the devices being of a type provided for in group H01L27/00

Industry

CPC
H01L25/105

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/105the devices being of a type provided for in group H01L27/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interposer substrate, and st...
- Patent number 12,148,729
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimension large system integration
- Patent number 12,136,612
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,132,004
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 12,125,832
- Issue date Oct 22, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- In Su Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,306
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,331
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor circuits with shielded reference transistors
- Patent number 12,119,300
- Issue date Oct 15, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,113,004
- Issue date Oct 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 12,113,027
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,100,666
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,100,681
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,728
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and vehicle
- Patent number 12,087,655
- Issue date Sep 10, 2024
- Fuji Electric Co., Ltd.
- Yuta Tamai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 12,087,738
- Issue date Sep 10, 2024
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 12,087,744
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor die having edge with multiple grad...
- Patent number 12,087,618
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387391
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240387462
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387463
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240387467
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...
- Publication number 20240387484
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EXTERNAL CONNECTORS
- Publication number 20240387193
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387326
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240387434
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods
- Publication number 20240387304
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Huan Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387483
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF
- Publication number 20240387485
- Publication date Nov 21, 2024
- DIODES INCORPORATED
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379482
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379638
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSION LARGE SYSTEM INTEGRATION
- Publication number 20240379637
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES
- Publication number 20240379524
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Daehun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20240379635
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379488
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379636
- Publication date Nov 14, 2024
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STACK AND A METHOD FOR FORMING THE SAME
- Publication number 20240379525
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- YoungGeun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379577
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-SIZE DIE, RELATED DEVICES AND METHODS
- Publication number 20240371807
- Publication date Nov 7, 2024
- Skyworks Solutions, Inc.
- Junhyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371814
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240369765
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20240371782
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371785
- Publication date Nov 7, 2024
- Powertech Technology Inc.
- Ching-Wei Liao
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L27/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-chip integrated fan-out package

Semiconductor package structure having interposer substrate, and st...

Three-dimension large system integration

Semiconductor package structure and fabrication method thereof

Semiconductor devices and methods of manufacture

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor package including test bumps

Package structure with fan-out feature

Semiconductor device assemblies and systems with one or more dies a...

Semiconductor package

Semiconductor bonding structures and methods

Semiconductor package

Transistor circuits with shielded reference transistors

Semiconductor device packages, packaging methods, and packaged semi...

Electronic package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package with dual sides of metal routing

Three-dimensional integrated circuit structures and methods of form...

Method of forming semiconductor packages having through package vias

Offset interposers for large-bottom packages and large-die package-...

Method for forming chip package structure

Semiconductor package and method of fabricating the same

Package structure with conductive patterns in a redistribution layer

Semiconductor package and method of manufacturing the same

Semiconductor device

Semiconductor apparatus and vehicle

Packaged integrated circuit devices with through-body conductive vi...

Semiconductor package device

Package structure and manufacturing method thereof

Method for forming semiconductor die having edge with multiple grad...

Patents Applicationslast 30 patents

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...

SEMICONDUCTOR DEVICES WITH EXTERNAL CONNECTORS

SEMICONDUCTOR DEVICE

Semiconductor Package and Method of Manufacturing the Same

PACKAGE STRUCTURE

Integrated Circuit Packages and Methods

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME

THREE-DIMENSION LARGE SYSTEM INTEGRATION

SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES

METHOD OF FORMING PACKAGE STRUCTURE

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STACK AND A METHOD FOR FORMING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

REDUCED-SIZE DIE, RELATED DEVICES AND METHODS

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF