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H01L2224/08245

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08245the item being metallic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonded body, circuit board, and semiconductor device
- Patent number 11,948,900
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leaded wafer chip scale packages
- Patent number 11,848,244
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sub-assembly and semiconductor power module
- Patent number 11,538,765
- Issue date Dec 27, 2022
- Hyundai Motor Company
- Hiyoshi Michiaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor assembly with dual middle mounting clips
- Patent number 11,075,148
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with double-sided cooling
- Patent number 10,879,155
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly for reusable surgical instruments
- Patent number 10,811,816
- Issue date Oct 20, 2020
- Covidien LP
- Christopher Penna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,109,611
- Issue date Oct 23, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,911,686
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,831,212
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making the same
- Patent number 9,735,138
- Issue date Aug 15, 2017
- Chih-liang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated circuit (IC) package comprising a plurality...
- Patent number 9,679,873
- Issue date Jun 13, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,368,436
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor formation using cold welding
- Patent number 9,087,905
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Cheng-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making an integrated circuit module with dual leadframes
- Patent number 9,029,194
- Issue date May 12, 2015
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor formation using cold welding
- Patent number 8,941,147
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Cheng-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and package process
- Patent number 8,916,957
- Issue date Dec 23, 2014
- Aptos Technology Inc.
- Chi-Jang Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS pressure sensor device and manufacturing method thereof
- Patent number 8,590,389
- Issue date Nov 26, 2013
- Metrodyne Microsystems Corporation, R.O.C.
- Chin-Fu Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated semiconductor chip with external contact pads and manu...
- Patent number 8,338,231
- Issue date Dec 25, 2012
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having TSV (through silicon via) and stacked ass...
- Patent number 7,838,967
- Issue date Nov 23, 2010
- Powertech Technology Inc.
- Ming-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240387352
- Publication date Nov 21, 2024
- LITE-ON SINGAPORE PTE. LTD.
- YOU-FA WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENTS
- Publication number 20240363497
- Publication date Oct 31, 2024
- INFINEON TECHNOLOGIES AG
- Andressa COLVERO SCHITTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20240355714
- Publication date Oct 24, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BIDIRECTIONAL FOUR QUADRANT SWITCHES WITH DRIVERS AND IN...
- Publication number 20240355717
- Publication date Oct 24, 2024
- Navitas Semiconductor Limited
- Alfred Hesener
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332171
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE
- Publication number 20240321761
- Publication date Sep 26, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Hao PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE SUBSTRATE BASED PACKAGE INTERCONNECT SYSTEMS
- Publication number 20240290705
- Publication date Aug 29, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. MOORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240266277
- Publication date Aug 8, 2024
- AOI ELECTRONICS CO., LTD.
- Katsuhiro TAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258208
- Publication date Aug 1, 2024
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING
- Publication number 20240249998
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20240222226
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240213223
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated process sequence for hybrid bonding applications
- Publication number 20240194635
- Publication date Jun 13, 2024
- Niranjan PINGLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194642
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Sungmock HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240014095
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Structure for Semiconductor Device and Method of Forming th...
- Publication number 20240014091
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDERABLE SIDEWALL
- Publication number 20230395465
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230317690
- Publication date Oct 5, 2023
- Murata Manufacturing Co., Ltd.
- Takashi IWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230317691
- Publication date Oct 5, 2023
- Murata Manufacturing Co., Ltd.
- Takashi IWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20230299186
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Kazuki MINAMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS
- Publication number 20230207515
- Publication date Jun 29, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING IN MICROELECTRONICS
- Publication number 20230197560
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED WAFER CHIP SCALE PACKAGES
- Publication number 20230095630
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Forming a Semiconductor Device
- Publication number 20230095162
- Publication date Mar 30, 2023
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230032035
- Publication date Feb 2, 2023
- Mitsubishi Electric Corporation
- Hideyuki HATTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20210398928
- Publication date Dec 23, 2021
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS
- Publication number 20210111106
- Publication date Apr 15, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH DOUBLE-SIDED COOLING
- Publication number 20200357729
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS

the item being metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded body, circuit board, and semiconductor device

Leaded wafer chip scale packages

Semiconductor sub-assembly and semiconductor power module

Stacked transistor assembly with dual middle mounting clips

Electronic device with double-sided cooling

Chip assembly for reusable surgical instruments

Package with vertical interconnect between carrier and clip

Semiconductor device

Source down semiconductor devices and methods of formation thereof

Semiconductor device

Integrated circuit package and method of making the same

Low profile integrated circuit (IC) package comprising a plurality...

Source down semiconductor devices and methods of formation thereof

Transistor formation using cold welding

Making an integrated circuit module with dual leadframes

Transistor formation using cold welding

Package structure and package process

MEMS pressure sensor device and manufacturing method thereof

Encapsulated semiconductor chip with external contact pads and manu...

Semiconductor chip having TSV (through silicon via) and stacked ass...

Patents Applicationslast 30 patents

CAPACITIVE COUPLING PACKAGE STRUCTURE

SEMICONDUCTOR MODULE ARRANGEMENTS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

INTEGRATED BIDIRECTIONAL FOUR QUADRANT SWITCHES WITH DRIVERS AND IN...

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE

METAL CORE SUBSTRATE BASED PACKAGE INTERCONNECT SYSTEMS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Integrated process sequence for hybrid bonding applications

SEMICONDUCTOR PACKAGE

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

SEMICONDUCTOR PACKAGE AND METHOD

Thermal Structure for Semiconductor Device and Method of Forming th...

SEMICONDUCTOR PACKAGE WITH SOLDERABLE SIDEWALL

ELECTRONIC DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS

THERMOELECTRIC COOLING IN MICROELECTRONICS

LEADED WAFER CHIP SCALE PACKAGES

Semiconductor Devices and Methods for Forming a Semiconductor Device

SEMICONDUCTOR MODULE

BONDED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS

ELECTRONIC DEVICE WITH DOUBLE-SIDED COOLING