the devices having the same size and there being no auxiliary carrier between the devices

Industry

CPC
H01L2225/06565

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06565the devices having the same size and there being no auxiliary carrier between the devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional stacking structure and manufacturing method thereof
- Patent number 12,224,265
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV check circuit with replica path
- Patent number 12,224,275
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Harutaka Makabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 12,218,102
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Youngkun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable logic device with fine-grained disaggregation
- Patent number 12,206,410
- Issue date Jan 21, 2025
- Intel Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating alignment of stacked chiplets
- Patent number 12,191,297
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Robert Clark
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator (IVR) package including inductor and c...
- Patent number 12,191,288
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 12,183,718
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal lines
- Patent number 12,170,268
- Issue date Dec 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Arrayed switch circuit, switching element and system chip package s...
- Patent number 12,154,905
- Issue date Nov 26, 2024
- Industrial Technology Research Institute
- Jie Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate inter-die connectors for data and error correction informa...
- Patent number 12,141,084
- Issue date Nov 12, 2024
- Lodestar Licensing Group LLC
- Vijayakrishna J. Vankayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory bandwidth aggregation using simultaneous access of stacked s...
- Patent number 12,131,796
- Issue date Oct 29, 2024
- RAMBUS INC.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package, semiconductor device and shielding housing o...
- Patent number 12,107,054
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,087,757
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery structures
- Patent number 12,087,682
- Issue date Sep 10, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a three-dimensional (3D) memory device having bo...
- Patent number 12,080,697
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside capacitor techniques
- Patent number 12,034,037
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies with near zero...
- Patent number 12,027,498
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffused bitline replacement in memory
- Patent number 11,978,724
- Issue date May 7, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple stacks of differ...
- Patent number 11,961,821
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Blaine J. Thurgood
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked semiconductor package
- Patent number 11,955,449
- Issue date Apr 9, 2024
- Samsung Electronics Co, Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED MULTI-CHIP STRUCTURE WITH ENHANCED PROTECTION
- Publication number 20250054827
- Publication date Feb 13, 2025
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Wan-Lan CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL LINES
- Publication number 20250038152
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
- Publication number 20250006251
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250006584
- Publication date Jan 2, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240371851
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...
- Publication number 20240371786
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES
- Publication number 20240363458
- Publication date Oct 31, 2024
- Joon Bu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20240355783
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20240355725
- Publication date Oct 24, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...
- Publication number 20240355499
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- CHANG SEOK LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BACKSIDE CAPACITOR TECHNIQUES
- Publication number 20240347582
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUNDANCY SCHEME FOR ACTIVATING CIRCUITRY ON A BASE DIE OF A 3D st...
- Publication number 20240330222
- Publication date Oct 3, 2024
- Xilinx, Inc.
- Brian C. GAIDE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20240304593
- Publication date Sep 12, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATING BATTERIES TO MAINTAIN VOLATILE...
- Publication number 20240264648
- Publication date Aug 8, 2024
- Arbor Company, LLLP
- Darrel James Guzy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED METAL LINES
- Publication number 20240266326
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFER...
- Publication number 20240258273
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Blaine J. Thurgood
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20240258278
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Hyungchul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD
- Publication number 20240203946
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Junyeong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...
- Publication number 20240194533
- Publication date Jun 13, 2024
- Intel Corporation
- Valluri R. RAO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS

the devices having the same size and there being no auxiliary carrier between the devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional stacking structure and manufacturing method thereof

TSV check circuit with replica path

Semiconductor package

Package-on-package assembly with wire bond vias

Programmable logic device with fine-grained disaggregation

Facilitating alignment of stacked chiplets

Semiconductor device assembly with pillar array

Integrated voltage regulator (IVR) package including inductor and c...

Semiconductor package having a high reliability

3D chip package based on vertical-through-via connector

Embedded metal lines

Signal routing between memory die and logic die

Arrayed switch circuit, switching element and system chip package s...

Bonding structures and methods for forming the same

Separate inter-die connectors for data and error correction informa...

Memory bandwidth aggregation using simultaneous access of stacked s...

Semiconductor device assemblies with molded support substrates

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Semiconductor package, semiconductor device and shielding housing o...

Semiconductor package and method of manufacturing the same

Semiconductor device assembly with surface-mount die support struct...

Integrated circuit packages

Power delivery structures

Method for forming a three-dimensional (3D) memory device having bo...

Backside capacitor techniques

Three-dimensional stacking semiconductor assemblies with near zero...

Diffused bitline replacement in memory

Semiconductor device assemblies including multiple stacks of differ...

Stacked semiconductor package

Patents Applicationslast 30 patents

STACKED MULTI-CHIP STRUCTURE WITH ENHANCED PROTECTION

Heat Dissipating Structure and Methods of Forming The Same

INTEGRATED CIRCUITS WITH CAPACITORS

EMBEDDED METAL LINES

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

POWER DELIVERY STRUCTURES

SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...

BACKSIDE CAPACITOR TECHNIQUES

REDUNDANCY SCHEME FOR ACTIVATING CIRCUITRY ON A BASE DIE OF A 3D st...

DIRECT BONDING METHODS AND STRUCTURES

SYSTEMS AND METHODS FOR INTEGRATING BATTERIES TO MAINTAIN VOLATILE...

EMBEDDED METAL LINES

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFER...

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD

INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES