the devices having the same size and there being no auxiliary carrier between the devices

Industry

CPC
H01L2225/06565

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06565the devices having the same size and there being no auxiliary carrier between the devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Diffused bitline replacement in memory
- Patent number 11,978,724
- Issue date May 7, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple stacks of differ...
- Patent number 11,961,821
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Blaine J. Thurgood
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked semiconductor package
- Patent number 11,955,449
- Issue date Apr 9, 2024
- Samsung Electronics Co, Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, and sem...
- Patent number 11,948,920
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
- Patent number 11,929,349
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
- Patent number 11,923,287
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,279
- Issue date Mar 5, 2024
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structure for stacked device
- Patent number 11,915,977
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device, structure and methods with connectivity st...
- Patent number 11,908,839
- Issue date Feb 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,894,346
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding interface
- Patent number 11,876,049
- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer routing structure and semiconductor package
- Patent number 11,869,846
- Issue date Jan 9, 2024
- Global Unichip Corporation
- Sheng-Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die circuit routing system and method
- Patent number 11,869,874
- Issue date Jan 9, 2024
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,855,042
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device structures and double-sided electrical te...
- Patent number 11,854,894
- Issue date Dec 26, 2023
- Intel Corporation
- Valluri R. Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 11,848,323
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including stacked individual modules
- Patent number 11,842,984
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Blaine J. Thurgood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for manufacturing the same
- Patent number 11,837,595
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacked memory device and method
- Patent number 11,830,562
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Shinhaeng Kang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,817,427
- Issue date Nov 14, 2023
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 11,817,428
- Issue date Nov 14, 2023
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for reconfiguring dual-function cell arrays
- Patent number 11,797,067
- Issue date Oct 24, 2023
- Arbor Company, LLLP
- Darrel James Guzy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip
- Patent number 11,798,906
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240153915
- Publication date May 9, 2024
- SK HYNIX INC.
- Hee Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153898
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Minseung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128135
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- GYOSOO CHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120299
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- JIHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240105527
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MEMORY ROUTING TECHNIQUES
- Publication number 20240096852
- Publication date Mar 21, 2024
- Lodestar Licensing Group, LLC
- Brent Keeth
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES,...
- Publication number 20240071891
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...
- Publication number 20240071970
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055406
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Yeongseon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240038731
- Publication date Feb 1, 2024
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK STRUCTURE
- Publication number 20240030190
- Publication date Jan 25, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Honglong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...
- Publication number 20240021552
- Publication date Jan 18, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR HYBRID-BOND
- Publication number 20240021544
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
- Publication number 20240014164
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
- Publication number 20230420437
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIC MOLECULE-ASSISTED DIRECT BONDING METHOD
- Publication number 20230387070
- Publication date Nov 30, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEQUENTIAL COMPLIMENTARY FET INCORPORATING BACKSIDE POWER DISTRIBUT...
- Publication number 20230378138
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATE INTER-DIE CONNECTORS FOR DATA AND ERROR CORRECTION INFORMA...
- Publication number 20230376432
- Publication date Nov 23, 2023
- Lodestar Licensing Group, LLC
- Vijayakrishna J. Vankayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW TEMPERATURE DIRECT BONDING
- Publication number 20230361074
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20230352471
- Publication date Nov 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20230343750
- Publication date Oct 26, 2023
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317657
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT FOR THERMAL DISPLACEMENT IN A MULTI-WAFER STACKED...
- Publication number 20230290755
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230282618
- Publication date Sep 7, 2023
- UltraMemory Inc.
- Ichiro HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STACKED ON PROCESSOR FOR HIGH BANDWIDTH
- Publication number 20230275068
- Publication date Aug 31, 2023
- NVIDIA Corporation
- William James Dally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230230944
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Boin NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRANSISTOR DEVICES
- Publication number 20230230958
- Publication date Jul 20, 2023
- X-CELEPRINT LIMITED
- William Edward Batchelor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES
- Publication number 20230223375
- Publication date Jul 13, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE
- Publication number 20230215828
- Publication date Jul 6, 2023
- Micron Technology, Inc.
- Andreas Kuesel
- H01 - BASIC ELECTRIC ELEMENTS

the devices having the same size and there being no auxiliary carrier between the devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Diffused bitline replacement in memory

Semiconductor device assemblies including multiple stacks of differ...

Stacked semiconductor package

Package comprising spacers between integrated devices

Semiconductor device and method for manufacturing the same, and sem...

Semiconductor device having laterally offset stacked semiconductor...

Method for manufacturing semiconductor device having chip stacked a...

Stacked integrated circuits with redistribution lines

Semiconductor device

Wafer-on-wafer formed memory and logic for genomic annotations

Interconnect structure for stacked device

3D semiconductor device, structure and methods with connectivity st...

Multilayer substrate

Semiconductor package having a high reliability

Semiconductor device and method of stacking semiconductor die for s...

Bonding alignment marks at bonding interface

Interposer routing structure and semiconductor package

Stacked die circuit routing system and method

Method of manufacturing semiconductor structure

Semiconductor packages with pass-through clock traces and associate...

Integrated circuit device structures and double-sided electrical te...

Semiconductor devices with package-level configurability

Semiconductor device assemblies including stacked individual modules

Semiconductor device structure and method for manufacturing the same

Three-dimensional stacked memory device and method

Package-on-package assembly with wire bonds to encapsulation surface

Semiconductor device having through silicon vias and manufacturing...

Memory device

Systems and methods for reconfiguring dual-function cell arrays

Semiconductor chip

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...

STACKED MEMORY ROUTING TECHNIQUES

SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES,...

SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE

SEMICONDUCTOR STACK STRUCTURE

CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...

SEAL RING FOR HYBRID-BOND

SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME

BASIC MOLECULE-ASSISTED DIRECT BONDING METHOD

SEQUENTIAL COMPLIMENTARY FET INCORPORATING BACKSIDE POWER DISTRIBUT...

SEPARATE INTER-DIE CONNECTORS FOR DATA AND ERROR CORRECTION INFORMA...

LOW TEMPERATURE DIRECT BONDING

INTEGRATED CIRCUIT PACKAGES

STACKED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

BACKSIDE CONTACT FOR THERMAL DISPLACEMENT IN A MULTI-WAFER STACKED...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

MEMORY STACKED ON PROCESSOR FOR HIGH BANDWIDTH

SEMICONDUCTOR PACKAGE

EMBEDDED TRANSISTOR DEVICES

PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES

LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE