the devices being mounted on two or more different substrates

Industry

CPC
H01L25/162

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/162the devices being mounted on two or more different substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 11,948,850
- Issue date Apr 2, 2024
- Mitsubishi Electric Corporation
- Akitoshi Shirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,916,004
- Issue date Feb 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Ching-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,901,303
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a plurality of lines to apply driving volt...
- Patent number 11,901,346
- Issue date Feb 13, 2024
- Samsung Display Co., Ltd.
- Ji Hye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic module with enhanced thermal and electrical perfor...
- Patent number 11,894,352
- Issue date Feb 6, 2024
- RENESAS ELECTRONICS AMERICA INC.
- Sri Ganesh A Tharumalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a capacitor
- Patent number 11,887,925
- Issue date Jan 30, 2024
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled display device
- Patent number 11,869,873
- Issue date Jan 9, 2024
- Samsung Display Co., Ltd.
- Dong Hee Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
- Patent number 11,837,552
- Issue date Dec 5, 2023
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled display device
- Patent number 11,837,589
- Issue date Dec 5, 2023
- Samsung Display Co., Ltd.
- Tae Woo Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electronic substrate and electronic device
- Patent number 11,830,833
- Issue date Nov 28, 2023
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method for forming the same
- Patent number 11,830,859
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor device package and method of ma...
- Patent number 11,830,834
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display device including the same
- Patent number 11,824,051
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Dae Hwan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,810,886
- Issue date Nov 7, 2023
- Japan Display Inc.
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure and package structure
- Patent number 11,798,890
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package and display device including the same
- Patent number 11,798,876
- Issue date Oct 24, 2023
- Novatek Microelectronics Corp.
- Ko Chien-Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and electronic apparatus
- Patent number 11,792,917
- Issue date Oct 17, 2023
- Canon Kabushiki Kaisha
- Takuya Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power laminate RF package
- Patent number 11,791,251
- Issue date Oct 17, 2023
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric or paraelectric memory and logic chiplet with thermal...
- Patent number 11,791,233
- Issue date Oct 17, 2023
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light-emitting device and light-emitting module with frame and cove...
- Patent number 11,784,170
- Issue date Oct 10, 2023
- Nichia Corporation
- Takashi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel having a plurality of display regions overlap
- Patent number 11,764,195
- Issue date Sep 19, 2023
- Shanghai Tianma Microelectronics Co., Ltd.
- Sitao Huo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Optical device and electronic device
- Patent number 11,764,311
- Issue date Sep 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,764,188
- Issue date Sep 19, 2023
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 11,756,892
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,756,942
- Issue date Sep 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing same
- Patent number 11,749,581
- Issue date Sep 5, 2023
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including press-fit connection terminal
- Patent number 11,742,251
- Issue date Aug 29, 2023
- Mitsubishi Electric Corporation
- Hidetoshi Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device module and display apparatus having the same
- Patent number 11,735,569
- Issue date Aug 22, 2023
- Seoul Viosys Co., Ltd.
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,728,320
- Issue date Aug 15, 2023
- Mediatek Inc.
- Tien-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power chip
- Patent number 11,709,533
- Issue date Jul 25, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Le Liang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240136263
- Publication date Apr 25, 2024
- Siliconware Precision Industries Co., Ltd.
- Hung-Kai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
- Publication number 20240136269
- Publication date Apr 25, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138052
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
- Publication number 20240128193
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240128249
- Publication date Apr 18, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
- Publication number 20240120268
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
- Publication number 20240105630
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE WITH SEALED DIE ENCLOSURES
- Publication number 20240088081
- Publication date Mar 14, 2024
- QUALCOMM Incorporated
- Bart KASSTEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20240079308
- Publication date Mar 7, 2024
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT PACKAGES
- Publication number 20240080970
- Publication date Mar 7, 2024
- Apple Inc.
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...
- Publication number 20240072024
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF...
- Publication number 20240071936
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembled Light Emitting Diode Display Device
- Publication number 20240071298
- Publication date Feb 29, 2024
- Macroblock, Inc.
- Ping-Kai Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071857
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A FIRST SUBSTRATE, A SECOND SUBSTRATE AND AN ELE...
- Publication number 20240063195
- Publication date Feb 22, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Partial EMI Shielding
- Publication number 20240063137
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240063078
- Publication date Feb 22, 2024
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Module-in-Package Struct...
- Publication number 20240063194
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063098
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240047441
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240047393
- Publication date Feb 8, 2024
- Innolux Corporation
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047332
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240038678
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240038643
- Publication date Feb 1, 2024
- Fuji Electric Co., Ltd.
- Ryusuke KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240038773
- Publication date Feb 1, 2024
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Yingchuan Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALLER MODULE BY STACKING
- Publication number 20240038743
- Publication date Feb 1, 2024
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Envelope Analysis for the Thermal Optimization of Multi-Chip...
- Publication number 20240037308
- Publication date Feb 1, 2024
- STATS ChipPAC Pte Ltd.
- Chien Ouyang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240030201
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Takanori UEJIMA
- H01 - BASIC ELECTRIC ELEMENTS

the devices being mounted on two or more different substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module and method for manufacturing semiconductor module

Electronic device

Integrated fan-out package

Display device including a plurality of lines to apply driving volt...

Power electronic module with enhanced thermal and electrical perfor...

Semiconductor device comprising a capacitor

Tiled display device

Semiconductor package with layer structures, antenna layer and elec...

Tiled display device

Electronic substrate and electronic device

Package structures and method for forming the same

Semiconductor device, semiconductor device package and method of ma...

Display device and tiled display device including the same

Display device

Assembly structure and package structure

Chip on film package and display device including the same

Electronic module and electronic apparatus

High power laminate RF package

Ferroelectric or paraelectric memory and logic chiplet with thermal...

Light-emitting device and light-emitting module with frame and cove...

Display panel having a plurality of display regions overlap

Optical device and electronic device

Electronic package and manufacturing method thereof

Method for forming chip package structure

Fan-out packaging structure and method

Semiconductor module and method for manufacturing same

Power semiconductor device including press-fit connection terminal

Light emitting device module and display apparatus having the same

Semiconductor package

Power chip

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE

CIRCUIT MODULE

ELECTRONIC MODULE AND ELECTRONIC APPARATUS

ELECTRONIC PACKAGE

METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Stacking Hybrid Substrates with...

DIE PACKAGE WITH SEALED DIE ENCLOSURES

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

SEMICONDUCTOR PACKAGE ASSEMBLY

ELECTRONIC CIRCUIT PACKAGES

MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...

INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF...

Assembled Light Emitting Diode Display Device

SEMICONDUCTOR DEVICE

PACKAGE COMPRISING A FIRST SUBSTRATE, A SECOND SUBSTRATE AND AN ELE...

Semiconductor Device and Method for Partial EMI Shielding

SEMICONDUCTOR PACKAGE STRUCTURE

Semiconductor Device and Method of Forming Module-in-Package Struct...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

DISPLAY PANEL AND DISPLAY DEVICE

SMALLER MODULE BY STACKING

Power Envelope Analysis for the Thermal Optimization of Multi-Chip...

RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE