the devices being mounted on two or more different substrates

Industry

CPC
H01L25/162

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/162the devices being mounted on two or more different substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sidewall connections and button interconnects for molded SiPs
- Patent number 12,148,741
- Issue date Nov 19, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display device including the same
- Patent number 12,148,767
- Issue date Nov 19, 2024
- Samsung Display Co., Ltd.
- Se Hoon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a capacitor
- Patent number 12,142,559
- Issue date Nov 12, 2024
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 12,132,037
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Jongsu Oh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Light emitting device package
- Patent number 12,119,437
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Soonwon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled display
- Patent number 12,119,332
- Issue date Oct 15, 2024
- Samsung Display Co., Ltd.
- Eun Kyung Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED display
- Patent number 12,118,926
- Issue date Oct 15, 2024
- Microsoft Technology Licensing, LLC
- Charles Walter Boecker
- G11 - INFORMATION STORAGE
Information Patent Grant
Light emitting array structure and display
- Patent number 12,094,861
- Issue date Sep 17, 2024
- Lextar Electronics Corporation
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display device including the same
- Patent number 12,074,170
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Cheol Min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and tiled display comprising the same
- Patent number 12,063,832
- Issue date Aug 13, 2024
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package aligning interposer and substrate
- Patent number 12,051,680
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,040,312
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembled light emitting diode display device
- Patent number 12,039,924
- Issue date Jul 16, 2024
- Macroblock, Inc.
- Ping-Kai Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of semiconductor devices between stacked substrates
- Patent number 12,009,351
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for managing power of ferroelectric or paraele...
- Patent number 12,001,266
- Issue date Jun 4, 2024
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pluggable CPU modules with vertical power
- Patent number 12,002,795
- Issue date Jun 4, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display device including the same
- Patent number 12,002,816
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- Ji Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent power module, electric vehicle or hybrid vehicle, and m...
- Patent number 11,993,247
- Issue date May 28, 2024
- Rohm Co., Ltd.
- Hideki Sawada
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Color tunable hybrid LED-OLED illumination devices
- Patent number 11,990,456
- Issue date May 21, 2024
- Arizona Board of Regents on behalf of Arizona State University
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,984,437
- Issue date May 14, 2024
- Nichia Corporation
- Takeshi Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display devices with different light sources in pixel structures
- Patent number 11,985,878
- Issue date May 14, 2024
- Shoei Chemical Inc.
- Jesse R. Manders
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,978,721
- Issue date May 7, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection structure and electronic device comprising th...
- Patent number 11,974,479
- Issue date Apr 30, 2024
- Innolux Corporation
- Shun-Yuan Hu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 11,948,850
- Issue date Apr 2, 2024
- Mitsubishi Electric Corporation
- Akitoshi Shirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,916,004
- Issue date Feb 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Ching-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,901,303
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a plurality of lines to apply driving volt...
- Patent number 11,901,346
- Issue date Feb 13, 2024
- Samsung Display Co., Ltd.
- Ji Hye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic module with enhanced thermal and electrical perfor...
- Patent number 11,894,352
- Issue date Feb 6, 2024
- RENESAS ELECTRONICS AMERICA INC.
- Sri Ganesh A Tharumalingam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL SPLICING UNIT AND DISPLAY PANEL SPLICED BY THE SAME
- Publication number 20240387487
- Publication date Nov 21, 2024
- HUA YANG Precision Machinery Co.,Ltd
- Yu-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...
- Publication number 20240387338
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240387387
- Publication date Nov 21, 2024
- InnoLux Corporation
- Jia-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronics Assembly Comprising Circuit Carrier, Semiconductor Chip...
- Publication number 20240379484
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Stefan Stegmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...
- Publication number 20240371736
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR
- Publication number 20240363519
- Publication date Oct 31, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240365623
- Publication date Oct 31, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20240355753
- Publication date Oct 24, 2024
- PIERBURG GMBH
- MIKA NUOTIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240355749
- Publication date Oct 24, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLOR TUNABLE HYBRID LED-OLED ILLUMINATION DEVICES
- Publication number 20240347523
- Publication date Oct 17, 2024
- Arizona Board of Regents on behalf of Arizona State University
- Jian LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347521
- Publication date Oct 17, 2024
- DENSO CORPORATION
- Yoshitaka KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...
- Publication number 20240341026
- Publication date Oct 10, 2024
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321672
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Cheng-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240313043
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312969
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240306320
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- SEON-KYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pluggable CPU Modules with Vertical Power
- Publication number 20240290763
- Publication date Aug 29, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282660
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Kenshi TERASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240282715
- Publication date Aug 22, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES
- Publication number 20240276739
- Publication date Aug 15, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...
- Publication number 20240258363
- Publication date Aug 1, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE, ELECTRIC VEHICLE OR HYBRID VEHICLE, AND M...
- Publication number 20240253613
- Publication date Aug 1, 2024
- Rohm Co., Ltd.
- Hideki SAWADA
- B60 - VEHICLES IN GENERAL
Information Patent Application
INVERTER POWER MODULE
- Publication number 20240258196
- Publication date Aug 1, 2024
- AMOSENSE CO., LTD.
- Kyungwhan WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL DEVICE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20240250079
- Publication date Jul 25, 2024
- Seoul Viosys Co., Ltd.
- Jong Min JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20240250081
- Publication date Jul 25, 2024
- Nichia Corporation.
- Takeshi IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR COOLED COMPACT POWER SYSTEMS
- Publication number 20240251533
- Publication date Jul 25, 2024
- Marel Power Solutions, Inc.
- Ian Byers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240250076
- Publication date Jul 25, 2024
- Innolux Corporation
- Kuang-Pin Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240237188
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS

the devices being mounted on two or more different substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sidewall connections and button interconnects for molded SiPs

Display device and tiled display device including the same

Semiconductor device comprising a capacitor

Display apparatus

Light emitting device package

Tiled display

Micro-LED display

Light emitting array structure and display

Display device and tiled display device including the same

Light-emitting device and tiled display comprising the same

Semiconductor package aligning interposer and substrate

Semiconductor package structure and method for manufacturing the same

Assembled light emitting diode display device

Semiconductor device and electronic device

Display panel, preparation method thereof, and display device

Plurality of semiconductor devices between stacked substrates

Method and apparatus for managing power of ferroelectric or paraele...

Pluggable CPU modules with vertical power

Display device and tiled display device including the same

Intelligent power module, electric vehicle or hybrid vehicle, and m...

Color tunable hybrid LED-OLED illumination devices

Light-emitting device

Display devices with different light sources in pixel structures

ASIC package with photonics and vertical power delivery

Electrical connection structure and electronic device comprising th...

Semiconductor module and method for manufacturing semiconductor module

Electronic device

Integrated fan-out package

Display device including a plurality of lines to apply driving volt...

Power electronic module with enhanced thermal and electrical perfor...

Patents Applicationslast 30 patents

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

DISPLAY PANEL SPLICING UNIT AND DISPLAY PANEL SPLICED BY THE SAME

RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Electronics Assembly Comprising Circuit Carrier, Semiconductor Chip...

SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...

SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR

ELECTRONIC DEVICE

POWER SEMICONDUCTOR PACKAGE

DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES

COLOR TUNABLE HYBRID LED-OLED ILLUMINATION DEVICES

SEMICONDUCTOR DEVICE

SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR DEVICE

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

DISPLAY DEVICE

Pluggable CPU Modules with Vertical Power

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES

INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...

INTELLIGENT POWER MODULE, ELECTRIC VEHICLE OR HYBRID VEHICLE, AND M...

INVERTER POWER MODULE

PIXEL DEVICE AND DISPLAY APPARATUS HAVING THE SAME

LIGHT-EMITTING DEVICE

AIR COOLED COMPACT POWER SYSTEMS

ELECTRONIC DEVICE

CIRCUIT MODULE