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the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/24246
the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device
Patent number
12,100,638
Issue date
Sep 24, 2024
Denso Corporation
Shohei Nagai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages using package in package systems and related...
Patent number
11,984,424
Issue date
May 14, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inpil Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
Patent number
11,908,783
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Naoki Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-on-lead semiconductor device, and corresponding method of manu...
Patent number
11,887,959
Issue date
Jan 30, 2024
STMicroelectronics S.r.l.
Michele Derai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly and method therefor
Patent number
11,557,565
Issue date
Jan 17, 2023
NXP USA, INC.
Jinbang Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
Patent number
11,189,553
Issue date
Nov 30, 2021
Amkor Technology Singapore Holding Pte Ltd.
Naoki Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
Patent number
11,133,242
Issue date
Sep 28, 2021
STMicroelectronics S.r.l.
Michele Derai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
Patent number
10,818,578
Issue date
Oct 27, 2020
STMicroelectronics S.r.l.
Michele Derai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device including a semiconductor chip monolithically integrated wit...
Patent number
10,763,246
Issue date
Sep 1, 2020
Infineon Technologies AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package with a conductive post
Patent number
10,446,411
Issue date
Oct 15, 2019
Advanced Semiconductor Engineering, Inc.
Tien-Szu Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor modules with semiconductor dies bonded to a metal foil
Patent number
10,192,849
Issue date
Jan 29, 2019
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a conductive post
Patent number
10,049,893
Issue date
Aug 14, 2018
Advanced Semiconductor Engineering, Inc.
Tien-Szu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a sealant layer including carbon direct...
Patent number
9,953,952
Issue date
Apr 24, 2018
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with sidewall contacting bonding tape
Patent number
9,691,691
Issue date
Jun 27, 2017
Samsung Electronics Co., Ltd.
Yong-Hoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded package and method thereof
Patent number
9,685,430
Issue date
Jun 20, 2017
Alpha and Omega Semiconductor Incorporated
Zhiqiang Niu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip arrangement
Patent number
9,607,966
Issue date
Mar 28, 2017
Infineon Technologies AG
Anton Prueckl
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic component
Patent number
9,559,078
Issue date
Jan 31, 2017
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded die redistribution layers for active device
Patent number
9,443,815
Issue date
Sep 13, 2016
Maxim Integrated Products, Inc.
Kai Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip-embedded printed circuit board and semiconductor package using...
Patent number
9,392,698
Issue date
Jul 12, 2016
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Suk Chang Hong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of mounting semiconductor die to he...
Patent number
9,379,064
Issue date
Jun 28, 2016
STATS ChipPAC Pte. Ltd.
JiHoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making an embedded wafer level b...
Patent number
9,269,691
Issue date
Feb 23, 2016
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package with passives
Patent number
9,190,389
Issue date
Nov 17, 2015
Infineon Technologies AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power overlay structure with leadframe connections
Patent number
9,171,785
Issue date
Oct 27, 2015
General Electric Company
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power overlay structure with leadframe connections
Patent number
9,165,864
Issue date
Oct 20, 2015
General Electric Company
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked type power device module
Patent number
9,142,473
Issue date
Sep 22, 2015
Industrial Technology Research Institute
Yin-Po Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for manufacturing the semiconducto...
Patent number
9,136,220
Issue date
Sep 15, 2015
Shinko Electric Industries Co., Ltd.
Kenta Uchiyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor chip package
Patent number
9,123,708
Issue date
Sep 1, 2015
Infineon Technologies Austria AG
Khalil Hosseini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for manufacturing the semiconducto...
Patent number
9,099,478
Issue date
Aug 4, 2015
Shinko Electric Industries Co., Ltd.
Kenta Uchiyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device
Patent number
9,059,083
Issue date
Jun 16, 2015
Infineon Technologies AG
Henrik Ewe
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of mounting semiconductor die to he...
Patent number
9,048,209
Issue date
Jun 2, 2015
STATS ChipPAC, Ltd.
JiHoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Packaging Method
Publication number
20240404968
Publication date
Dec 5, 2024
SHENZHEN SIPTORY TECHNOLOGY CO., LTD
Dongdong Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
Publication number
20240258268
Publication date
Aug 1, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inpil YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTUR...
Publication number
20240213203
Publication date
Jun 27, 2024
Huawei Technologies Co., Ltd
Yonggang ZHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE
Publication number
20230317673
Publication date
Oct 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
Publication number
20230290750
Publication date
Sep 14, 2023
Sumitomo Electric Industries, Ltd.
Tatsuya HASHINAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
Publication number
20220238473
Publication date
Jul 28, 2022
STMicroelectronics S.r.l
Dario VITELLO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-LEAD SEMICONDUCTOR DEVICE, AND CORRESPONDING METHOD OF MANU...
Publication number
20220199564
Publication date
Jun 23, 2022
STMicroelectronics S.r.l
Michele DERAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
Publication number
20220108973
Publication date
Apr 7, 2022
NXP USA, Inc.
Jinbang Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
Publication number
20220044991
Publication date
Feb 10, 2022
Amkor Technology Singapore Holding Pte. Ltd
Naoki HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
Publication number
20210242167
Publication date
Aug 5, 2021
Semiconductor Components Industries, LLC
Inpil YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
Publication number
20210013134
Publication date
Jan 14, 2021
STMicroelectronics S.r.l.
Michele DERAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
Publication number
20200066623
Publication date
Feb 27, 2020
J-DEVICES CORPORATION
Naoki HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20170330870
Publication date
Nov 16, 2017
Advanced Semiconductor Engineering, Inc.
Tien-Szu CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making an Embedded Wafer Level B...
Publication number
20140367848
Publication date
Dec 18, 2014
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE
Publication number
20140284792
Publication date
Sep 25, 2014
Wei-Ming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT
Publication number
20140264950
Publication date
Sep 18, 2014
INFINEON TECHNOLOGIES AG
Rainer Steiner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Chip Package
Publication number
20140246766
Publication date
Sep 4, 2014
Infineon Technologies Austria AG
Khalil Hosseini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED TYPE POWER DEVICE MODULE
Publication number
20140159212
Publication date
Jun 12, 2014
Industrial Technology Research Institute
Yin-Po Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-EMBEDDED PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING...
Publication number
20140159222
Publication date
Jun 12, 2014
Samsung Electro-Mechanics Co., Ltd.
Suk Chang HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS
Publication number
20140138806
Publication date
May 22, 2014
GENERAL ELECTRIC COMPANY
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS
Publication number
20140138807
Publication date
May 22, 2014
GENERAL ELECTRIC COMPANY
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT AND A METHOD FOR FORMING A CHIP ARRANGEMENT
Publication number
20140110864
Publication date
Apr 24, 2014
INFINEON TECHNOLOGIES AG
Anton Prueckl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT AND A METHOD FOR FORMING A CHIP ARRANGEMENT
Publication number
20130256912
Publication date
Oct 3, 2013
INFINEON TECHNOLOGIES AG
Anton Prueckl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUF...
Publication number
20130249075
Publication date
Sep 26, 2013
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT
Publication number
20130237055
Publication date
Sep 12, 2013
IMEC
Takuo Funaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LED Package with Slanting Structure and Method of the Same
Publication number
20130181227
Publication date
Jul 18, 2013
KING DRAGON INTERNATIONAL INC.
Wen Kun YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...
Publication number
20130069219
Publication date
Mar 21, 2013
Shinko Electric Industries Co., Ltd.
Kenta UCHIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE
Publication number
20130062759
Publication date
Mar 14, 2013
Xintec Inc.
Wei-Ming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING ELECTRONIC DEVICE PACKAGE
Publication number
20130045571
Publication date
Feb 21, 2013
Xintec Inc.
Wei-Ming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS
Publication number
20130043571
Publication date
Feb 21, 2013
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS