publication number
20240021558
Publication date
Jan 18, 2024
Powertech Technology Inc.
Shang-Yu CHANG-CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
Publication number
20240014170
Publication date
Jan 11, 2024
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240006294
Publication date
Jan 4, 2024
SONY GROUP CORPORATION
Koichi ONO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
Publication number
20240006377
Publication date
Jan 4, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20230420352
Publication date
Dec 28, 2023
Samsung Electronics Co., Ltd.
Yeongbeom KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230411272
Publication date
Dec 21, 2023
Innolux Corporation
Cheng-Chi Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...
Publication number
20230411263
Publication date
Dec 21, 2023
STATS ChipPAC Pte Ltd.
SooHan PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Manufacturing the Same
Publication number
20230369161
Publication date
Nov 16, 2023
Nippon Telegraph and Telephone Corporation
Yusuke Araki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WAFER LEVEL INTEGRATION OF TRANSUCER ELEMENTS, TECHNIQUES AND IMPLE...
Publication number
20230317679
Publication date
Oct 5, 2023
ELTA SYSTEMS LTD.
Yaniv Maydar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230282587
Publication date
Sep 7, 2023
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT WATER-LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD TH...
Publication number
20230282531
Publication date
Sep 7, 2023
JCET Advanced Packaging Co., LTD.
XIA XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
Publication number
20230275065
Publication date
Aug 31, 2023
SEMTECH CORPORATION
Satyamoorthi Chinnusamy
H01 - BASIC ELECTRIC ELEMENTS