the devices being of a type provided for in group H01L29/00

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/11the devices being of a type provided for in group H01L29/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation structure and encapsulation method of power module
- Patent number 12,322,678
- Issue date Jun 3, 2025
- Huawei Technologies Co., Ltd.
- Huibin Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum nitride multilayer power module interposer and method
- Patent number 12,300,578
- Issue date May 13, 2025
- TriPent Power LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 12,300,622
- Issue date May 13, 2025
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,283,539
- Issue date Apr 22, 2025
- Mitsubishi Electric Corporation
- Yuki Matsutaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 12,248,869
- Issue date Mar 11, 2025
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside-illumination solid-state image pickup apparatus, image pic...
- Patent number 12,230,662
- Issue date Feb 18, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoki Komai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a semiconductor package with integrate...
- Patent number 12,218,030
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric susbtrate including a trench
- Patent number 12,211,782
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interconnects in bridges for integrated-circuit packages
- Patent number 12,183,722
- Issue date Dec 31, 2024
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus and semiconductor apparatus with cooling apparatus
- Patent number 12,178,007
- Issue date Dec 24, 2024
- Fuji Electric Co., Ltd.
- Ginji Uchibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures and methods of manufacturing the same
- Patent number 12,166,114
- Issue date Dec 10, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Jingyu Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,159,821
- Issue date Dec 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,155,307
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Evaluation module and evaluation method for evaluating multichip mo...
- Patent number 12,111,348
- Issue date Oct 8, 2024
- Robert Bosch GmbH
- Lin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device
- Patent number 12,074,513
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Yusuke Tsubaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module board and memory module including the same
- Patent number 12,063,736
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Universal network-attached memory architecture
- Patent number 12,058,874
- Issue date Aug 6, 2024
- Eliyan Corporation
- Ramin Farjadrad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,533
- Issue date Jul 23, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 12,046,560
- Issue date Jul 23, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode stack including organic and inorganic layers
- Patent number 12,040,351
- Issue date Jul 16, 2024
- SEOUL VIOSYS CO., LTD.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER DEVICE AND METHOD FOR ASSEMBLING A POWER DEVICE
- Publication number 20250201665
- Publication date Jun 19, 2025
- Hitachi Energy Ltd
- Milad MALEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20250183190
- Publication date Jun 5, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid State Switching Power Module with Improved Current Rating
- Publication number 20250174610
- Publication date May 29, 2025
- ABB Schweiz AG
- Francisco Canales
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...
- Publication number 20250167081
- Publication date May 22, 2025
- Wolfspeed, Inc.
- Ajit R. Kanale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE
- Publication number 20250140682
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- JIYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE-ILLUMINATION SOLID-STATE IMAGE PICKUP APPARATUS, IMAGE PIC...
- Publication number 20250142988
- Publication date May 1, 2025
- Sony Semiconductor Solutions Corporation
- Naoki KOMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20250125249
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE
- Publication number 20250125218
- Publication date Apr 17, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE ARRANGEMENT
- Publication number 20250118634
- Publication date Apr 10, 2025
- Infineon Technologies Austria AG
- Chang Young PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ELECTRODES, SEMICONDUCTOR DEVICE AND SEMICONDUCT...
- Publication number 20250113578
- Publication date Apr 3, 2025
- Infineon Technologies Austria AG
- Winfried Kaindl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer and Inverter Transistors Embedded in Interconnect Metal Layers
- Publication number 20250105134
- Publication date Mar 27, 2025
- Apple Inc.
- Xin Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250096684
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive Heatable Particles in Semiconductor Module
- Publication number 20250096219
- Publication date Mar 20, 2025
- Fabian Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079413
- Publication date Mar 6, 2025
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038088
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...
- Publication number 20250022816
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Takaya NEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
- Publication number 20250006665
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ASSEMBLY FOR POWER SEMICONDUCTOR CHIPS AND POWER ELECTRONIC...
- Publication number 20240413119
- Publication date Dec 12, 2024
- ZF Friedrichshafen AG
- Fabian Hohmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE STACK INCLUDING ORGANIC AND INORGANIC LAYERS
- Publication number 20240363675
- Publication date Oct 31, 2024
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICES INCLUDING STAGGERED GATE STRUCTU...
- Publication number 20240355879
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- SEUNG MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
- Publication date Oct 3, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR A TOP SIDE COOLED POWER SEMICONDUCTOR THERM...
- Publication number 20240314979
- Publication date Sep 19, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Alexandre M. S. Reis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR CHIP PACKAGE
- Publication number 20240304528
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE HAVING COMMONLY CONNECTED LED SUB-UNITS
- Publication number 20240297206
- Publication date Sep 5, 2024
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L29/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Encapsulation structure and encapsulation method of power module

Aluminum nitride multilayer power module interposer and method

Semiconductor device having a heat dissipation structure connected...

Device packages including redistribution layers with carbon-based c...

Semiconductor device

Three dimensional circuit implementing machine trained network

Power semiconductor device and method for manufacturing power semic...

Backside-illumination solid-state image pickup apparatus, image pic...

Package structure with warpage-control element

Electronic module comprising a semiconductor package with integrate...

Semiconductor package dielectric susbtrate including a trench

Package structure

Molded interconnects in bridges for integrated-circuit packages

Cooling apparatus and semiconductor apparatus with cooling apparatus

Semiconductor device structures and methods of manufacturing the same

Electronic package and manufacturing method thereof

Power module

Evaluation module and evaluation method for evaluating multichip mo...

Semiconductor device and method of making the same

Semiconductor device, printed circuit board (PCB), and method of in...

Power conversion device

Module board and memory module including the same

Universal network-attached memory architecture

Package and package-on-package structure having elliptical columns...

Wafer level chip scale packaging intermediate structure apparatus a...

Semiconductor device

Microelectronic device with embedded die substrate on interposer

Power module and fabrication method of the same, graphite plate, an...

Light emitting diode stack including organic and inorganic layers

Patents Applicationslast 30 patents

POWER DEVICE AND METHOD FOR ASSEMBLING A POWER DEVICE

MODULE

Solid State Switching Power Module with Improved Current Rating

REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE

BACKSIDE-ILLUMINATION SOLID-STATE IMAGE PICKUP APPARATUS, IMAGE PIC...

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

INTELLIGENT POWER MODULE ARRANGEMENT

METHOD FOR FORMING ELECTRODES, SEMICONDUCTOR DEVICE AND SEMICONDUCT...

Buffer and Inverter Transistors Embedded in Interconnect Metal Layers

POWER MODULE

Inductive Heatable Particles in Semiconductor Module

METHOD FOR FORMING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...

CONTACT ASSEMBLY FOR POWER SEMICONDUCTOR CHIPS AND POWER ELECTRONIC...

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

LIGHT EMITTING DIODE STACK INCLUDING ORGANIC AND INORGANIC LAYERS

STACKED INTEGRATED CIRCUIT DEVICES INCLUDING STAGGERED GATE STRUCTU...

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

SYSTEMS AND METHODS FOR A TOP SIDE COOLED POWER SEMICONDUCTOR THERM...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

POWER TRANSISTOR CHIP PACKAGE

LIGHT EMITTING DEVICE HAVING COMMONLY CONNECTED LED SUB-UNITS