the devices being of a type provided for in group H01L29/00

Industry

CPC
H01L25/11

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/11the devices being of a type provided for in group H01L29/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Evaluation module and evaluation method for evaluating multichip mo...
- Patent number 12,111,348
- Issue date Oct 8, 2024
- Robert Bosch GmbH
- Lin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device
- Patent number 12,074,513
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Yusuke Tsubaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module board and memory module including the same
- Patent number 12,063,736
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Universal network-attached memory architecture
- Patent number 12,058,874
- Issue date Aug 6, 2024
- Eliyan Corporation
- Ramin Farjadrad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,533
- Issue date Jul 23, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 12,046,560
- Issue date Jul 23, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode stack including organic and inorganic layers
- Patent number 12,040,351
- Issue date Jul 16, 2024
- SEOUL VIOSYS CO., LTD.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,040,312
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus
- Patent number 12,033,918
- Issue date Jul 9, 2024
- LG Electronics Inc.
- Myeon Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier board and power module using same
- Patent number 12,028,969
- Issue date Jul 2, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode stack including hydrophilic material layer
- Patent number 12,021,111
- Issue date Jun 25, 2024
- SEOUL VIOSYS CO., LTD.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric substrate including a trench
- Patent number 11,961,796
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertical transistor with back side p...
- Patent number 11,948,974
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,942,411
- Issue date Mar 26, 2024
- Mitsubishi Electric Corporation
- Takamasa Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device having commonly connected LED sub-units
- Patent number 11,935,912
- Issue date Mar 19, 2024
- SEOUL VIOSYS CO., LTD.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,935,878
- Issue date Mar 19, 2024
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with high peak bandwidth I/O channels
- Patent number 11,901,956
- Issue date Feb 13, 2024
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,855,539
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assessing the thermal loading of a converter
- Patent number 11,846,668
- Issue date Dec 19, 2023
- Schneider Electric Power Drives GmbH
- Michael Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,837,523
- Issue date Dec 5, 2023
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE STACK INCLUDING ORGANIC AND INORGANIC LAYERS
- Publication number 20240363675
- Publication date Oct 31, 2024
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICES INCLUDING STAGGERED GATE STRUCTU...
- Publication number 20240355879
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- SEUNG MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
- Publication date Oct 3, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR A TOP SIDE COOLED POWER SEMICONDUCTOR THERM...
- Publication number 20240314979
- Publication date Sep 19, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Alexandre M. S. Reis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR CHIP PACKAGE
- Publication number 20240304528
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE HAVING COMMONLY CONNECTED LED SUB-UNITS
- Publication number 20240297206
- Publication date Sep 5, 2024
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240282675
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240244750
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240235393
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...
- Publication number 20240235138
- Publication date Jul 11, 2024
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS
- Publication number 20240223283
- Publication date Jul 4, 2024
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20240213171
- Publication date Jun 27, 2024
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR PIN ALIGNMENT ASSEMBLY
- Publication number 20240215167
- Publication date Jun 27, 2024
- Garrett Transportation I Inc.
- Valeriy Fedorikhin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL TRANSISTOR WITH BACK SIDE P...
- Publication number 20240194734
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
- Publication number 20240162111
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...
- Publication number 20240136782
- Publication date Apr 25, 2024
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...
- Publication number 20240105548
- Publication date Mar 28, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONTROL APPARATUS
- Publication number 20240088013
- Publication date Mar 14, 2024
- DENSO CORPORATION
- Shintaro KOGURE
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088064
- Publication date Mar 14, 2024
- Mitsubishi Electric Corporation
- Daichi OTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088109
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Masahiko KURAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER WITH AT LEAST TWO POWER SEMICONDUCTOR MODULES
- Publication number 20240088110
- Publication date Mar 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Felix ZEYSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Comprising a First and a Second Compartm...
- Publication number 20240071853
- Publication date Feb 29, 2024
- INFINEON TECHNOLOGIES AG
- Hans Hartung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055316
- Publication date Feb 15, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT BODY AND POWER CONVERSION DEVICE
- Publication number 20240047231
- Publication date Feb 8, 2024
- Hitachi Astemo, Ltd.
- Yasuhiro TSUYUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240047311
- Publication date Feb 8, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L29/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Evaluation module and evaluation method for evaluating multichip mo...

Semiconductor device and method of making the same

Semiconductor device, printed circuit board (PCB), and method of in...

Power conversion device

Module board and memory module including the same

Universal network-attached memory architecture

Package and package-on-package structure having elliptical columns...

Wafer level chip scale packaging intermediate structure apparatus a...

Semiconductor device

Microelectronic device with embedded die substrate on interposer

Power module and fabrication method of the same, graphite plate, an...

Light emitting diode stack including organic and inorganic layers

Semiconductor package structure and method for manufacturing the same

Cooling apparatus

Carrier board and power module using same

Light emitting diode stack including hydrophilic material layer

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor package dielectric substrate including a trench

Circuit carrier arrangement and method for producing such a circuit...

Ultra small molded module integrated with die by module-on-wafer as...

Semiconductor device including vertical transistor with back side p...

Semiconductor device

Light emitting device having commonly connected LED sub-units

Package structure and method for manufacturing the same

Module with high peak bandwidth I/O channels

Microelectronic device with embedded die substrate on interposer

Power module

Method for assessing the thermal loading of a converter

Inverter

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

LIGHT EMITTING DIODE STACK INCLUDING ORGANIC AND INORGANIC LAYERS

STACKED INTEGRATED CIRCUIT DEVICES INCLUDING STAGGERED GATE STRUCTU...

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

SYSTEMS AND METHODS FOR A TOP SIDE COOLED POWER SEMICONDUCTOR THERM...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

POWER TRANSISTOR CHIP PACKAGE

LIGHT EMITTING DEVICE HAVING COMMONLY CONNECTED LED SUB-UNITS

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

SEMICONDUCTOR MODULE

POWER MODULE

BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...

MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

TRANSISTOR PIN ALIGNMENT ASSEMBLY

SEMICONDUCTOR DEVICE INCLUDING VERTICAL TRANSISTOR WITH BACK SIDE P...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS

BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...

PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...

POWER CONTROL APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER CONVERTER WITH AT LEAST TWO POWER SEMICONDUCTOR MODULES

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

Power Semiconductor Module Comprising a First and a Second Compartm...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

ELECTRIC CIRCUIT BODY AND POWER CONVERSION DEVICE

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...