the devices being encapsulated in a common layer

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/96the devices being encapsulated in a common layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration into cavities of a host wafer using lateral dielec...
- Patent number 12,125,759
- Issue date Oct 22, 2024
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,009,350
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting module and method for manufacturing same
- Patent number 12,002,907
- Issue date Jun 4, 2024
- Nichia Corporation
- Yumiko Kameshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-interconnect
- Patent number 11,929,337
- Issue date Mar 12, 2024
- Invensas LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,823,913
- Issue date Nov 21, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration into cavities of a host wafer using lateral dielec...
- Patent number 11,756,848
- Issue date Sep 12, 2023
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 11,699,678
- Issue date Jul 11, 2023
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,688,728
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,631,611
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hybrid battery separators for lithium ion secondary batt...
- Patent number 11,626,349
- Issue date Apr 11, 2023
- Celgard, LLC
- Lie Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit with interposing functionality and meth...
- Patent number 11,605,569
- Issue date Mar 14, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 11,581,250
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 11,508,679
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple coplanar interposers
- Patent number 11,469,210
- Issue date Oct 11, 2022
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four D device process and structure
- Patent number 11,458,717
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,456,240
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules formed using wafer-level processing of a reconst...
- Patent number 11,387,214
- Issue date Jul 12, 2022
- Invensas LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor die
- Patent number 11,387,171
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing insulating film and semiconductor package
- Patent number 11,361,878
- Issue date Jun 14, 2022
- LG Chem, Ltd.
- Woo Jae Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,328,969
- Issue date May 10, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductive chips in reconstituted wafers, and systems...
- Patent number 11,257,688
- Issue date Feb 22, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin 3D fan-out embedded wafer level package (EWLB) for application...
- Patent number 11,251,154
- Issue date Feb 15, 2022
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 11,227,809
- Issue date Jan 18, 2022
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240413136
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Tsung-Kai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MAT...
- Publication number 20240395568
- Publication date Nov 28, 2024
- Resonac Corporation
- Keisuke NISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387346
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240387387
- Publication date Nov 21, 2024
- InnoLux Corporation
- Jia-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240371822
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING CIRCUIT BOARD AND RESIN SHEET USED THEREIN
- Publication number 20240371823
- Publication date Nov 7, 2024
- AJINOMOTO CO., INC.
- Shu IKEHIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME
- Publication number 20240363586
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...
- Publication number 20240339426
- Publication date Oct 10, 2024
- NXP B.V.
- Wen Yuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240332268
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF
- Publication number 20240321825
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Subtractive Metal Structuring on Surface of Semiconductor Package
- Publication number 20240312956
- Publication date Sep 19, 2024
- INFINEON TECHNOLOGIES AG
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-THICKNESS CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USIN...
- Publication number 20240304508
- Publication date Sep 12, 2024
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20240304607
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...
- Publication number 20240297146
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Shota KONUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME
- Publication number 20240297087
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Kai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297150
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240274582
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
- Publication number 20240266264
- Publication date Aug 8, 2024
- Semiconductor Components Industries, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKA...
- Publication number 20240266307
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Junghyun Roh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-CUT LEAD FRAME FOR INTEGRATED CIRCUIT (IC) PACKAGES
- Publication number 20240258120
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yuntao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240250064
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Yoshihisa MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...
- Publication number 20240243026
- Publication date Jul 18, 2024
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...
- Publication number 20240243025
- Publication date Jul 18, 2024
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243102
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234210
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240234328
- Publication date Jul 11, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234335
- Publication date Jul 11, 2024
- Siliconware Precision Industries Co., Ltd.
- Yen-Yu CHU
- H01 - BASIC ELECTRIC ELEMENTS

the devices being encapsulated in a common layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming ultra high density embed...

Chip integration into cavities of a host wafer using lateral dielec...

Wafer level chip scale packaging intermediate structure apparatus a...

Semiconductor package and method of fabricating the same

Light emitting module and method for manufacturing same

Packaged die and RDL with bonding structures therebetween

3D-interconnect

Manufacturing method of package structure

Method of manufacturing an electronic device and electronic device...

Chip integration into cavities of a host wafer using lateral dielec...

Micro device integration into system substrate

Semiconductor device and method of forming insulating layers around...

Integrated circuit structure and method for reducing polymer layer...

Packaged die and RDL with bonding structures therebetween

Wafer level chip scale packaging intermediate structure apparatus a...

Multilayer hybrid battery separators for lithium ion secondary batt...

Packaged integrated circuit with interposing functionality and meth...

Package with metal-insulator-metal capacitor and method of manufact...

Polymer resin and compression mold chip scale package

Semiconductor package with multiple coplanar interposers

Four D device process and structure

Semiconductor device and method of manufacture

Multi-chip modules formed using wafer-level processing of a reconst...

Method of packaging a semiconductor die

Method for manufacturing insulating film and semiconductor package

Semiconductor device and manufacturing method thereof

Embedded semiconductive chips in reconstituted wafers, and systems...

Thin 3D fan-out embedded wafer level package (EWLB) for application...

Stacked modules

Semiconductor device and method of forming ultra high density embed...

Patents Applicationslast 30 patents

OPTOELECTRONIC SYSTEM

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MAT...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD

METHOD FOR PRODUCING CIRCUIT BOARD AND RESIN SHEET USED THEREIN

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME

LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

Subtractive Metal Structuring on Surface of Semiconductor Package

MULTI-THICKNESS CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USIN...

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...

PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKA...

LASER-CUT LEAD FRAME FOR INTEGRATED CIRCUIT (IC) PACKAGES

SUBSTRATE PROCESSING METHOD

CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...

CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGES AND METHODS

MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF