the devices being of a type provided for in group H01L29/00

Industry

CPC
H01L25/11

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/11the devices being of a type provided for in group H01L29/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric substrate including a trench
- Patent number 11,961,796
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertical transistor with back side p...
- Patent number 11,948,974
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,942,411
- Issue date Mar 26, 2024
- Mitsubishi Electric Corporation
- Takamasa Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device having commonly connected LED sub-units
- Patent number 11,935,912
- Issue date Mar 19, 2024
- SEOUL VIOSYS CO., LTD.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,935,878
- Issue date Mar 19, 2024
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with high peak bandwidth I/O channels
- Patent number 11,901,956
- Issue date Feb 13, 2024
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,855,539
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assessing the thermal loading of a converter
- Patent number 11,846,668
- Issue date Dec 19, 2023
- Schneider Electric Power Drives GmbH
- Michael Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,837,523
- Issue date Dec 5, 2023
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bus bar and power electronic device with current shaping terminal c...
- Patent number 11,837,826
- Issue date Dec 5, 2023
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 11,830,822
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,817,437
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,810,831
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,790,219
- Issue date Oct 17, 2023
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Module board and memory module including the same
- Patent number 11,785,710
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic power module
- Patent number 11,776,940
- Issue date Oct 3, 2023
- Kyocera AVX Components (Salzburg) GmbH
- Louis Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,764,126
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge packages with lithographical...
- Patent number 11,764,158
- Issue date Sep 19, 2023
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotating rectifiers
- Patent number 11,764,648
- Issue date Sep 19, 2023
- Hamilton Sundstrand Corporation
- Dhaval Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,756,943
- Issue date Sep 12, 2023
- Intel Corporation
- Shawna M. Liff
- G02 - OPTICS
Information Patent Grant
Thermally conductive material in the recess of an encapsulant and s...
- Patent number 11,756,802
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 11,749,608
- Issue date Sep 5, 2023
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power modules for ultra-fast wide-bandgap power switching devices
- Patent number 11,735,492
- Issue date Aug 22, 2023
- GaN Svstems Inc.
- Juncheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,728,240
- Issue date Aug 15, 2023
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...
- Publication number 20240136782
- Publication date Apr 25, 2024
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...
- Publication number 20240105548
- Publication date Mar 28, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONTROL APPARATUS
- Publication number 20240088013
- Publication date Mar 14, 2024
- DENSO CORPORATION
- Shintaro KOGURE
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088064
- Publication date Mar 14, 2024
- Mitsubishi Electric Corporation
- Daichi OTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088109
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Masahiko KURAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER WITH AT LEAST TWO POWER SEMICONDUCTOR MODULES
- Publication number 20240088110
- Publication date Mar 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Felix ZEYSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Comprising a First and a Second Compartm...
- Publication number 20240071853
- Publication date Feb 29, 2024
- INFINEON TECHNOLOGIES AG
- Hans Hartung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055316
- Publication date Feb 15, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT BODY AND POWER CONVERSION DEVICE
- Publication number 20240047231
- Publication date Feb 8, 2024
- Hitachi Astemo, Ltd.
- Yasuhiro TSUYUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240047311
- Publication date Feb 8, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
- Publication number 20240030096
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Ke Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240014192
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...
- Publication number 20230411299
- Publication date Dec 21, 2023
- Lodestar Licensing Group, LLC
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME
- Publication number 20230413424
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Wonseop LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSISTOR STACKS HAVING SPACERS, AND RELATED FABRICATION METHODS
- Publication number 20230395659
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Keumseok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20230387038
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING PACKAGE FOR DOUBLE-SIDED, BI-DIRECTIONAL JUNCT...
- Publication number 20230386987
- Publication date Nov 30, 2023
- IDEAL POWER INC.
- Jiankang BU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20230386989
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20230354526
- Publication date Nov 2, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Hideo MORIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE HAVING DIFFERENT CHANNEL LAYER INTE...
- Publication number 20230352529
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Gunho JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-COUPLING CONNECTIONS FOR STACKED FIELD EFFECT TRANSISTORS
- Publication number 20230343821
- Publication date Oct 26, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE FORMED OF...
- Publication number 20230343824
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Seungchan YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Carrier Arrangement And Method For Producing Such A Circuit...
- Publication number 20230343674
- Publication date Oct 26, 2023
- Vitesco Technologies GMBH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20230335525
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Battery Disconnect Unit
- Publication number 20230309278
- Publication date Sep 28, 2023
- LG ENERGY SOLUTION, LTD.
- Yong-Hwan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation Structure and Encapsulation Method of Power Module
- Publication number 20230268251
- Publication date Aug 24, 2023
- Huawei Technologies Co.,Ltd.
- Huibin Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20230197631
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230187376
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Naoyuki KANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20230108517
- Publication date Apr 6, 2023
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L29/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor package dielectric substrate including a trench

Circuit carrier arrangement and method for producing such a circuit...

Ultra small molded module integrated with die by module-on-wafer as...

Semiconductor device including vertical transistor with back side p...

Semiconductor device

Light emitting device having commonly connected LED sub-units

Package structure and method for manufacturing the same

Module with high peak bandwidth I/O channels

Microelectronic device with embedded die substrate on interposer

Power module

Method for assessing the thermal loading of a converter

Inverter

Bus bar and power electronic device with current shaping terminal c...

Semiconductor device and method of making the same

Method of forming package structure

Integrated circuit package and method of forming same

Three dimensional circuit implementing machine trained network

Module board and memory module including the same

Electronic power module

Semiconductor device and method of manufacturing semiconductor device

Embedded multi-die interconnect bridge packages with lithographical...

Rotating rectifiers

Package and package-on-package structure having elliptical columns...

Microelectronic assemblies

Thermally conductive material in the recess of an encapsulant and s...

Device packages including redistribution layers with carbon-based c...

Power modules for ultra-fast wide-bandgap power switching devices

Circuit carrier arrangement and method for producing such a circuit...

Patents Applicationslast 30 patents

BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...

PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...

POWER CONTROL APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER CONVERTER WITH AT LEAST TWO POWER SEMICONDUCTOR MODULES

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

Power Semiconductor Module Comprising a First and a Second Compartm...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

ELECTRIC CIRCUIT BODY AND POWER CONVERSION DEVICE

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...

PACKAGE STRUCTURE

DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...

MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME

TRANSISTOR STACKS HAVING SPACERS, AND RELATED FABRICATION METHODS

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

DOUBLE-SIDED COOLING PACKAGE FOR DOUBLE-SIDED, BI-DIRECTIONAL JUNCT...

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

CIRCUIT ASSEMBLY

3D-STACKED SEMICONDUCTOR DEVICE HAVING DIFFERENT CHANNEL LAYER INTE...

CROSS-COUPLING CONNECTIONS FOR STACKED FIELD EFFECT TRANSISTORS

3D-STACKED SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE FORMED OF...

Circuit Carrier Arrangement And Method For Producing Such A Circuit...

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

Battery Disconnect Unit

Encapsulation Structure and Encapsulation Method of Power Module

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR MODULE

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...