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H01L2224/32245

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32245the item being metallic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chemically anchored mold compounds in semiconductor packages
- Patent number 12,180,595
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device including a semiconductor element having elect...
- Patent number 12,166,002
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a layer stack, semiconductor arrangemen...
- Patent number 12,159,854
- Issue date Dec 3, 2024
- Infineon Technologies Austria AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-coated heat spreader for integrated circuit device assemblies
- Patent number 12,154,839
- Issue date Nov 26, 2024
- Advanced Micro Devices, Inc.
- Xiaoyang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,148,680
- Issue date Nov 19, 2024
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,136,589
- Issue date Nov 5, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,136,596
- Issue date Nov 5, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus
- Patent number 12,132,014
- Issue date Oct 29, 2024
- Hitachi, Ltd.
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having lead frame with semiconductor die and...
- Patent number 12,125,771
- Issue date Oct 22, 2024
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tablet ultrasound system
- Patent number 12,115,023
- Issue date Oct 15, 2024
- Teratech Corporation
- Alice M. Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member for semiconductor device
- Patent number 12,119,322
- Issue date Oct 15, 2024
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...
- Publication number 20250006572
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
- Publication number 20250006583
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING SUCH SEM...
- Publication number 20250006597
- Publication date Jan 2, 2025
- NEXPERIA B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE
- Publication number 20250006600
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES
- Publication number 20250006603
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
- Publication number 20250006693
- Publication date Jan 2, 2025
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEADFRAME SPACER AND METHOD THEREFOR
- Publication number 20250006598
- Publication date Jan 2, 2025
- NXP B.V.
- Yao Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR
- Publication number 20240429137
- Publication date Dec 26, 2024
- NXP B.V.
- Hsin-En Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429139
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240429180
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240429119
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Shigeki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429138
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD
- Publication number 20240429056
- Publication date Dec 26, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Method for Assembling a Power Module
- Publication number 20240429121
- Publication date Dec 26, 2024
- ZF Friedrichshafen AG
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR, AND...
- Publication number 20240429124
- Publication date Dec 26, 2024
- ROBERT BOSCH GmbH
- Arne Stephen Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429133
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tsunehisa ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421046
- Publication date Dec 19, 2024
- Kabushiki Kaisha Toshiba
- Yoshiki ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421095
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240421050
- Publication date Dec 19, 2024
- Shinko Electric Industries Co., Ltd.
- Etsuo UEMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240421114
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Norikazu SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING THERMAL MANAGEMENT STRUCTURE
- Publication number 20240413047
- Publication date Dec 12, 2024
- CHUN-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION DEVICES
- Publication number 20240413053
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon Koh
- H01 - BASIC ELECTRIC ELEMENTS

the item being metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chemically anchored mold compounds in semiconductor packages

Semiconductor device

Leadframes in semiconductor devices

Systems and methods for single channel fault encoding for inverter...

Semiconductor device with enhanced thermal dissipation and method f...

Thermal conductive film

Semiconductor device

Floating die package

Dicing die attach film, and semiconductor package using the same an...

Systems and methods for phase switch timing controller for inverter...

Semiconductor device including a semiconductor element having elect...

Semiconductor device with lead between a plurality of encapsulated...

Semiconductor device having a layer stack, semiconductor arrangemen...

Graphene-coated heat spreader for integrated circuit device assemblies

Semiconductor device and method of manufacturing the same

Electronic package with interposer between integrated circuit dies

Semiconductor device

Microelectronic assemblies

Power semiconductor apparatus

Heat sink, semiconductor package and semiconductor module

Systems and methods for bidirectional message architecture for inve...

Extendable inner lead for leaded package

Semiconductor package having lead frame with semiconductor die and...

Semiconductor module with a first substrate, a second substrate and...

Tablet ultrasound system

Methods and apparatus for an improved integrated circuit package

Bonding member for semiconductor device

Multi-chip package and method of providing die-to-die interconnects...

Low pressure sintering powder

Plurality of transistors attached to a heat sink with a periphery n...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING SUCH SEM...

SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE

FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES

METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES

SEMICONDUCTOR DEVICE WITH LEADFRAME SPACER AND METHOD THEREFOR

DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Power Module and Method for Assembling a Power Module

ELECTRONIC MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR, AND...

SEMICONDUCTOR DEVICE

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

LEADFRAME AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR PACKAGE STRUCTURE HAVING THERMAL MANAGEMENT STRUCTURE

HEAT RADIATION DEVICES