the item being a discrete passive component

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H01L2224/24195

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/24195the item being a discrete passive component

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 12,148,708
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuits on soft substrates
- Patent number 11,996,380
- Issue date May 28, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package with interconnected modules
- Patent number 11,817,438
- Issue date Nov 14, 2023
- Intel Corporationd
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 11,735,518
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,728,252
- Issue date Aug 15, 2023
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 11,688,685
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrical connections on an encapsulat...
- Patent number 11,676,928
- Issue date Jun 13, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 11,676,907
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,670,548
- Issue date Jun 6, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked package-on-package structures
- Patent number 11,664,322
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer semiconductor package with stacked passive components
- Patent number 11,587,899
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless transmission module and manufacturing method
- Patent number 11,538,774
- Issue date Dec 27, 2022
- Huawei Technologies Co., Ltd.
- Qijing He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna substrate and antenna module including the same
- Patent number 11,503,713
- Issue date Nov 15, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and manufacturing method thereof
- Patent number 11,394,103
- Issue date Jul 19, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of formation
- Patent number 11,335,658
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless charging package with chip integrated in coil center
- Patent number 11,282,785
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component with sensitive component structures and method f...
- Patent number 11,245,977
- Issue date Feb 8, 2022
- Snaptrack, Inc.
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,244,939
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,217,562
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics package and method of manufacturing thereof
- Patent number 11,177,204
- Issue date Nov 16, 2021
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic system including the same
- Patent number 11,165,143
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer-based-semiconductor structure with cavity
- Patent number 11,133,236
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrical connections on an encapsulat...
- Patent number 11,114,404
- Issue date Sep 7, 2021
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera assembly and packaging method thereof, lens module, and elec...
- Patent number 11,069,670
- Issue date Jul 20, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH INTEGRATIVE PASSIVE COMPONENTS
- Publication number 20240203911
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20240178178
- Publication date May 30, 2024
- STMicroelectronics International N.V.
- Francesca DE VITI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20230317693
- Publication date Oct 5, 2023
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package with 3D Magnetic Core Inductor
- Publication number 20230298993
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
- Publication number 20230290750
- Publication date Sep 14, 2023
- Sumitomo Electric Industries, Ltd.
- Tatsuya HASHINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ANTENNA MODULE COMPRISING THE SAME
- Publication number 20230260919
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Yong Koon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
- Publication number 20230207509
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...
- Publication number 20230162992
- Publication date May 25, 2023
- TOHOKU UNIVERSITY
- Takafumi FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-SIDED INTERCONNECTED EMBEDDED CHIP PACKAGING STRUCTURE AND MANU...
- Publication number 20230154857
- Publication date May 18, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUITS ON SOFT SUBSTRATES
- Publication number 20220037278
- Publication date Feb 3, 2022
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
- Publication number 20220037280
- Publication date Feb 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...
- Publication number 20210366865
- Publication date Nov 25, 2021
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE
- Publication number 20210320095
- Publication date Oct 14, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ANTENNA MODULE COMPRISING THE SAME
- Publication number 20210313276
- Publication date Oct 7, 2021
- Samsung Electronics Co., Ltd.
- Yong Koon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20210305203
- Publication date Sep 30, 2021
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210305226
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package with 3D Magnetic Core Inductor
- Publication number 20210193572
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package with 3D Magnetic Core Inductor
- Publication number 20210167011
- Publication date Jun 3, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS TRANSMISSION MODULE AND MANUFACTURING METHOD
- Publication number 20210082842
- Publication date Mar 18, 2021
- Huawei Technologies Co., Ltd
- Qijing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA SUBSTRATE AND ANTENNA MODULE INCLUDING THE SAME
- Publication number 20210076501
- Publication date Mar 11, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Doo Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20210043511
- Publication date Feb 11, 2021
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Stacked Package-on-Package Structures
- Publication number 20210005556
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wireless Charging Package with Chip Integrated in Coil Center
- Publication number 20200343181
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200243427
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE WITH INTERCONNECTED MODULES
- Publication number 20200227393
- Publication date Jul 16, 2020
- Intel Corporation
- Hyoung Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200219824
- Publication date Jul 9, 2020
- Samsung Electronics Co., Ltd.
- Suk Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH ANTENNA ON PACKAGE
- Publication number 20200212536
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- VIKAS GUPTA
- H01 - BASIC ELECTRIC ELEMENTS

the item being a discrete passive component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and antenna module comprising the same

Semiconductor device and corresponding method of manufacture

Flexible circuits on soft substrates

Structure and method for fabricating a computing system with an int...

Semiconductor device with discrete blocks

System in package with interconnected modules

Dual-mode wireless charging device

Semiconductor device package

Integrated fan-out package with 3D magnetic core inductor

Electronic device including electrical connections on an encapsulat...

Semiconductor package and antenna module comprising the same

Structure and method for fabricating a computing system with an int...

Multi-stacked package-on-package structures

Ultra-thin embedded semiconductor device package and method of manu...

Multi-layer semiconductor package with stacked passive components

Wireless transmission module and manufacturing method

Antenna substrate and antenna module including the same

Antenna module and manufacturing method thereof

Multi-chip package and method of formation

Wireless charging package with chip integrated in coil center

Electric component with sensitive component structures and method f...

Package structure and method of forming the same

Stacked modules

Semiconductor device with discrete blocks

Power electronics package and method of manufacturing thereof

Method for producing a printed circuit board structure

Antenna module and electronic system including the same

Polymer-based-semiconductor structure with cavity

Electronic device including electrical connections on an encapsulat...

Camera assembly and packaging method thereof, lens module, and elec...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

Structure and Method for Fabricating a Computing System with an Int...

INTERPOSER WITH INTEGRATIVE PASSIVE COMPONENTS

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

Structure and Method for Fabricating a Computing System with an Int...

DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF

Integrated Fan-Out Package with 3D Magnetic Core Inductor

METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE

SEMICONDUCTOR PACKAGE AND ANTENNA MODULE COMPRISING THE SAME

MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...

TWO-SIDED INTERCONNECTED EMBEDDED CHIP PACKAGING STRUCTURE AND MANU...

FLEXIBLE CIRCUITS ON SOFT SUBSTRATES

MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS

ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...

CAMERA ASSEMBLY, LENS MODULE, AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND ANTENNA MODULE COMPRISING THE SAME

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Integrated Fan-Out Package with 3D Magnetic Core Inductor

Integrated Fan-Out Package with 3D Magnetic Core Inductor

WIRELESS TRANSMISSION MODULE AND MANUFACTURING METHOD

ANTENNA SUBSTRATE AND ANTENNA MODULE INCLUDING THE SAME

Structure and Method for Fabricating a Computing System with an Int...

Multi-Stacked Package-on-Package Structures

Wireless Charging Package with Chip Integrated in Coil Center

SEMICONDUCTOR DEVICE PACKAGE

SYSTEM IN PACKAGE WITH INTERCONNECTED MODULES

SEMICONDUCTOR PACKAGE

WIRELESS COMMUNICATION DEVICE WITH ANTENNA ON PACKAGE