the devices being mounted on two or more different substrates

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H01L25/162

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/162the devices being mounted on two or more different substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Double side integration semiconductor package and method of forming...
- Patent number 12,368,142
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside recess in motherboard with thermally conductive mold
- Patent number 12,363,831
- Issue date Jul 15, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and tiled display device
- Patent number 12,355,017
- Issue date Jul 8, 2025
- INNOLUX CORPORATION
- Jian-Jung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure with support features and methods
- Patent number 12,354,940
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display device including the same
- Patent number 12,336,287
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Dae Hwan Jang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 12,327,817
- Issue date Jun 10, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intra-cardiac echocardiography interposer
- Patent number 12,324,701
- Issue date Jun 10, 2025
- PHILIPS IMAGE GUIDED THERAPY CORPORATION
- Wojtek Sudol
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
System packaging for cellular modem and transceiver system of heter...
- Patent number 12,315,853
- Issue date May 27, 2025
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 12,308,361
- Issue date May 20, 2025
- Nichia Corporation
- Takeshi Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,300,679
- Issue date May 13, 2025
- Mediatek Inc.
- Yi-Jyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color tunable hybrid led-OLED illumination devices
- Patent number 12,300,687
- Issue date May 13, 2025
- Arizona Board of Regents on behalf of Arizona State University
- Jian Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Power module and method for manufacturing same
- Patent number 12,288,940
- Issue date Apr 29, 2025
- AMOSENSE CO., LTD.
- Jonguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating same
- Patent number 12,283,578
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jeong Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module, display apparatus, and method of manufacturing the...
- Patent number 12,278,225
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Jongsu Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,255,191
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Hideki Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,255,182
- Issue date Mar 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, and method of manufacturing electronic...
- Patent number 12,243,858
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display device including the same
- Patent number 12,243,876
- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Doo Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number 12,243,857
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Motoki Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chiplet device
- Patent number 12,230,578
- Issue date Feb 18, 2025
- Global Unichip Corporation
- Sheng-Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 12,224,579
- Issue date Feb 11, 2025
- Nexperia B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator (IVR) package including inductor and c...
- Patent number 12,191,288
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module
- Patent number 12,193,143
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya Hosotani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cytotoxic and anti-mitotic compounds, and methods of using the same
- Patent number 12,152,083
- Issue date Nov 26, 2024
- Zymeworks BC Inc.
- Geoffrey C. Winters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus which may be powered by wireless power transfer
- Patent number 12,155,959
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Sungyong Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall connections and button interconnects for molded SiPs
- Patent number 12,148,741
- Issue date Nov 19, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239575
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Seulgi YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226326
- Publication date Jul 10, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURE AND DISPLAY PANEL
- Publication number 20250219033
- Publication date Jul 3, 2025
- Industrial Technology Research Institute
- Jui-Wen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR BACK SIDE MICRO-LED ASSEMBLIES
- Publication number 20250219032
- Publication date Jul 3, 2025
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure
- Publication number 20250219031
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-Feng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210481
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20250194115
- Publication date Jun 12, 2025
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED STACK CAPACITOR AND METHOD OF...
- Publication number 20250192121
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jin SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192060
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183214
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- SEUNGSOO HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE
- Publication number 20250183240
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Mudit Sunilkumar Khasgiwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...
- Publication number 20250185169
- Publication date Jun 5, 2025
- Arista Networks, Inc.
- Robert Morris Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC PACKAGES
- Publication number 20250167185
- Publication date May 22, 2025
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Fan-Out (FO) Space Utilization in Package-On-Package (POP...
- Publication number 20250167186
- Publication date May 22, 2025
- Google LLC
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140731
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125206
- Publication date Apr 17, 2025
- Powertech Technology Inc.
- SHANG YU CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE
- Publication number 20250105157
- Publication date Mar 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
- Publication number 20250096211
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND REPAIR METHOD
- Publication number 20250087649
- Publication date Mar 13, 2025
- ALPS ALPINE CO., LTD.
- Katsuhiko KISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087637
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20250079420
- Publication date Mar 6, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURITY CHIP FOR ENSURING THE PHYSICAL INTEGRITY OF AN INTEGRATED...
- Publication number 20250079344
- Publication date Mar 6, 2025
- NVIDIA Corporation
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically Oriented Component Stack And Assembly
- Publication number 20250079419
- Publication date Mar 6, 2025
- KYOCERA AVX Components Corporation
- Jonathan Herr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079338
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...
- Publication number 20250079252
- Publication date Mar 6, 2025
- AMOGREENTECH CO., LTD.
- In Yong SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079421
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jihyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070103
- Publication date Feb 27, 2025
- Rohm Co., Ltd.
- Masanobu TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS WHICH MAY BE POWERED BY WIRELESS POWER TRANSFER
- Publication number 20250063133
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Sungyong JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250062238
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Bong Wee YU
- H01 - BASIC ELECTRIC ELEMENTS

the devices being mounted on two or more different substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Double side integration semiconductor package and method of forming...

Backside recess in motherboard with thermally conductive mold

Electronic substrate and electronic device

Display panel and tiled display device

Redistribution layer structure with support features and methods

Display device and tiled display device including the same

ASIC package with photonics and vertical power delivery

Intra-cardiac echocardiography interposer

System packaging for cellular modem and transceiver system of heter...

Light-emitting device

Electronic component module, sub-module, and method for manufacturi...

Package for power semiconductor devices

Semiconductor package structure

Color tunable hybrid led-OLED illumination devices

Power module and method for manufacturing same

Fan-out semiconductor package

Semiconductor package and method of fabricating same

Display module, display apparatus, and method of manufacturing the...

Semiconductor device

Electronic package and manufacturing method thereof

Electronic component module, and method of manufacturing electronic...

Display device and tiled display device including the same

Semiconductor integrated circuit

Semiconductor chiplet device

ESD protection device

Integrated voltage regulator (IVR) package including inductor and c...

Circuit board module

Cytotoxic and anti-mitotic compounds, and methods of using the same

Display apparatus which may be powered by wireless power transfer

Sidewall connections and button interconnects for molded SiPs

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

HYBRID BONDING STRUCTURE AND DISPLAY PANEL

TECHNOLOGIES FOR BACK SIDE MICRO-LED ASSEMBLIES

Semiconductor structure

SEMICONDUCTOR PACKAGE

ISOLATOR

SEMICONDUCTOR DEVICE WITH INTEGRATED STACK CAPACITOR AND METHOD OF...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE

DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...

STACKED ELECTRONIC PACKAGES

Efficient Fan-Out (FO) Space Utilization in Package-On-Package (POP...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE

INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...

DISPLAY DEVICE AND REPAIR METHOD

SEMICONDUCTOR PACKAGE

MODULE

SECURITY CHIP FOR ENSURING THE PHYSICAL INTEGRITY OF AN INTEGRATED...

POWER MODULE AND POWER CONVERSION APPARATUS

Vertically Oriented Component Stack And Assembly

SEMICONDUCTOR PACKAGE

INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

DISPLAY APPARATUS WHICH MAY BE POWERED BY WIRELESS POWER TRANSFER

SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE